7月17日上午，在第三届中国国际供应链促进博览会上的先进制造链主题活动现场，英伟达公司创始人 兼首席执行官黄仁勋与之江实验室主任、阿里云创始人王坚进行炉边谈话。 英伟达公司创始人兼首席执行官黄仁勋 黄仁勋谈到人工智能技术发展给人类社会、科学发现和生物学带来的影响，也谈及开源大模型的价值和 中国在人工智能技术上的成绩，并分享了对下一代芯片技术的看法，以及对年轻人如何适应人工智能时 代的建议。 人工智能下一步发展趋势 是向物理世界渗透 黄仁勋谈到，2012年的"AlexNet"（由 Alex Krizhevsky等人提出的深度卷积神经网络）堪称人工智能 的"大爆炸"时刻，深度学习的应用被证明极其有效。"从2012年开始的接下来五年左右，我们亲眼见证 了计算机视觉从有效到超越人类，语音识别从有效到超越人类，再到语言理解也从有效发展到超越人 类。"他表示， 人工智能技术从"感知型人工智能"升级为"生成式人工智能"，现在已经实现在不同模态 间的转换。 "汽车和飞机拓展了人类的移动能力，而人工智能将拓展人类的智能。"黄仁勋说，人工智能下一步发展 趋势是向物理世界渗透。 "我们现在正处于'推理型人工智能'的浪潮中，它的强大 ...

Core Viewpoint - The importance of photolithography in semiconductor manufacturing is being questioned, with industry leaders suggesting alternative technologies may reduce reliance on High-NA EUV lithography [1][8]. Group 1: High-NA EUV Lithography - High-NA EUV lithography machines are facing low demand, with many major chip manufacturers hesitant to fully adopt the technology due to high costs and alternative methods being developed [1][3]. - Intel has begun production using ASML's High-NA EUV machines, aiming to leverage this technology for its next-generation manufacturing processes, including Intel 18A (1.8nm) and Intel 14A (1.4nm) [4][6]. - TSMC has stated that it will not adopt High-NA EUV for its A16 (1.6nm) and A14 (1.4nm) processes, indicating that standard EUV machines will suffice until at least 2026 [5][6]. Group 2: Industry Trends and Shifts - Samsung and SK Hynix are delaying the implementation of High-NA EUV in DRAM production due to high costs and upcoming architectural changes in DRAM technology [6][7]. - The focus is shifting towards etching technology, which is becoming increasingly critical in semiconductor manufacturing, especially as advanced processes evolve below 3nm [7][9]. - The industry is exploring new transistor designs that may lessen the dependency on advanced lithography techniques, emphasizing the importance of etching processes instead [7][9]. Group 3: ASML's Market Position - ASML's EUV lithography technology dominates the market, controlling 75% to 80% of the EUV lithography market, contributing significantly to its revenue [10][13]. - In 2024, ASML reported a total of 418 lithography machine sales, including 44 EUV machines, with significant revenue contributions from the Chinese market [10][13]. - ASML is also developing the next generation Hyper NA EUV lithography system, which promises improved performance and efficiency [11][12]. Group 4: Emerging Technologies - New lithography technologies, such as EUV-FEL and atomic lithography, are being researched as potential alternatives to ASML's current EUV systems, which could disrupt the market [14][15][16]. - These emerging technologies aim to provide higher resolution and lower costs, posing a potential threat to ASML's market dominance [15][16].

如果您希望可以时常见面，欢迎标星收藏哦~ 目前量产的半导体标准最尖端工程3纳米市场由台积电率先实现收益率稳定化，独占主要顾客。据 市场调查企业Counterpoint Research透露，台积电的3纳米工程在批量生产后，时隔5个季度，最 近开工率首次达到了100%。Counterpoint Research预测："台积电的2纳米工程将在量产后时隔4 个季度达到完全开工率。" 来源：内容来自东亚日报 ，谢谢 。 三星电子2022年6月在世界上首次宣布批量生产3纳米工程，但在改善收率和吸引大型客户方面一 直面临困难。相关业界预测，将于今年7月在美国纽约公开的"Galaxy Z Fold·Flip 7"将首次搭载三 星电子3纳米工艺基础的"Exynos 2500"。 不过，三星电子在收益率相对稳定的工程中，正在确保顾客。彭博社当地时间19日报道称，三星 电子获得了将于下月上市的任天堂"Switch 2"的8纳米工艺基础主半导体供应合同。这是超越现有 开关的半导体供应商台积电取得的成果。彭博社报道说："这是三星与台积电竞争的重要胜利。" 据悉，台积电在美中矛盾全面爆发后在中国市场停滞不前，此后，三星电子开始扩大当地 ...

