Workflow
SiC功率半导体
icon
Search documents
港股异动 天岳先进(02631)午后涨超4% 公司与东芝电子元件达成合作 共同开发SiC功率半导体
Jin Rong Jie· 2025-08-22 06:05
Core Viewpoint - Tianyue Advanced (02631) has seen a stock price increase of over 4%, currently trading at 44.6 HKD with a transaction volume of 1.08 billion HKD, following a partnership agreement with Toshiba Electronic Components and Storage Devices Corporation for the development of SiC power semiconductor substrates [1]. Company Summary - Tianyue Advanced has reached a basic agreement with Toshiba for technical collaboration aimed at enhancing the characteristics and quality of SiC power semiconductors [1]. - The collaboration will focus on expanding the commercial supply of high-quality and stable substrates for SiC power semiconductors [1]. Industry Summary - Toshiba is accelerating the development of SiC devices for applications such as server power supplies and automotive uses, leveraging its experience in railway SiC power semiconductors [1]. - The partnership with Tianyue Advanced, a global leader in SiC substrate development and mass production technology, is expected to provide optimal solutions for various application scenarios and accelerate business expansion [1].
天岳先进午后涨超4% 公司与东芝电子元件达成合作 共同开发SiC功率半导体
Zhi Tong Cai Jing· 2025-08-22 05:40
Group 1 - Tianyue Advanced (02631) saw its stock rise over 4% in the afternoon, currently trading at 44.6 HKD with a transaction volume of 108 million HKD [1] - On August 22, Tianyue Advanced reached a basic agreement with Toshiba Electronic Components and Storage Devices Corporation to collaborate on the development and manufacturing of SiC power semiconductor substrates [1] - The collaboration will focus on technical cooperation to enhance the characteristics and quality of SiC power semiconductors, as well as commercial cooperation to expand the supply of high-quality stable substrates [1] Group 2 - Toshiba is accelerating the development of SiC devices for server power supplies and automotive applications, aiming to reduce power loss in SiC power semiconductors and develop high-reliability, high-efficiency products for efficient power conversion [1] - The partnership with Tianyue Advanced, a global leader in SiC substrate development and mass production technology, is expected to provide optimal solutions for various application scenarios and accelerate business expansion [1]
天岳先进(02631)与东芝电子元件达成合作协议 加速业务拓展
智通财经网· 2025-08-22 04:50
Group 1 - Tianyue Advanced has reached a basic agreement with Toshiba Electronic Components and Storage Devices Corporation to collaborate on the development and manufacturing of SiC power semiconductor substrates, focusing on technical cooperation for enhancing SiC power semiconductor characteristics and quality improvement [1][2] - The demand for power semiconductors, essential for energy efficiency and carbon neutrality in electrical devices, is expected to continue expanding, particularly for SiC substrates used in electric vehicles and renewable energy systems [3] - Toshiba is accelerating the development of SiC devices for server power supplies and automotive applications, aiming to reduce power loss and enhance reliability and efficiency in high-efficiency power conversion applications [3][4] Group 2 - Tianyue Advanced, founded in 2010, specializes in the development and production of single-crystal SiC substrates, holding a top-five position globally in related patents [4] - The company plans to launch the world's first 12-inch SiC substrate in 2024 and aims to achieve a full range of n-type, semi-insulating, and p-type 12-inch substrates by 2025 [4] - The collaboration with Toshiba is expected to enhance substrate quality and reliability, supporting the growth of the SiC power semiconductor market [4]
损失17亿美元、目标延后,这家MCU大厂发生了啥?
芯世相· 2025-07-08 06:21
Group 1 - Renesas has recently announced the abandonment of its SiC power semiconductor production and disbanded its SiC chip production team at the Takasaki factory, leading to an expected loss of approximately $1.7 billion (about 250 billion yen) in the first half of the year [2][3][14] - The company has postponed its strategic goals set in 2022, including becoming one of the top three embedded semiconductor solution providers by 2030, exceeding $20 billion in sales, and increasing its market value sixfold by 2022, now aiming for 2035 [4][14] - The bankruptcy restructuring of its SiC partner, Wolfspeed, has significantly impacted Renesas, as Wolfspeed is a key supplier of SiC substrates [5][6][8] Group 2 - Renesas experienced a surge in revenue during 2021-2022 due to the global chip shortage and acquisitions, with 2022 revenue reaching 1.5 trillion yen, a 51% year-on-year increase, but growth has since slowed [23][25] - The company announced a major layoff of about 5% of its workforce, approximately 1,000 employees, and postponed salary increases due to performance pressures [24][29] - Financial results for the first quarter of 2025 showed a 12.2% year-on-year decline in sales to 308.8 billion yen, with automotive revenue also down 12.8% [26][27][41] Group 3 - The automotive semiconductor market is facing a downturn, with a projected 1.2% revenue decline in 2024, attributed to inventory adjustments by suppliers and OEMs [38] - Renesas has adjusted its strategy to focus on its core strengths in embedded processing and computing technologies, while also planning to increase investments in hardware and related peripherals [29][30] - The company is expected to continue its presence in the SiC market through design and outsourcing manufacturing, despite halting its own production [21][44]
