Group 1 - The third Integrated Chip and Chiplet Conference will be held in Wuhan from October 10-13, 2025, focusing on the theme "Design and Packaging Collaboration, Building the Future of Chips" [2][3] - The conference aims to discuss the latest advancements and future trends in integrated chip and chiplet technology, which are crucial for driving innovation in various sectors such as electronics, communication systems, and artificial intelligence [3][4] - The event will feature keynote speeches, expert roundtable discussions, technology forums, and showcases of cutting-edge technologies, providing attendees with insights into the latest research and practical case studies [4] Group 2 - Registration for the conference is now open, with student tickets priced at 1,000 yuan and non-student tickets at 2,000 yuan [6] - Early bird registration discounts are available until September 20, 2025, with student tickets at 800 yuan and non-student tickets at 1,600 yuan [7] - The conference invites sponsorships, offering partners opportunities for brand promotion and resource integration to achieve multiple goals in technology display, market expansion, and industry collaboration [11]