如果您希望可以时常见面，欢迎标星收藏哦~ 来源 ：内容 编译自 chosun 。 在全球存储芯片行业最新战场——10纳米级第六代DRAM领域（1c、11-12纳米级）争夺战中，三 星电子与SK海力士采取了截然不同的策略。 EUV 的波长为 13.5 纳米，是传统半导体曝光工艺材料 ArF（氟化氩）的十三分之一，使其成为 实现超精细工艺的理想光源。然而，由于技术难度高、设备成本高，目前 EUV 仅适用于需要超精 细电路的特定层。对于其余层，则使用现有的传统工艺，例如深紫外 (DUV)。 为了从上一代产品的挫折中恢复过来，三星迅速采取行动，投资新的生产设施，而 SK 海力士则推 迟大规模支出，直到在与包括 Nvidia 在内的主要客户谈判中确认明年的供应承诺，确保盈利能 力。 预计三星将比SK海力士提前三到四个月开始量产1c DRAM。分析师表示，如果三星成功向英伟达 供应采用新工艺生产的DRAM的第四代高带宽内存（HBM4），它有望重夺约30年来首次失去的 市场领先地位。 每一代 DRAM 都采用更先进的制程技术，通过缩小电路线宽来减小芯片尺寸并提高密度，从而提 升性能和能效。三星、SK 海力士和美国美光科技公 ...

来源 ：内容 综合 businesskorea 。 SK 海 力 士 高 带 宽 存 储 器 （ HBM ） 业 务 负 责 人 预 测 ， 到 2030 年 ， HBM 市 场 年 均 增 长 率 将 达 到 30%。这一预测消除了部分人士的担忧，即由于供过于求，HBM市场增长率可能会放缓。 SK 海 力 士 副 总 裁 兼 HBM 业 务 规 划 负 责 人 崔 俊 勇 于 8 月 10 日 （ 当 地 时 间 ） 接 受 路 透 社 采 访 时 表 示，"最终用户对人工智能的需求非常坚定且强劲"，预计到2030年，包括HBM在内的人工智能 （AI）专用存储芯片市场将以每年30%的速度增长。 Choi 指出，引领 AI 创新的大型科技公司持续大规模的 AI 投资是市场持续增长的基础。他表 示："这将对 HBM 市场产生积极影响。" 他补充道："这些公司对 AI 基础设施的投资与 HBM 需 求之间存在直接关联。" 这些言论似乎直接驳斥了近期HBM市场增速可能放缓的观点。三星电子上个月在第二季度财报电 话会议上提到："对于HBM3E产品，由于供应增长超过需求增长，预计供需将发生变化，这将暂时 影响市场价格。 ...

我是芯片超人花姐，入行20年，有50W+芯片行业粉丝。 有很多不方便公开发公众号的， 关于芯片买卖、关于资 源链接等， 我会分享在朋友圈 。 扫码加我本人微信 一周 大 事件 1. 特朗普称美将对芯片和半导体征收约100%的关税 2. WSTS：2025年上半年全球半导体市场规模同比增长18.9% 达3460亿美元 3. 中芯国际赵海军：产能供不应求状态至少持续至今年10月 4. 传 三星修改DDR4停产计划：将继续生产至2026年12月 5. 消息称SK海力士已大幅上调HBM4定价 行业风向前瞻 七部门：突破关键脑机芯片 工业和信息化部、国家发展改革委、教育部、国家卫生健康委、国务院国资委、中国科学院、国家 药监局近日发布关于推动脑机接口产业创新发展的实施意见。其中提出，突破关键脑机芯片。发展 高通道、高速率脑信号采集芯片，强化模数转换、通道管理和噪声抑制，增强脑信号采集放大能 力。研发高性能、超低功耗脑信号处理芯片，强化并行处理能力，推动感知、计算和调节等功能的 一体化集成。研发超低功耗、高速率、高可靠的通信芯片，提升脑信号传输和抗干扰能力。 （ 财 联社 ） 上海：加快具身智能专用芯片、核心主板等核心零 ...

Accessible version Global Memory Tech Weekly theme: strong July exports, HBM4 order in progress, 3Q guidance check Industry Overview Positive implications of July export increase Korea's semiconductor export growth rate strongly recovered in July (+32% YoY vs +11% on average during Jan-Jun). The absolute amount (US$15bn) was also close to record- high (2024-1H25 month average: US$12bn). Key contributors should be not only 12-hi HBM3e (Hynix's massive shipment, Samsung's ramp-up) but also commodity memory (c ...

