Core Viewpoint - The article discusses the launch of a major research initiative by the National Natural Science Foundation of China aimed at addressing fundamental issues in integrated chip technology, with a focus on enhancing chip performance through innovative research and development [1][3]. Group 1: Scientific Goals - The major research plan targets cutting-edge technologies in integrated chips, aiming to explore new principles of decomposition, combination, and integration of chips through interdisciplinary collaboration among various fields such as circuit science, computer science, mathematics, physics, chemistry, and materials [3]. Group 2: Core Scientific Issues - The research will focus on three core scientific questions: - Mathematical description and optimization theory of chip particles, aiming to develop mapping, simulation, and optimization theories for complex integrated chips [5][6]. - Design automation and parallel architecture for large-scale chip particles, investigating design methodologies for high-density integrated chips [7]. - Coupling mechanisms and interface theories of multiphysical fields at the particle scale, clarifying the interactions of electrical, thermal, and mechanical fields in 3D integrated chips [8]. Group 3: Guidelines and Requirements - The guidelines for project proposals include: - Relevance to the major research plan and contributions to solving core scientific issues [10]. - Proposed research content emphasizing innovation and uniqueness [10]. - Expected progress and feasibility analysis [10]. - Overview of domestic and international research status, along with the research foundation of the proposing team [10]. Group 4: Submission Information - Proposals must be submitted via email by November 15, 2025, following specific naming conventions for attachments and emails [13].

Core Viewpoint - The Third Integrated Chip and Chiplet Conference will be held from October 10-13, 2025, in Wuhan, focusing on collaborative design and packaging to advance chip technology [1]. Event Overview - The conference is organized by Wuhan University, the Institute of Computing Technology of the Chinese Academy of Sciences, and Fudan University, featuring 7 keynote speeches and 16 technical forums [1]. - The theme is "Design and Packaging Collaboration, Building the Future of Chips," aiming to foster discussions on cutting-edge topics such as 3D integration, heterogeneous integration, multi-physical field collaboration, high-speed interconnects, EDA design methods, and advanced storage and packaging technologies [1]. Schedule Highlights - The opening ceremony will take place on October 11, 2025, followed by various sessions including: - Keynote on cutting-edge technology research in integrated chips [1]. - Forums addressing topics like storage and computing integration, multi-physical field simulation, and thermal management technologies [4]. - Notable speakers include experts from prestigious institutions such as the Chinese Academy of Sciences and Fudan University [4][1]. Participation Information - Registration for the conference can be completed online or on-site, with a countdown of only 2 days remaining until the event [5].

Core Viewpoint - The third Integrated Chip and Chiplet Conference will be held from October 10-13, 2025, in Wuhan, focusing on "Design and Packaging Collaboration to Build the Future of Chips" [2] Conference Overview - The conference will feature 16 technical sub-forums aimed at professionals in the integrated chip and chiplet technology fields, covering topics such as 3D integration, heterogeneous integration, multi-physical field collaboration, high-speed interconnects, EDA design methods, and advanced storage and packaging processes [2] - The event aims to foster collaborative innovation in integrated chip and chiplet technology, address key bottlenecks, and accelerate industry implementation [2] Agenda Summary - Registration will take place on October 10, 2025, from 14:00 to 20:00 at Wanda Reign Hotel [3] - The opening ceremony and keynote presentations are scheduled for the morning of October 11, followed by technical sub-forum reports in the afternoon [3] - The conference will continue with additional keynote presentations and sub-forum reports on October 12, along with self-service lunches and dinners [3] Sub-Forum Topics - Forum 1: Fusion of Storage and Computing for Large Models [5] - Forum 2: Multi-Physical Field Simulation for Integrated Chips [5] - Forum 3: Heterogeneous Integration of Memory and Computing Chips [5] - Forum 4: Optical I/O and Ultra-High-Speed Interfaces for Integrated Chips [5] - Forum 5: Thermal Management and Packaging Heat Dissipation Technologies [5] - Forum 6: Top Conference Forum - System Architecture [6] - Forum 7: Open Source Community Competitions [7] - Forum 8: IEEE Chiplet Workshop on Standards, Circuits, and Systems [7] - Forum 9: Advanced Packaging Processes and Hybrid Bonding for Chiplets [7] - Forum 10: Wafer-Level/Ultra-Wafer Size High-Performance Chips [7] - Forum 11: Heterogeneous Integrated 3D Power Supply Architectures [7] - Forum 12: Advanced Storage Chips Based on 3D Integration [7] - Forum 13: Silicon Interposer and Glass Substrate for Integrated Chips [7] - Forum 14: EDA Layout and Testing for Chiplet Integration [7] - Forum 15: Post-Processing 3D Heterogeneous Integrated Devices and Processes [8] - Forum 16: Top Conference Forum - Packaging Materials and Processes [8] Registration Information - Early bird registration ends on September 20, 2025, with registration available through the conference website [2][15]

Group 1 - The third Integrated Chip and Chiplet Conference will be held in Wuhan from October 10-13, 2025, focusing on the theme "Design and Packaging Collaboration, Building the Future of Chips" [2][3] - The conference aims to discuss the latest advancements and future trends in integrated chip and chiplet technology, which are crucial for driving innovation in various sectors such as electronics, communication systems, and artificial intelligence [3][4] - The event will feature keynote speeches, expert roundtable discussions, technology forums, and showcases of cutting-edge technologies, providing attendees with insights into the latest research and practical case studies [4] Group 2 - Registration for the conference is now open, with student tickets priced at 1,000 yuan and non-student tickets at 2,000 yuan [6] - Early bird registration discounts are available until September 20, 2025, with student tickets at 800 yuan and non-student tickets at 1,600 yuan [7] - The conference invites sponsorships, offering partners opportunities for brand promotion and resource integration to achieve multiple goals in technology display, market expansion, and industry collaboration [11]