Group 1 - Samsung aims to develop its own 1nm process technology, with a target for mass production set for 2029, although it currently lacks the necessary high NA EUV exposure equipment [1][2] - TSMC has begun accepting orders for 2nm wafers and is also developing a 1.4nm node, indicating competitive advancements in the semiconductor industry [1][2] - Samsung's yield rate for its 2nm GAA technology has reached 30%, an improvement over its 3nm GAA process, but still has significant room for enhancement [1] Group 2 - Samsung is reallocating personnel from its foundry division to its high bandwidth memory (HBM) business due to dissatisfaction within the organization and a decline in HBM demand [4][6] - The company has lost its leading position in the DRAM market to SK Hynix, which now holds a 36% market share compared to Samsung's 34% [5] - Samsung plans to focus on the HBM4 project, which will utilize foundry processes to enhance logic chip performance and allow for customized HBM production [5] Group 3 - Concerns about talent loss in the foundry department are rising as employees are transferred to the memory division, potentially leading to internal conflicts [6] - The morale of remaining employees in the foundry division is declining due to ongoing personnel shifts and accumulated losses [6] - Leadership within Samsung is under pressure to maintain employee retention and prevent conflicts between departments during this transition [6]