华金证券表示，目前HBM采用的凸点键合方式限制了颗粒间的垂直间距，使其难以缩短到40μm以下， 这阻碍了HBM的内存容量和带宽的提升。 因此10μm节距以下将会采用混合键合技术。混合键合技术互连密度更高，节距更小，能效更低，可以 提高芯片间通信速度，节距可以达到10μm及以下，是未来应用于下一代HBM产品键合的理想解决方 案。 据DIGITIMES 8月5日消息，SK海力士在今年向英伟达供应其HBM4 12-Hi堆叠，价格较第五代HBM （HBM3E）高出约70%。 点评：在2025年7月24日的二季度业绩说明会上，SK海力士表示，HBM4有重大技术变革，包括为提高 带宽而增加的IO计数、改进功效的新设计以及在基线中采用逻辑处理。公司正努力将成本的增加反映 在HBM4的定价策略中，同时通过与客户建立最优定价来刺激AI市场来保持当前的盈利水平。 雅克科技：公司前驱体供货台积电、SK海力士、中芯国际等。 太极实业：公司为SK海力士及其关联公司提供半导体后工序服务。 *免责声明：文章内容仅供参考，不构成投资建议 *风险提示：股市有风险，入市需谨慎 此外据韩国科学技术院（KAIST）于2025年6月发布的HBM技术路 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源 ：内容 编译自zdnet 。 三星电子在其核心业务领域（包括半导体）一直举步维艰，如今终于开始复苏。 在董事长李在镕 摆脱 近十年的法律危机后，曾经是DS（半导体）部门痛点的代工业务，如今已与特斯拉签署了一 份价值22万亿韩元的合同。此外，随着Galaxy Z Flip 7搭载Exynos 2500处理器，系统LSI部门近 期的低迷局面也得以扭转。 该公司剩下的最后任务是在AI时代经历显著增长的HBM（高带宽存储器）市场取得预期成果。 李在镕会长最近一直在扩大其全球管理影响力。 例如，他上个月29日飞往华盛顿特区，为韩美关 税谈判提供支持，之后又 与特斯拉CEO埃隆·马斯克进行视频通话，讨论未来具体的合作计划。他 一直在积极开展前所未有的活动。 李健熙会长的举动备受业界期待。此前，由于围绕李健熙的法律风险，三星的经营活动（包括大规 模战略投资）一直受到限制。考虑到韩国本土企业强调积极投资在此次谈判中发挥了重要作用，李 健熙此举间接影响了关税谈判。 韩国商工会议所研究部部长姜锡九表示，"在全球高科技产业竞争激烈的形势下，我们预计此举不 仅能缓解公司的经营风险，还将 ...

[Table_Title] Research Report 31 Jul 2025 电子 Technology 全球科技业绩快报: Samsung Electronics 2Q25 Global Tech Snapshots: Samsung Electronics 2Q25 姚书桥 Barney Yao 纪雨岑 Grace Chi barney.sq.yao@htisec.com grace.yt.chi@htisec.com [Table_yemei1] Flash Analysis [Table_summary] (Please see APPENDIX 1 for English summary) 利润率与成本控制 公司整体利润率：2025 年第二季度，公司层面的营业利润率收缩 2.2 个百分点至 6.3%。 移动部门利润率：尽管部分组件价格下降，移动（MX）部门在 2025 年第二季度仍保持了两位数的盈利能力。 HBM 利润率：预计 2025 年下半年，HBM3E 与传统 DRAM 之间的利润率差异将显著缩小。 NAND 利润率改善措施：公司正在提高服务器 SSD 的销售份额以改善利润率。 AI 战 ...

Summary of Key Points from Conference Call Records Industry Overview - **Company**: SK Hynix - **Core Point**: SK Hynix has increased its capital expenditure (capex) guidance for HBM4, driven by NVIDIA's commitment to use significant volumes of Hynix's HBM4 in 2026-27. The forecast for Hynix's HBM wafer capacity has been revised upwards from 190k/210k to 213k/235k, representing a 12% increase. This capacity is expected to account for low-40% of the global total, compared to Samsung's mid-30% share. Hynix's HBM revenue is projected to remain over 60% of the global total due to price premiums and full utilization, particularly favored by US Big Tech [1][1][1]. - **Additional Insights**: Hynix is set to install new equipment in Korea's M15X fab starting from 4Q25, followed by Yongin in 2Q27. R&D for 1,024GB HBM4e (16-hi) has already commenced, likely for use in the Rubin Ultra GPU, which is a significant upgrade from the initial 288GB version [1][1][1]. Hanmi Semiconductor - **Core Point**: Hanmi Semiconductor reported strong preliminary sales for 2Q, amounting to W180 billion, reflecting a 22% quarter-over-quarter and 46% year-over-year increase. The growth is attributed to rising TCB equipment sales to memory chipmakers, including Hynix and Micron. Expectations for new TCB equipment shipments for HBM4 are anticipated to strengthen in late 3Q or 4Q [2][2][2]. - **Earnings Outlook**: Despite bullish earnings estimates, revisions for 2025-26 EPS are minimal, under 1%, based on slightly higher sales assumptions. The Buy rating for Hanmi is supported by strong growth, high margins, and a low P/E ratio compared to peers [2][2][2]. Memory Market Dynamics - **DDR4 Pricing Trends**: The spot price for 8Gb DDR4 has declined by 1%, marking the first correction since March, following a significant rally of over 200%. Despite this, contract prices for DDR4 are expected to rise by more than 10% in 3Q and 4Q, indicating ongoing concerns about supply shortages [3][3][3]. - **Market Forecasts**: Global memory forecasts have been adjusted upward due to Hynix's strong 2Q shipments, with only a 1% increase for 2025E DRAM and NAND sales. HBM forecasts for 2025/26 remain largely unchanged, but Hynix's capex increase for HBM4 presents potential for upward revisions [4][4][4]. HBM Market Outlook - **Sales Projections**: The global HBM market is projected to reach US$35.4 billion in 2025 and US$50.4 billion in 2026, with a compound annual growth rate (CAGR) of 49% from 2024 to 2027. The growth is driven by a limited price cut and robust bit growth, with Hynix's 12-hi HBM3e and HBM4 expected to be key contributors [48][48][48]. - **Market Share**: SK Hynix is expected to maintain a dominant position in the HBM market, with a projected market share of over 60% in 2026-27, while Samsung's share is anticipated to be around 20% [50][50][50]. - **Earnings Outlook**: Hynix's HBM earnings are forecasted to grow significantly, with sales expected to reach US$21.1 billion in 2025 and US$30.1 billion in 2026, reflecting a 54% CAGR from 2024 to 2027 [51][51][51]. Conclusion - The conference call highlights significant developments in the memory semiconductor industry, particularly focusing on SK Hynix's strategic investments and market positioning. The anticipated growth in HBM sales and the strong performance of Hanmi Semiconductor indicate a positive outlook for the sector, despite some pricing corrections in legacy DRAM products.

