截至发稿，奥士康市值为136亿元。 每经头条（nbdtoutiao）——天水麻辣烫、淄博烧烤、荣昌卤鹅⋯⋯"泼天流量"退去后，这些城市怎么 样了？ （记者 曾健辉） 每经AI快讯，奥士康（SZ 002913，收盘价：42.87元）10月10日晚间发布公告称，截至2025年9月30 日，公司通过回购专用证券账户以集中竞价交易方式回购股份约289万股，占公司目前总股本的 0.9101%，最高成交价为39.52元/股，最低成交价为24.64元/股，成交金额约为9004万元，公司本次回购 金额已达回购方案中的回购资金总额下限，且不超过回购资金总额上限。至此，本次回购方案已实施完 毕，实际回购股份时间区间为2025年5月7日至2025年8月27日。 2025年1至6月份，奥士康的营业收入构成为：PCB制造占比91.6%，其他业务占比8.4%。 ...

Summary of Key Points from the Conference Call Industry Overview - **Industry**: Electronic Components in Japan - **Investor Engagement**: 29 individual meetings and one group meeting held with institutional investors in Singapore and Hong Kong from September 29 to October 3, focusing on stock selection and trends from July to September, as well as medium-term earnings projections for fiscal year ending March 2027 [1][2] Core Insights - **Investment Themes**: There is a growing emphasis on selecting stocks related to AI, data centers, and other specific themes rather than focusing solely on earnings. Strong interest was noted in several companies: - **Ibiden**: High market share in NVIDIA's GPU ABF package substrates - **Murata Manufacturing and Taiyo Yuden**: Increasing sales in the AI/data center segment within their main MLCC businesses - **TDK**: Ongoing expansion in rechargeable battery earnings and improvements in HDD-related business - **Meiko Electronics**: Geopolitical advantage due to primary production site in Vietnam [3] Company-Specific Highlights Ibiden - **Sales Growth**: Reported ¥75.1 billion in sales from NVIDIA in fiscal year 2025, a 138% year-over-year increase. Expected sales to rise to ¥130.0 billion in fiscal year 2026 and ¥192.7 billion in fiscal year 2027. - **New Product Launch**: Anticipated shipments of Rubin ABF package substrates starting March 2026, expected to significantly boost earnings. - **Operational Performance**: Projected operating profit of ¥12.0 billion for Q2 fiscal year 2026, with a total of ¥58.7 billion for fiscal year 2026 [4][8] Murata Manufacturing - **Market Conditions**: Not expecting tight supply-demand conditions for MLCCs in the near future. Global MLCC shipment value is projected to increase from $12.64 billion in 2023 to $14.84 billion in 2025 (+11.6% YoY). - **Operational Performance**: Forecasting operating profit of ¥269.9 billion for fiscal year 2026, with a significant impact from currency fluctuations [9][10] TDK - **Earnings Outlook**: Expected operating profit of ¥266.3 billion for fiscal year 2026, marking a sixth consecutive year of all-time high profits. - **Product Focus**: Mobile-device rechargeable batteries and HDD-related business are key profit drivers. Anticipated improvements in HDD-related business profitability [10][11] Meiko Electronics - **Long-term Growth**: Projected operating profit of ¥24.1 billion for fiscal year 2026, driven by strong sales to smartphone and gaming segments. - **Strategic Initiatives**: Forming a joint venture with Taiwan-based ACCL to enhance production capabilities for AI servers [13][21] Additional Insights - **MLCC Market Dynamics**: MLCCs are critical components across various electronic devices, with AI server-related business expected to contribute approximately 7% of MLCC shipment value in 2025. - **Currency Impact**: A single yen change against the USD is estimated to impact operating profit by approximately ¥4.5 billion for Murata and ¥900 million for Taiyo Yuden [9][14] Risks and Considerations - **Upside Risks**: High-value-added ABF package products may drive earnings beyond expectations for Ibiden. For TDK, potential growth in HDD heads earnings is not factored into the base case. - **Downside Risks**: Increased competition from Taiwanese peers in the automotive PCB market and potential downturns in auto production could negatively impact Meiko Electronics [19][24][30] This summary encapsulates the key points discussed during the conference call, highlighting the performance and outlook of major players in the electronic components industry in Japan.

