Summary of Zhongfu Circuit Conference Call Company Overview - Zhongfu Circuit focuses on communication and data center businesses, which are expected to account for nearly 50% of revenue by 2025, driven by the high pricing and profitability of the AI industry. The company is currently facing capacity constraints but has a strong order situation [2][4][16]. Investment and Production Capacity - Since its IPO in 2021, Zhongfu Circuit has invested approximately 400 million yuan in domestic and Thai factories, focusing on HDI thick copper boards and high-end AI power-related products, which are expected to gradually start production and yield benefits [2][5][6]. - The domestic factory is operating at nearly full capacity, while the Thai factory has a lower utilization rate but is expected to see significant increases in the fourth quarter [3][16]. Business Segmentation and Performance - The company’s product segments include: - Communication and data center: ~50% - Industrial products: ~20% - Automotive electronics: ~20% - Consumer electronics: ~10% [4][7]. - Overall performance in the first three quarters of 2025 showed a growth of approximately 3-4%, primarily benefiting from the AI industry's high pricing and profitability [4]. Technological Advancements - The introduction of NVIDIA's 800V DC power architecture is a significant advantage for Zhongfu Circuit, with collaborations on nearly all front-end solutions. This architecture is expected to enhance the value of PCB boards significantly starting in 2026 [2][9][10]. - The transition from 480V AC to 800V DC will introduce new power levels and modularization, which will increase the value of HVDC products [10]. High-End Product Strategy - Currently, high-end products account for about 30-40% of revenue, with a goal to increase the market share of embedded components and advanced power supplies, targeting over 50% in the future [12][11]. - The company aims to develop 16×16 layer to 30 layer HBI products, with average prices exceeding 10,000 yuan [12]. Competitive Positioning - Zhongfu Circuit maintains a leading position in advanced packaging through collaborations with top chip companies and is actively seeking customer opportunities in traditional PCB sectors [13]. - The company plans to supply high-end products from both its He Shan and Thai factories, with significant orders from major global clients [14]. Future Outlook - The company anticipates that high-end PCB capacity is not yet oversaturated, with ongoing demand, particularly in overseas markets [22]. - The automotive sector is expected to see good growth next year, but the company will focus on high-margin products with technological barriers, avoiding low-margin projects [23]. Cost and Pricing Dynamics - The rise in copper foil prices affects mid-to-low-end products but not high-end products, leading to a strategy of increasing high-end product share while reducing competition in lower-tier products [25]. - The company expects a turning point in profit margins to occur soon, potentially in the fourth quarter or early next year, focusing on high-end products to drive profitability [26]. Conclusion - Zhongfu Circuit is strategically positioned to capitalize on the growth of the AI industry and advanced power solutions, with significant investments in production capacity and a clear focus on high-end product development. The company is well-prepared to meet increasing demand while navigating challenges in capacity and market dynamics.