纳米级检测

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这项技术,彻底改变3D芯片制造
半导体行业观察· 2025-04-13 03:45
Core Viewpoint - Researchers at the University of Massachusetts Amherst have developed a new method for aligning 3D semiconductor chips using laser-illuminated concentric superlenses to generate holograms, which could significantly reduce the manufacturing costs of 2D chips and support the development of 3D photonic and electronic chips, opening doors for affordable compact sensor technologies [1][6]. Group 1: Traditional Alignment Limitations - Traditional methods for aligning two layers of chips involve using a microscope to find markers, which is ineffective for 3D chip manufacturing due to the inability to clearly see two markers at once and the large gaps between layers [2][4]. - The minimum feature discernible by existing methods is limited by diffraction to approximately 200 nanometers, making it unsuitable for the precision required in 3D chip alignment [4]. Group 2: Breakthrough in Nano-level Detection - The new alignment method developed by the research team does not require moving parts and can measure misalignment between layers with unprecedented precision, achieving errors of only 0.017 nanometers in lateral measurements (x and y axes) and 0.134 nanometers in vertical distance (z axis) [6]. - The method utilizes concentric superlens-embedded alignment markers on semiconductor chips, allowing for the projection of interference holograms that indicate the alignment status and degree of misalignment between chips [6]. Group 3: Implications for the Semiconductor Industry - The new alignment technique addresses a significant and costly challenge in semiconductor manufacturing, potentially lowering costs and increasing access to this technology for small startups seeking semiconductor innovations [7]. - This method can also be applied to create displacement sensors for measuring various physical quantities, suggesting broad applications in detecting motion-related phenomena such as vibrations, heat, and acceleration [7].