Core Insights - The communication equipment industry experienced a revenue growth of 12.7% year-on-year in Q2 2025, indicating a recovery that began in Q4 2023, with AI computing power emerging as a new growth engine [1][2] - The net profit for the communication equipment sector grew by 19.0% year-on-year in Q2 2025, reflecting strong profitability amid the transition of growth drivers [1][2] Financial Summary and Outlook - The overall revenue for communication equipment in Q2 2025 increased by 12.7% year-on-year, with growth accelerating from Q4 2023 to Q3 2024, indicating a successful transition between old and new growth drivers [2] - The net profit attributable to the parent company in Q2 2025 rose by 19.0% year-on-year, showing consistent growth in Q1 and Q2 2025 after a decline in Q4 2024 [2] Key Industry Segments to Watch - The optical device segment saw a remarkable revenue growth of 72.81% year-on-year in Q2 2025, with net profit growth of 133.5%, driven by increased global demand for AI and optical modules [3] - The Internet of Things (IoT) sector continued to show good revenue growth in Q2 2025, confirming the ongoing recovery trend, with companies benefiting from the long-term trend of interconnected devices [3] - The fiber optic cable sub-sector reported a revenue increase of 16.5% year-on-year in Q2 2025, although net profit declined by 9.6% [4] - The main equipment sector reversed its downward trend in Q1 and Q2 2025, driven by strong demand for computing power, despite challenges in operator capital expenditures [5] - The satellite industry generated revenue of 1.12 billion yuan in Q2 2025, down 17.0% year-on-year, but is expected to enter a phase of regular launches following the establishment of satellite internet [5] - The Beidou and military communication sectors reported revenue of 5.31 billion yuan in Q2 2025, a decline of 7.1% year-on-year, but are anticipated to recover with new equipment entering service [5] Investment Recommendations - The company suggests focusing on investment opportunities in "AI + overseas expansion + satellite" sectors, particularly in optical modules and devices, as well as domestic computing power lines [6] - Key recommendations include companies in the optical device sector such as Zhongji Xuchuang and Tianfu Communication, and in the server and switch PCB sectors like Huadian Co. and ZTE [7] - The report highlights the potential of the satellite internet industry and encourages monitoring developments in this area [6][10]

Core Viewpoint - The report highlights that the evolution of AI computing hardware is driving structural growth opportunities in the PCB (Printed Circuit Board) industry, with significant demand for high-layer and HDI boards due to the increasing requirements of AI applications and high-performance computing [1][27]. Industry Overview - The global PCB market size is projected to grow from $62 billion in 2020 to $75 billion in 2024, with a compound annual growth rate (CAGR) of 4.9%. By 2029, the market is expected to reach $93.7 billion, with a CAGR of 4.6% from 2024 to 2029 [1][27]. - The AI and high-performance computing sectors are anticipated to see substantial growth, with the market size expected to reach $15 billion by 2029, reflecting a CAGR of 20.1% from 2024 to 2029 [1][27]. Demand Drivers - The demand for high-layer PCBs and HDI boards is rapidly increasing, driven by the need for high-frequency, low-signal loss, and high-heat dissipation performance in AI servers. The value of a single AI server PCB is significantly higher than that of traditional servers [1][27]. - The market for high-layer PCBs is projected to reach $171 billion by 2029, while the share of high-end HDI boards in the global HDI market is expected to rise from 47% in 2024 to 57% in 2029, with a market size of $9.6 billion [1][27]. Technological Advancements - AI server requirements are pushing PCB technology upgrades, necessitating the use of high-layer (14-30 layers) and low-loss materials. This includes the adoption of low roughness reverse (RTF) copper foil and very low loss materials to minimize signal distortion [1][27]. - The report emphasizes the importance of material upgrades, such as the transition from traditional fiberglass cloth to low dielectric constant Q cloth, to meet the evolving demands of high-frequency applications [1][27]. Company Strategies - Companies in the PCB sector are actively expanding their capabilities. For instance, companies like Huadian Co. are advancing high-end PCB production, while Shenghong Technology has the capacity for mass production of high-layer boards and HDI boards [1][27]. - Equipment manufacturers like Chip Microelectronics and Dazhu CNC are introducing laser equipment tailored for high-end PCB processing, while material suppliers like Honghe Technology and Feilihua are developing low-dielectric electronic fabrics and high-end copper foils [1][27].

