Core Viewpoint - The article highlights the upcoming "Electric Transportation & Digital Energy SiC Technology Application and Supply Chain Upgrade Conference" in Shanghai, emphasizing the participation of major companies in the SiC (Silicon Carbide) industry and the importance of SiC technology in enhancing performance and efficiency in various applications [2][3]. Group 1: Conference Details - The conference will take place on May 15, featuring Mitsubishi Electric's China Semiconductor Technical Director, Song Gaosheng, who will present on SiC power semiconductor solutions for electric transportation and digital energy applications [2]. - Mitsubishi Electric will showcase its SiC technology strategy and ecosystem, focusing on dual technology routes for performance enhancement in both low and high voltage applications [2][3]. - The event will include discussions on the core challenges and innovative breakthroughs in the industrialization of SiC technology, with dedicated sessions on digital energy and electric transportation applications [3]. Group 2: Industry Participation - Major industry players such as STMicroelectronics, Wolfspeed, and Sanan Semiconductor will participate, contributing to discussions on industry development and showcasing their latest products and technologies [3][5]. - The conference aims to facilitate collaboration and exploration of industrialization paths and ecosystem cooperation opportunities in the SiC technology sector [3]. - Sponsors like Hoshine New Materials and Jihua Hengyi will provide materials and information on their latest products and technologies during the event [3].

Core Viewpoint - The article highlights the upcoming "Electric Transportation & Digital Energy SiC Technology Application and Supply Chain Upgrade Conference" in Shanghai, focusing on the advancements and challenges in the silicon carbide (SiC) technology industry [1][2]. Group 1: Conference Details - The conference will take place on May 15 and will feature key industry players such as Mitsubishi Electric, STMicroelectronics, Wolfspeed, and others [1][2]. - The event will include two main themes: "Digital Energy SiC Technology Application Seminar" and "Electric Transportation SiC Technology Application Seminar" [2]. - A dedicated exhibition area for SiC and digital energy solutions will be set up at the conference [2]. Group 2: Participation and Presentations - Zhongdian Guojinan South has confirmed its participation, with its application manager presenting on the current status and research progress of SiC MOSFET technology [1]. - The conference aims to foster discussions on industry development and innovation breakthroughs among leading companies and institutions [2].

插播：英诺赛科、能华半导体、致能半导体、京东方华灿光电、镓奥科技等已确认参编《2024- 2025氮化镓（GaN）产业调研白皮书》，参编咨询请联系许若冰（hangjiashuo999）。 当前，碳化硅衬底价格下降压力较大，亟需降本。传统切割工艺普遍依赖传统多线切割技术，但该工艺效 率低、材料损耗，很难满足6-8英寸大尺寸碳化硅晶锭加工需求，尤其是在12英寸光波导碳化硅镜片制备 的难度较大。 针对激光剥离技术量产化难题，大族半导体以三大突破性技术破局： 低电阻 晶锭全兼容：突破 低电阻率晶 锭 激光加工 瓶颈，实现导电型衬底电阻率需求全覆盖； ● 砂轮损耗降40%+：采用LaserMesh™界面技术精准控制剥离面形貌（粗糙度≤2μm，TTV<10μm）， 结合界面软化工艺，大幅 降低后续减薄成本 ； ● 12英寸 量产突破：全球率先实现12英寸导电/半绝缘晶锭激光剥离量产，推动大尺寸衬底迈向"低成本、高良 率"时代，为光电子、射频器件降本奠基。 要想详细了解更多关于大族半导体的碳化硅衬底激光剥离技术等，欢迎参加 "行家说三代半"于5月15日在 上海 ● 锦江汤臣洲际大酒店 召开 "电动交通&数字能源SiC技术应 ...