Core Insights - TSMC is facing delays in the construction of its advanced packaging facility in Chiayi, with equipment installation now pushed from Q3 to Q4 2024, raising concerns about the impact on global high-performance computing (HPC) chip supply [1][2] - The Chiayi facility is expected to focus on wafer-level multi-chip module (WMCM) packaging, which integrates multiple chips at the wafer stage, potentially first applied to Apple's self-developed chips [1] - Recent safety incidents at the construction site have led to work stoppages, with the need for improvement plans and training before resuming operations, highlighting the importance of safety management in the project [2] Group 1 - TSMC's advanced packaging facility in Chiayi was initially scheduled for equipment installation in Q3 but has been delayed to Q4 [1] - The Chiayi facility's first phase will establish WMCM packaging capacity, integrating multiple chips at the wafer stage [1] - The construction has faced challenges, including work stoppages due to cultural heritage discoveries and safety incidents [1][2] Group 2 - TSMC has begun recruiting technicians for the Chiayi facility, offering salaries above NT$700,000 per year [2] - The recent safety incidents involved different contractors and have resulted in work being halted until improvement plans are approved [2] - TSMC is being urged to enhance safety measures following the incidents, as it is the owner of the project [2]