三星电子代工（半导体代工）事业部正与英伟达、高通等进行2纳米（nm，1nm为十亿分之一 米）制程的评估工作，以争取相关订单。据分析，随着首次采用"环绕栅极"（GAA）结构的3nm 制程良率趋于稳定，三星正在加快推动技术更为先进的2nm制程客户拓展。由于台积电已成功获 得苹果的应用处理器（AP）与英伟达AI加速器的订单，进一步拉开差距，三星则通过扩大客户 基础，加快追赶步伐。 GAA制程技术是通过四个方向的栅极将电流通道完全包裹，从而最大限度地减少漏电流并提升半 导体性能。相较之下，传统的鳍式场效应晶体管（FinFET）技术仅包裹三面。三星在3nm代工制 程中全球首次引入GAA技术，但由于早期良率不稳和性能提升受限，面临订单困境。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 chosun，谢谢。 另据分析，三星首次引入GAA的3nm制程良率已超过60%，为其2nm制程良率的进一步提升打下 基础。2nm制程在保留GAA结构的同时，对3nm技术进行了优化升级。最初，三星在3nm制程良 率提升中遭遇困难，导致使用该工艺的系统LSI事业部Exynos 2500项目搁浅。 三星高层相关人士表示："我们是 ...

Financial Data and Key Metrics Changes - Revenue totaled $167 million, above the midpoint of guidance, down 4% year-over-year and 8% sequentially [16] - Non-GAAP operating income was $24 million, and non-GAAP EPS was $0.37, exceeding the high end of guidance [4] - Gross margin was approximately 42%, in line with guidance, while operating expenses were approximately $46 million, below guidance [19] Business Line Data and Key Metrics Changes - The Semiconductor business grew 10% sequentially and 3% year-over-year, representing 74% of total revenue [16] - Advanced Packaging saw significant growth, with expectations to double revenue to about $150 million in 2025 [28] - Compound Semiconductor revenue declined to $14 million, accounting for 9% of total revenue [17] Market Data and Key Metrics Changes - Revenue from China customers was flat in Q1, increasing their share from 39% to 42% of total revenue [18] - Revenue from the Asia Pacific region (excluding China) increased from 31% to 36%, driven by sales to semiconductor customers in Taiwan [18] - The United States accounted for 15% of revenue, while EMEA represented 7% [18] Company Strategy and Development Direction - The company aims to capitalize on long-term semiconductor industry growth, focusing on laser annealing and ion beam deposition technologies [8] - Strategic wins include being awarded Intel's 2025 EPYC supplier award, validating the company's position in the semiconductor industry [5] - The company is expanding its served available market (SAM) in laser annealing and advanced packaging, driven by demand for AI and high-performance computing [12][11] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in long-term strategy despite uncertainties from recently enacted tariffs affecting customer shipments and costs [7][21] - The company anticipates growth in 2025, particularly in gate all around and advanced packaging, potentially doubling revenue in these areas [23][24] - Management noted that while there are headwinds in the mature node business in China, opportunities exist in GaN power and scientific research areas [24] Other Important Information - Cash and short-term investments at the end of the quarter were $353 million, with cash flow from operations totaling $20 million [20] - The company is monitoring tariff impacts closely and is working with customers to mitigate potential disruptions [21] Q&A Session Summary Question: Could you elaborate on the advanced packaging orders for lithography tools? - The company announced $35 million in lithography orders, driven by advanced packaging and AI applications, expecting significant year-over-year growth in 2025 [28][29] Question: What is the impact of tariffs on shipments to China? - Some customers are delaying shipments due to tariffs, with an anticipated $15 million impact on Q2 guidance [33][34] Question: What parts of the semiconductor business are expected to grow in 2025? - The company expects growth in advanced packaging and high bandwidth memory, potentially offsetting declines in other areas [36][65] Question: Are there any updates on GaN power applications? - The company is making progress with a customer for GaN power, with plans to start pilot production in 2026 [51] Question: What is the outlook for second-half revenue? - The company anticipates second-half revenue to be flattish, with strengths in advanced packaging and gate all around potentially offsetting challenges in China [56][57]