Core Viewpoint - Samsung Electronics faces increasing pressure to revitalize its competitiveness in the memory chip market, particularly in high bandwidth memory (HBM), which is crucial for advanced AI computing. Establishing a supply agreement with major buyer Nvidia is essential for Samsung [1][2]. Group 1: HBM Market Dynamics - SK Hynix has dominated the HBM market since 2022, supplying Nvidia exclusively with HBM3, while Samsung has not yet passed Nvidia's stringent certification tests. Analysts predict that by 2025, SK Hynix will hold a 57% market share, followed by Samsung at 24% and Micron at 19% [1]. - Samsung's relative weakness in HBM is a key factor in its declining position in the broader DRAM market, where it lost its leadership to SK Hynix for the first time, with market shares of 34% and 36% respectively [2]. - Samsung is focusing on improving its HBM products and aims to pass Nvidia's certification for HBM3E chips, which could open doors for future orders [2]. Group 2: Semiconductor Business Performance - Samsung's foundry division has secured a significant order from Tesla for next-generation AI chips, which may help offset substantial losses in its memory division [3][4]. - The foundry's 2nm process is reportedly achieving expected yields and production stability, with plans for mass production by the end of the year [4]. - The contract with Tesla is seen as a critical achievement, potentially leading to more orders from other major tech companies and improving Samsung's competitive position against TSMC [5]. Group 3: Future Strategies and Expectations - Samsung plans to implement a dual-track strategy to enhance its existing mature process business while accelerating its pursuit of TSMC [6]. - The foundry's strong performance is expected to positively impact Samsung's overall semiconductor results and help restore its memory competitiveness [6]. - Samsung is working on the next generation of HBM (HBM4) and has submitted its sixth-generation DRAM (D1c) for validation, with production expected to ramp up soon [7].

Core Viewpoint - Samsung Electronics has delayed the mass production of its next-generation High Bandwidth Memory (HBM) chips to 2026, indicating a more cautious approach in the ongoing redesign of DRAM technology [3][5]. Group 1: Samsung Electronics - Samsung initially planned to start mass production of the 12-inch HBM4 modules based on 10nm-class sixth-generation 1c DRAM in the second half of 2025, but now aims to deliver early samples to major customers in Q3 2025 and full-scale production in Q4 2025 [3][5]. - The company is focusing on improving the performance and yield of its redesigned 1c DRAM chips, with internal tests showing a yield of approximately 65% as of early July [3][5]. - Samsung is pursuing two strategies to enhance 1c DRAM: modifying previous 1a and 1b designs and completely redesigning to create a new generation of chips, which could increase chip size and yield but also raise costs [5]. Group 2: SK Hynix - SK Hynix reported record quarterly earnings, with operating profit increasing by 68% year-on-year to 9.21 trillion KRW (approximately 6.7 billion USD) and sales rising by 35% to 22.23 trillion KRW (approximately 16.1 billion USD) [7]. - HBM and AI-related memory products accounted for 77% of SK Hynix's total revenue, contributing to the strongest performance in its memory division to date [7]. - The company plans to double its HBM sales by 2025, driven by strong demand for its HBM3E chips, and is preparing for the commercial launch of HBM4 in 2026 after distributing early samples [8][9].