此次纳入采信的6项HiPi团体标准为《芯粒测试规范》系列标准的第1部分至第6部分，内容涵盖芯 粒互联接口兼容性测试、芯粒可测性设计及互联接口连通性测试、测试文件数据格式、测试设备与 工具、量产测试以及电磁兼容测试等方面。这套标准是HiPi联盟芯粒标准体系的重要组成部分，紧 密结合了国内产业基础和技术实践，明确了测试接口、方法以及覆盖要求，确保芯粒在出厂、封装 和系统集成的各个阶段均具备可测性与接口一致性。该标准体系不仅具有高度的适应性，还提供了 极具工程指导价值的实施方案，旨在为芯粒技术在高性能计算、人工智能、通信等领域的规模化应 用提供坚实的技术支撑。 当前，我国芯粒领域标准化工作持续推进。2022年，HiPi联盟提出芯粒标准体系1.0版本。2023 年，HiPi联盟发布芯粒互联接口团标。2024年，全国集成电路标准化技术委员会成立芯粒标准工 作组；芯粒互联接口标准列为国家集成电路领域标准稳链重点项目之一。2025年8月，国家市场监 督管理总局（国家标准化管理委员会）正式发布了5项《芯粒互联接口规范》（GB/T 46280.1- 2025～GB/T 46280.5-2025）系列推荐性国家标准，将于2026 ...

Core Viewpoint - The Third Integrated Chip and Chiplet Conference will be held from October 10-13, 2025, in Wuhan, focusing on collaborative design and packaging to advance chip technology [1]. Event Overview - The conference is organized by Wuhan University, the Institute of Computing Technology of the Chinese Academy of Sciences, and Fudan University, featuring 7 keynote speeches and 16 technical forums [1]. - The theme is "Design and Packaging Collaboration, Building the Future of Chips," aiming to foster discussions on cutting-edge topics such as 3D integration, heterogeneous integration, multi-physical field collaboration, high-speed interconnects, EDA design methods, and advanced storage and packaging technologies [1]. Schedule Highlights - The opening ceremony will take place on October 11, 2025, followed by various sessions including: - Keynote on cutting-edge technology research in integrated chips [1]. - Forums addressing topics like storage and computing integration, multi-physical field simulation, and thermal management technologies [4]. - Notable speakers include experts from prestigious institutions such as the Chinese Academy of Sciences and Fudan University [4][1]. Participation Information - Registration for the conference can be completed online or on-site, with a countdown of only 2 days remaining until the event [5].

Core Viewpoint - The third Integrated Chip and Chiplet Conference will be held from October 10-13, 2025, in Wuhan, focusing on "Design and Packaging Collaboration to Build the Future of Chips" [2] Conference Overview - The conference will feature 16 technical sub-forums aimed at professionals in the integrated chip and chiplet technology fields, covering topics such as 3D integration, heterogeneous integration, multi-physical field collaboration, high-speed interconnects, EDA design methods, and advanced storage and packaging processes [2] - The event aims to foster collaborative innovation in integrated chip and chiplet technology, address key bottlenecks, and accelerate industry implementation [2] Agenda Summary - Registration will take place on October 10, 2025, from 14:00 to 20:00 at Wanda Reign Hotel [3] - The opening ceremony and keynote presentations are scheduled for the morning of October 11, followed by technical sub-forum reports in the afternoon [3] - The conference will continue with additional keynote presentations and sub-forum reports on October 12, along with self-service lunches and dinners [3] Sub-Forum Topics - Forum 1: Fusion of Storage and Computing for Large Models [5] - Forum 2: Multi-Physical Field Simulation for Integrated Chips [5] - Forum 3: Heterogeneous Integration of Memory and Computing Chips [5] - Forum 4: Optical I/O and Ultra-High-Speed Interfaces for Integrated Chips [5] - Forum 5: Thermal Management and Packaging Heat Dissipation Technologies [5] - Forum 6: Top Conference Forum - System Architecture [6] - Forum 7: Open Source Community Competitions [7] - Forum 8: IEEE Chiplet Workshop on Standards, Circuits, and Systems [7] - Forum 9: Advanced Packaging Processes and Hybrid Bonding for Chiplets [7] - Forum 10: Wafer-Level/Ultra-Wafer Size High-Performance Chips [7] - Forum 11: Heterogeneous Integrated 3D Power Supply Architectures [7] - Forum 12: Advanced Storage Chips Based on 3D Integration [7] - Forum 13: Silicon Interposer and Glass Substrate for Integrated Chips [7] - Forum 14: EDA Layout and Testing for Chiplet Integration [7] - Forum 15: Post-Processing 3D Heterogeneous Integrated Devices and Processes [8] - Forum 16: Top Conference Forum - Packaging Materials and Processes [8] Registration Information - Early bird registration ends on September 20, 2025, with registration available through the conference website [2][15]

Group 1 - The third Integrated Chip and Chiplet Conference will be held in Wuhan from October 10-13, 2025, focusing on the theme "Design and Packaging Collaboration, Building the Future of Chips" [2][3] - The conference aims to discuss the latest advancements and future trends in integrated chip and chiplet technology, which are crucial for driving innovation in various sectors such as electronics, communication systems, and artificial intelligence [3][4] - The event will feature keynote speeches, expert roundtable discussions, technology forums, and showcases of cutting-edge technologies, providing attendees with insights into the latest research and practical case studies [4] Group 2 - Registration for the conference is now open, with student tickets priced at 1,000 yuan and non-student tickets at 2,000 yuan [6] - Early bird registration discounts are available until September 20, 2025, with student tickets at 800 yuan and non-student tickets at 1,600 yuan [7] - The conference invites sponsorships, offering partners opportunities for brand promotion and resource integration to achieve multiple goals in technology display, market expansion, and industry collaboration [11]