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Core Viewpoint - The emergence of Tuojing Technology marks a significant step towards domestic production in the high-end semiconductor manufacturing sector, particularly in the film deposition equipment market, which has been dominated by international giants [2]. Group 1: Market Overview - The film deposition equipment sector accounts for over 20% of the wafer manufacturing equipment market, with Tuojing Technology capturing approximately 12% of the market share, translating to a revenue of 4.1 billion yuan in a market projected to reach 9.7 billion USD in 2024 [2]. - Tuojing Technology focuses on PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. Group 2: Technological Advancements - Chinese companies, represented by Tuojing Technology, are rapidly catching up in terms of process coverage and production equipment performance, achieving levels comparable to international counterparts [3]. - Tuojing Technology has undertaken 11 national major projects and has filed 1,640 patents, with 507 granted, showcasing its commitment to innovation and technology breakthroughs in the semiconductor film deposition field [3]. Group 3: Future Prospects - The company is preparing for future product generations, with 70% of its products being new or advanced process technologies, indicating a strong focus on innovation [4]. - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3].

Core Viewpoint - The emergence of Tuojing Technology represents a significant step towards domestic production in the monopolized thin film deposition equipment market, which is crucial for high-end semiconductor manufacturing [2][3]. Market Overview - The thin film deposition equipment accounts for over 20% of the wafer manufacturing equipment market, with the Chinese market for this equipment projected to reach approximately $9.7 billion in 2024 [2]. - Tuojing Technology's product market size is estimated at $4.85 billion, with the company generating revenue of 4.1 billion yuan, capturing about 12% market share [2]. Technological Advancements - Tuojing Technology focuses on the research and industrial application of PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. - The company has made significant technological breakthroughs, evidenced by its 1,640 patent applications (including PCT) and 507 authorized patents [3]. Future Prospects - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's future growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3]. - The company is proactively developing technologies for the next two to three generations of products, with 70% of its products being required for new and advanced processes [4].

势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 添加文末微信，加 先进封装 群 "宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 三维集成电路（3D IC）已为后摩路径中的产品设计提供了极大的灵活、便利与复用性，越来越多 的AI算力与高端数模混合集成正在运用堆叠芯片架构来获得下一代产品。堆叠芯片与先进封装技术 对产品的性能、功能、成本、迭代方式均至关重要。 然而，三维堆叠芯片（2.5D/3D/3.5D）包含多个堆叠芯片（Stacked Die），这些Die通过中介层 上特殊过孔（via）或互连凸块（bump）来实现所需的连接。然而，根据工艺规则独立验证这些独 立Die和基板的物理集成与之互连精度，并不能确保整个2.5D/3D封装系统得到最终的正确，设计 者们需要针对多种堆叠方式进行自动化的验证，包括版图原理图一致性与设计规则。 3Sheng Stratify™（EDA）工具为堆叠芯片设计中的Die与Die之间、Die与中介层互连接口提供快 速、准确的组装级验证。 对于来自多个工艺节点的Die设计的互连进行操作，从物理规则与设计版 图层 ...

证券研究报告 收入高增，聚焦新工艺新设备研发 | 华泰研究 | | | 季报点评 | | --- | --- | --- | --- | | 2025 年 | 5 月 | 02 日│中国内地 | 半导体 | 拓荆科技 1Q25 实现营收 7.09 亿元（yoy+50.22%、qoq-61.18%），归母净 利-1 亿元，同环比转亏。受益于新产品/新工艺在客户端实现批量验证，工 艺覆盖面不断扩大，产品性能及核心竞争力进一步增强，量产规模快速增长。 但因 24 年部分在研设备发到客户端验证，成本较高，25Q1 公司毛利率为 19.89%，环比下滑 19.42pct，同时公司持续加大新产品投入，一季度公司 归母净利润亏损。公司已实现全系列 PECVD 介质薄膜材料的覆盖， ALD 工艺覆盖率本土第一，先进键合设备（包括混合键合、熔融键合设备）及配 套使用的量检测设备处于加速增长阶段，我们预计后期公司新签订单及营收 延续高增势头，毛利率及净利率有望回升，维持买入。 回顾：营业收入高增，新产品收入成为主要拉力，毛利率阶段性承压 拓荆科技 (688072 CH) 1Q25 实现营业收入 7.09 亿元，同比大幅增长 50 ...

电子/半导体 拓荆科技（688072.SH） 业绩持续高增，新机台&新工艺实现批量验证 2025 年 04 月 30 日 投资评级：买入（维持） | 日期 | 2025/4/29 | | --- | --- | | 当前股价(元) | 163.80 | | 一年最高最低(元) | 216.52/101.40 | | 总市值(亿元) | 458.20 | | 流通市值(亿元) | 458.20 | | 总股本(亿股) | 2.80 | | 流通股本(亿股) | 2.80 | | 近 3 个月换手率(%) | 90.55 | 股价走势图 数据来源：聚源 -24% 0% 24% 48% 72% 96% 2024-04 2024-08 2024-12 拓荆科技 沪深300 相关研究报告 《多款新品确收助力营收增长，工艺 覆盖度加速提升—公司信息更新报 告》-2024.10.30 《单季度业绩表现亮眼，新品类设备 研发成果显现—公司信息更新报告》 -2024.8.29 《薄膜沉积应用领域持续拓展，订单 高增保障未来业绩—公司信息更新报 告》-2024.5.6 陈蓉芳（分析师） 陈瑜熙（分析师） chenrongfang ...

Core Viewpoint - The company is engaged in the research, production, and sales of high-end semiconductor equipment, focusing on maintaining core competitiveness through independent research and development, with a significant emphasis on the growth potential in the semiconductor equipment market driven by advancements in technology and increasing demand from emerging industries [3][4][8]. Company Overview - The company primarily operates in the high-end semiconductor equipment sector, developing products such as PECVD, ALD, SACVD, HDPCVD, and Flowable CVD equipment, which are widely used in the manufacturing of integrated circuits [3][4]. - The company has established a stable cooperation relationship with domestic semiconductor manufacturers, ensuring a steady flow of orders through direct sales and technical services [7][8]. Industry Situation - The semiconductor equipment industry is characterized by cyclical fluctuations, driven by technological advancements and demand from downstream applications, with a projected global semiconductor sales growth of 19% to $628 billion in 2024 [8][9]. - The global semiconductor manufacturing equipment sales are expected to reach $117.1 billion in 2024, reflecting a 10% increase from 2023, with China being the largest market for semiconductor equipment, projected to reach $49.6 billion in sales, a 35% year-on-year growth [9][10]. - The thin film deposition equipment market, a subset of the semiconductor equipment sector, is expected to reach approximately $23 billion in 2024, with the company focusing on CVD equipment, which holds a significant market share [10][12]. Technological Trends - The advancement of three-dimensional integration technology is becoming a key driver for market growth, with the global advanced packaging market expected to grow from $4.3 billion in 2023 to $28 billion by 2029, at a CAGR of 37% [12][13]. - The increasing complexity of chip manufacturing processes and the shift towards 3D chip designs are driving demand for advanced bonding equipment, which is essential for achieving high-density and high-performance chips [12][24]. Financial Data - The company plans to distribute a cash dividend of 2.70 yuan per 10 shares, amounting to a total of approximately 75.18 million yuan, which represents 10.93% of the net profit attributable to shareholders for the reporting period [1][2].