Core Viewpoint - The article discusses the potential advantages of Apple's M5 Pro and M5 Max utilizing TSMC's new "Small Outline Integrated Circuit" (SoIC) packaging technology, which could enhance performance and reduce manufacturing costs for Apple's portable Mac computers. It raises questions about why Qualcomm has not yet adopted this technology, suggesting that Qualcomm will eventually transition to chiplet design [2]. Group 1 - The M5 Pro and M5 Max are expected to be among the first Apple SoCs to use independent CPU and GPU modules, offering various advantages such as improved yield and lower manufacturing costs [2]. - Qualcomm's Snapdragon X2 Elite Extreme and X2 Elite have not adopted chiplet architecture, which may be due to the complexity and extensive R&D required for such a transition [3]. - Qualcomm's current focus on efficiency and thermal management may lead it to avoid chiplet designs, as they require additional power and could complicate cooling solutions for laptops [4]. Group 2 - Apple's M5 Pro and M5 Max have successfully addressed thermal issues associated with chiplet designs, achieving record battery life in portable Mac computers [5]. - Recent benchmark tests indicate that Qualcomm's Snapdragon X2 Elite processor has performance bottlenecks, particularly in gaming, highlighting the need for Qualcomm to consider chiplet designs to remain competitive [6].