金刚石+化合物半导体

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倒计时2天!中科院宁波材料所、国创中心、甬江实验室、北大、港大、西交大、哈工大等演讲 聚焦 “金刚石+” 5月22-24日苏州见
材料汇· 2025-05-20 15:10
Core Viewpoint - The "2025 Future Semiconductor Industry Innovation Conference" will focus on the integration of diamond and compound semiconductors, addressing key industry challenges and exploring innovative solutions for semiconductor materials and applications [1][3][13]. Group 1: Conference Overview - The conference will be held from May 22 to 24, 2025, at the Hilton Garden Inn in Suzhou, Jiangsu [4][5]. - It aims to create a collaborative platform for academia and industry to promote the integration of diamond technology with other semiconductor technologies [13][22]. Group 2: Key Topics and Discussions - The conference will cover critical topics such as high-power device heat dissipation, substrate preparation, heterogeneous integration, and polishing technology [3][13]. - Discussions will include advancements in diamond semiconductor materials, GaN power devices, and the application of diamond in AI computing chip packaging [18][20]. Group 3: Registration and Participation - Registration fees are set at 2800 yuan per participant and 1500 yuan for students, with discounts available for group registrations [27]. - Participants will receive conference materials, meals, and access to all sessions during the event [27].
限时优惠· 最后2天丨2025未来半导体产业创新大会,5月22-24日,苏州见!
材料汇· 2025-05-07 14:51
Core Viewpoint - The article discusses the upcoming 2025 Future Semiconductor Innovation Conference, focusing on the integration of diamond and other semiconductor technologies to address challenges in the semiconductor industry, particularly in the context of AI, quantum computing, and new energy revolutions [5][6]. Group 1: Conference Overview - The conference will be held from May 22-24, 2025, at the Hilton Garden Inn in Suzhou, Jiangsu [8]. - The theme of the conference is "Cross-border Exploration of Key Technologies and Innovative Applications in Diamond + Compound Semiconductor Industry" [8]. - The event aims to build a collaborative platform for industry, academia, and research to promote the deep integration of diamond with other semiconductor technologies [6][8]. Group 2: Industry Challenges and Opportunities - The diamond semiconductor industry faces multiple challenges, including immature large-diameter wafer preparation technology and high batch production costs [6]. - Diamond's strategic value lies not only in its material advantages but also in its potential for collaborative innovation with third-generation semiconductors like silicon carbide and gallium nitride [6]. - The demand for miniaturized, low-power chips necessitates the commercialization of diamond technology, requiring a closed-loop system from material research to terminal validation [6]. Group 3: Conference Activities and Highlights - The conference will feature discussions on the ecological layout of diamond and compound semiconductors, innovative applications, and the future of the industry [9][10]. - Activities include expert consultations, project selection for innovative technology solutions, and showcasing cutting-edge research and commercial paths [9][10]. - A detailed schedule includes various presentations on advancements in diamond semiconductor technology and its applications in high-power devices and thermal management solutions [10][11][12]. Group 4: Registration and Participation - Registration fees are set at 2800 RMB per participant and 1500 RMB for students, with discounts available for group registrations [20]. - The conference will also provide opportunities for sponsorship and exhibition, allowing companies to showcase their innovations [20].