Core Viewpoint - Pingchuang Semiconductor has achieved a significant milestone by independently developing pressure-sintered nano copper paste, marking it as the first company in China to break through international barriers in third-generation semiconductor packaging materials and the first globally to apply nano copper paste in automotive projects [1][19]. Group 1: Product Development and Features - The company has developed chip-level and system-level copper pastes, with the first production line capable of producing 500 kg/month and a second line planned for 1000 kg/month [3]. - The chip-level copper paste (seCure-BC1113) features low-temperature pressure sintering, excellent thermal and electrical conductivity, and high bonding strength, suitable for various chip surface coatings [4]. - The system-level copper paste (seCure-BC0323) allows for low-temperature sintering at 200°C and can sinter areas up to 3500 mm², eliminating the need for additional silver plating [5]. Group 2: Technical Innovations - The developed copper paste materials have an ultra-wide operational window, allowing for over 48 hours of handling time before drying, which enhances production efficiency and reduces material waste [7]. - The sintering process is characterized by low temperature (40-90°C lower than traditional methods), low pressure (over 30% reduction), and short duration (5 minutes), improving energy efficiency and equipment compatibility [9]. - The technology effectively addresses oxidation issues in DBC and AMB substrates, enhancing the reliability and strength of sintered connections without the need for additional reduction steps [11][19]. Group 3: Market Impact and Future Prospects - The nano copper paste technology represents a dual breakthrough in performance and cost, with copper prices being only 1/10 of silver, and the cost of the paste being 1/3 of sintered silver [19]. - The thermal conductivity of the developed materials exceeds 200 W/(m·K), significantly outperforming traditional solder pastes, and the shear strength exceeds 60 MPa, with no risks of silver paste sulfidation or electromigration [19]. - The recognition from leading automotive companies for the application of this technology in electric vehicles and power electronics indicates strong market potential and future growth opportunities [19].