公众号记得加星标⭐️，第一时间看推送不会错过。 分论坛及论坛目用 论坛1:面向大模型的存算融合三维芯片 刘 琦(复旦大学) 杨建国(张江实验室) 第三届集成芯片和芯粒大会(会议网址https://2025.iccconf.cn/)，由武汉大学、中国科学院计算技术 研究所、复旦大学主办，将于2025年10月10-13日在武汉召开。大会主题是"设计封装协同，共筑芯 未来"。会议设立16场技术分论坛，为集成芯片与芯粒技术领域专业人士提供思想交锋、技术论道、 交流会友的舞台。16场技术分论坛，聚焦三维集成、异构融合、多物理场协同、高速互连、EDA设 计方法、先进存储与封装工艺等前沿方向。论坛将汇聚来自全国多所知名高校、研究院所及产业界的 顶尖专家，共同探讨从设计、器件、工艺到系统的最新突破与发展趋势。通过多维度、全链条的交流 与碰撞，本届大会将为推动集成芯片和芯粒技术的协同创新、突破关键瓶颈、加速产业落地注入新的 动能。 扫 描 文 末 二 维 码 ， 或 登 录 会 议 官 方 网 站 (https://2025.iccconf.cn/) ， 点 击 " 注 册 缴 费 "→ 提 交 信 息 →"我要缴费"。早鸟注 ...

Group 1 - The third Integrated Chip and Chiplet Conference will be held in Wuhan from October 10-13, 2025, focusing on the theme "Design and Packaging Collaboration, Building the Future of Chips" [2][3] - The conference aims to discuss the latest advancements and future trends in integrated chip and chiplet technology, which are crucial for driving innovation in various sectors such as electronics, communication systems, and artificial intelligence [3][4] - The event will feature keynote speeches, expert roundtable discussions, technology forums, and showcases of cutting-edge technologies, providing attendees with insights into the latest research and practical case studies [4] Group 2 - Registration for the conference is now open, with student tickets priced at 1,000 yuan and non-student tickets at 2,000 yuan [6] - Early bird registration discounts are available until September 20, 2025, with student tickets at 800 yuan and non-student tickets at 1,600 yuan [7] - The conference invites sponsorships, offering partners opportunities for brand promotion and resource integration to achieve multiple goals in technology display, market expansion, and industry collaboration [11]