广合科技（001389）(001389.SZ)公告，公司拟通过招拍挂方式购买位于广州市黄埔区东江大道以东的 土地使用权并投资建设云擎智造基地项目。项目投资金额约26亿元人民币(含购买土地使用权款)，公司 将以自有资金、银行贷款或其他融资方式出资，用于项目的开发和运营，本次投资建设项目周期为2025 年下半年至2027年。 据悉，经过公司多年的技术积累与发展，公司具备46层高多层板的量产能力并完成7阶HDI制造工艺的 验证。随着与客户合作的广度和深度不断增强，基于广州工厂现有的订单负荷及物理空间限制，无法满 足所有客户高多层PCB和HDI等高端PCB产品的需求。因此，本项目的实施将进一步扩大公司高端PCB 业务规模，满足服务器应用领域客户的需求，提升核心产品的竞争力。 ...

Core Viewpoint - The company plans to acquire land use rights and invest in the Cloud Manufacturing Base project in Guangzhou, with an estimated investment of approximately 2.6 billion RMB [1] Group 1: Project Details - The investment will be funded through self-owned funds, bank loans, or other financing methods [1] - The project development and operation period is set from the second half of 2025 to 2027 [1] Group 2: Company Capabilities - The company has achieved mass production capability for 46-layer high multi-layer boards and validated the 7-stage HDI manufacturing process [1] - The implementation of this project aims to expand the company's high-end PCB business scale to meet the demand from clients in the server application field [1] Group 3: Market Demand - The current order load and physical space limitations at the Guangzhou factory hinder the ability to meet all customer demands for high multi-layer PCBs and HDI products [1] - Strengthening collaboration with clients is a key focus, as the company seeks to enhance the competitiveness of its core products [1]