如果您希望可以时常见面，欢迎标星收藏哦~ 报道指出，台积电针对宝山与高雄厂2纳米订单分配也早有定案，宝山厂首批产能早已被苹果全数包 下，主攻苹果使用；高雄厂则用来支援非苹客户群。另外，也传出英特尔也将争取2纳米于今年内投 片，现在客户群排队已至2027年以后，等于2纳米尚未量产，就已获得超乎预期的市场需求。 从之前的报道可以看到，台积电2纳米（N2）采用第一代Nanosheet纳米片技术的环绕栅极晶体管 （ GAAFET ） 架 构 ； 相 较 N3E ， 在 相 同 功 耗 下 ， 速 度 增 加 10~15%； 而 在 相 同 速 度 下 ， 功 耗 降 低 25~30%，新品啊密度则相对增加15%以上 2纳米搭配NanoFlex技术，透过灵活的元件宽度调节，进行效能、功耗和面积的最大化（PPA）。短 单元可节省面积并提高能源效率，高单元则可提升效能，提高客户在设计组合上的灵活性，可提升 15%的速度，同时在面积与能源效率间取得最佳平衡。 2纳米将如期在2025年下半年进入量产。 在此之前，我们讨论了很多2nm，当中涵盖了各大厂商的技术布局，个人的时间进度，以及可 能潜在的市场颠覆力量。但现在，围绕着2n ...

之前摩根士丹利发布报告称，2025年台积电2nm月产能将从今年的1万片试产规模，增加至5万片左右的 量产规模。由于产能爬坡以及良率提升都需要时间，2025年苹果iPhone 17系列的A19系列处理器可能不 会采用2nm制程，只是会升级到3nm家族的N3P制程。 根据台积电披露的资料，2nm制程在相同电压下可以将功耗降低24%-35%，或将性能提高15%，晶体管 密度比上一代3nm工艺高1.15倍，这些指标的提升主要得益于台积电的新型全环绕栅极（GAA）纳米片 晶体管，以及N2 NanoFlex设计技术协同优化和其他一些增强功能来实现。 价格方面，消息称台积电2nm晶圆的价格超过了3万美元，目前3nm晶圆的价格大概在1.85万至2万美 元，两者价格差距明显。半导体业内人士预计，由于先进制程报价居高不下，厂商势必会将成本压力转 嫁给下游客户或终端消费者。 ***************END*************** 国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 3月21日消息，投资公司GF Securities在报告中称，iPhone 18 ...

Core Viewpoint - The article emphasizes the acceleration of the adoption of High-NA EUV lithography equipment in the semiconductor industry, highlighting its significance for advanced semiconductor manufacturing processes, particularly for 2nm technology [2][3]. Group 1: High-NA EUV Equipment Adoption - Samsung Electronics has introduced the first High-NA EUV lithography machine, EXE:5000, valued at approximately 24.88 billion RMB, to enhance its semiconductor manufacturing capabilities [2]. - The High-NA EUV equipment increases the numerical aperture from 0.33 to 0.55, significantly improving lithography precision and enabling narrower line widths, which reduces power consumption and enhances data processing speed [2]. - Intel has also accelerated its procurement of High-NA EUV equipment, having purchased a total of 6 units, with the first two already in production, capable of processing 30,000 wafers per quarter [3]. Group 2: Market Position and Performance - Despite being ranked second in the global foundry market in Q4 2023, Samsung's revenue decreased by 1.4% to 3.26 billion USD, resulting in a market share of only 8.1% [4]. - TSMC maintains a dominant position with a market share of 67%, highlighting the competitive landscape in the semiconductor foundry sector [4].

以下文章来源于半导体产业洞察 ，作者YUKI 半导体产业洞察 . 专注半导体领域原创内容 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 来自半导体芯闻综合 ，谢谢。 据悉，三星电子正与博通（Broadcom）合作开发被称为"光半导体"的硅光子（Silicon Photonics） 相关技术。硅光子技术通过将半导体间的数据通信方式从电信号转换为光信号，使数据处理速度提 升至10倍以上，因此被视为下一代晶圆代工（Foundry）制造的关键工艺技术。全球晶圆代工龙头 台积电（TSMC）计划在今年下半年将该技术应用于英伟达（NVIDIA）的人工智能（AI）加速器 生产。 据业内消息，三星电子正与博通合作，目标是在两年内实现硅光子技术的量产和商业化。尽管三星 电子也在与英伟达等企业商讨技术落地事宜，但与博通的合作进度最为领先。 一位半导体行业人士表示："台积电比三星电子更早开始硅光子技术的研发。博通在去年年初提出联 合开发的提案后，三星电子迅速作出应对。目前来看，三星电子与博通的合作进展最快。" 三星电子计划借助与博通的紧密合作，加快下一代晶圆代工工艺的开发。博通在无线通信和光通信 半导体领域具有强大实力，其无 ...