Core Viewpoint - The chairman of Tuojing Technology, Lv Guangquan, emphasizes that the innovation path of integrated circuits needs to shift from planar to three-dimensional to overcome storage wall and I/O bandwidth limitations [1] Group 1: Innovation Path - Integrated circuit innovation should transition from planar to three-dimensional structures to address existing limitations [1] - Key technologies include atomic-level manufacturing (ALD/ALE), device density enhancement, bonding technology, and advanced packaging [1] Group 2: Technical Advancements - Three-dimensional integration can increase I/O bandwidth by over a thousand times [1] - Important directions for development include HBM structures and backside power supply technology [1]