明日开幕!上海SiC会议参会攻略请查收
行家说三代半· 2025-05-14 06:11
Core Viewpoint - The conference will gather key players in the silicon carbide (SiC) industry, providing a platform for exploring development opportunities and technological advancements in the sector [1]. Conference Details - The conference is scheduled for May 15, from 09:00 to 17:30, at the Shanghai Jin Jiang InterContinental Hotel [2]. - Attendees are encouraged to arrive before 09:00 for timely registration [2]. Transportation Information - From Shanghai Pudong International Airport to the hotel is approximately 37 kilometers, taking about 45 minutes by taxi or 50 minutes via public transport [3]. - From Shanghai Hongqiao International Airport to the hotel is about 20 kilometers, with a taxi ride taking around 35 minutes or 50 minutes using public transport [3]. Conference Agenda - The conference will feature two thematic forums and an all-day exhibition, focusing on the SiC industry [5]. - The launch of the "2025 Silicon Carbide Substrate and Epitaxy Industry Research White Paper" and "2025 Silicon Carbide Devices and Modules Industry Research White Paper" will take place during the event [5]. - The afternoon session will include a seminar on SiC technology applications in electric transportation [5]. Exhibition Highlights - A dedicated exhibition area will showcase new products and technologies from various companies, enhancing networking and collaboration opportunities [7]. - Companies such as Mitsubishi Electric, Guojijinan, and others will present their latest innovations [8]. Sponsorship and Participation - Companies like Hesheng New Materials and Jihua Hengyi are sponsoring the event by providing promotional materials and product information [9].
三菱电机:面向电动交通和数字能源应用的SiC功率半导体解决方案
行家说三代半· 2025-05-13 10:00
Core Viewpoint - The article highlights the upcoming "Electric Transportation & Digital Energy SiC Technology Application and Supply Chain Upgrade Conference" in Shanghai, emphasizing the participation of major companies in the SiC (Silicon Carbide) industry and the importance of SiC technology in enhancing performance and efficiency in various applications [2][3]. Group 1: Conference Details - The conference will take place on May 15, featuring Mitsubishi Electric's China Semiconductor Technical Director, Song Gaosheng, who will present on SiC power semiconductor solutions for electric transportation and digital energy applications [2]. - Mitsubishi Electric will showcase its SiC technology strategy and ecosystem, focusing on dual technology routes for performance enhancement in both low and high voltage applications [2][3]. - The event will include discussions on the core challenges and innovative breakthroughs in the industrialization of SiC technology, with dedicated sessions on digital energy and electric transportation applications [3]. Group 2: Industry Participation - Major industry players such as STMicroelectronics, Wolfspeed, and Sanan Semiconductor will participate, contributing to discussions on industry development and showcasing their latest products and technologies [3][5]. - The conference aims to facilitate collaboration and exploration of industrialization paths and ecosystem cooperation opportunities in the SiC technology sector [3]. - Sponsors like Hoshine New Materials and Jihua Hengyi will provide materials and information on their latest products and technologies during the event [3].
功率芯片,还要熬一年
半导体行业观察· 2025-04-07 01:04
Core Viewpoint - The global power semiconductor market is projected to reach 7.771 trillion yen by 2035, which is 2.3 times the size in 2024, driven by the long-term growth from electric vehicle (EV) adoption despite short-term inventory issues in 2024 [1][2]. Market Size and Growth Projections - The power semiconductor market is expected to reach 3.5285 trillion yen in 2025, with silicon power semiconductors accounting for 3.147 trillion yen. The market is anticipated to expand starting in 2026 after inventory normalization [1]. - The next-generation power semiconductor market is projected to reach 513.8 billion yen by 2025, with significant growth expected for GaN power semiconductors due to their ability to replace silicon semiconductors [2]. - By 2035, the market for next-generation power semiconductors is expected to reach 3.1981 trillion yen, with SiC power semiconductors projected to reach 2.9034 trillion yen [2]. Specific Semiconductor Types - SiC power semiconductors are expected to see an adoption rate exceeding 50% in electric vehicles by 2035, up from just over 10% in 2024 [2]. - The GaN power semiconductor market is projected to grow to 278.7 billion yen by 2035, with significant applications in AC-DC adapters and server power supplies [3]. - The market for GaN power semiconductors is expected to reach 58 billion yen by 2025, driven by production scale effects and price reductions [3]. Wafer and Component Market Trends - The power semiconductor wafer market is expected to reach 300.9 billion yen by 2025 and 911.8 billion yen by 2035, with SiC wafers projected to surpass silicon wafers in 2024 due to increased production from Chinese companies [5]. - The overall market for power semiconductor components is expected to reach 1.7408 trillion yen in 2023 and 615.2 billion yen by 2025 [5]. Manufacturing Equipment Market - The power semiconductor manufacturing equipment market is projected to reach 1.3234 trillion yen by 2035, with a forecasted size of 739.3 billion yen in 2025. A decline in automotive-related capital investment is expected to impact the market in 2025 [7].