Core Viewpoint - TSMC is set to officially launch its 2nm process technology, with aggressive capacity planning indicating strong customer demand for advanced chips [1][2]. Group 1: Capacity Planning - TSMC's 2nm family (N2/N2P/A16) is projected to have a monthly capacity of approximately 5-6 million wafers at the Hsinchu Baoshan plant by Q4 2025, and the Kaohsiung plant aims to reach 145,000-150,000 wafers per month by the end of 2028, totaling around 200,000 wafers per month [1]. - The ramp-up of 2nm capacity is expected to exceed 100,000 wafers per month by the end of 2026, with a total capacity of about 200,000 wafers by 2028, potentially increasing further with future U.S. facilities [1][2]. Group 2: Technology and Performance - TSMC will utilize a Gate-All-Around (GAA) architecture for its 2nm chips, with the A16 architecture expected to enhance speed by 8-10% at the same voltage and reduce power consumption by 15-20%, while increasing chip density by 1.10 times [2]. - The initial monthly capacity for new processes has typically been around 50,000 wafers, but the 2nm process is set to directly target a capacity of approximately 200,000 wafers, reflecting careful strategic planning [2]. Group 3: Customer Demand - Major customers for TSMC's 2nm technology include AMD, which plans to use it in its EPYC processors, and Apple, which is expected to implement it in its A20 chip using advanced packaging technology [3]. - The new WMCM (Wafer-Level Multi-Chip Module) packaging technology is anticipated to enhance thermal performance for Apple's upcoming chips, representing an upgrade from existing packaging methods [3].