智通财经10月7日讯（编辑 若宇）据Choice数据统计，沪深京三市9月（9.1-9.30）共有2027家上市公司接受机构调研。具体来看，接待机构调研次数最多的 上市公司是大族激光达14次；汇川技术位列第二，接待次数为10次；中控技术、威力传动和冰轮环境紧随其后，接待次数为9次。具体详见下图： 大族数控同样具备PCB概念，公司自4月低点迄今股价累计最大涨幅达289.68%。大族数控9月30日披露投资者关系活动记录表，公司业务模式创新发展，通 过布局PCB生产关键工序及多品类产品为客户提供一站式解决方案，实现了应用场景、技术、供应链、设备与材料、产品、工序、客户的多维协同，并创造 性地发挥协同优势，放大客户、供应链及产业链伙伴、公司整体价值，不断提升公司产品的技术能力和客户服务能力，助力下游客户提升综合竞争力，更好 的满足不断演进的PCB先进制造需求。 芯片股聚辰股份自8月低点迄今股价累计最大涨幅达132.26%。聚辰股份9月29日发布投资者关系活动记录表，在内存模组配套芯片领域，公司拥有近二十年 的量产经验。自DDR2世代起即研发并销售配套DDR内存模组的SPD芯片，凭借长期的技术积累、对行业标准的理解以及多 ...

《科创板日报》10月5日讯 就在上个月，胜宏科技和沪电股份，两家市值过千亿的PCB龙头，分别披露了其融资扩产计划的进度。 先是9月17日，沪电股份在接受机构调研时透露了其新建人工智能芯片配套高端印制电路板扩产项目进展。据悉，该项目投资额高达43亿元，最初规划于去 年10月，并于今年6月下旬正式开工建设。公司预计，将在2026年下半年开始试产，并逐步提升产能。 随后在9月19日，经过近11个月的推进，胜宏科技新一轮定增最终落地。根据公告，此轮定增募集资金总额达19亿元，其中8.5亿元投向越南胜宏人工智能 HDI项目，5亿元投向泰国高多层印制线路板项目。 此外，据《科创板日报》统计，仅7月25日至今，便有8家PCB厂商公布新一轮的融资扩产计划，扩产投资项目大多用于提升HDI、HLC、SLP等高端PCB产 能和技术能力。 虽然未来PCB需求尚具有不确定性，但在AI叙事下，PCB产品具有沿着高端方向发展的需要是确定的。 | 代码 | 公司 | | 动作类 | | --- | --- | --- | --- | | 002938. SZ | 鹏鼎控股 | | 扩产 | | 002384. SZ | 东山精密 | | 扩 ...

大盘指数 4000 14000 3000 8000 7000 策略观点 以时间换空间 投资要点 9月主要股指表现分化,成长风格独领风骚。截至9月26日,上 证指数下跌 0.77%,深证成指上涨 4.04%,创业板指上涨 9.04%,沪深 300 上涨 1.19%,上证 50下跌 1.19%,科创 50 上涨 8.16%。按风格来 看,稳定风格下跌 1.67%,金融风格下跌 6.13%,消费风格下跌 2.60%, 周期风格上涨2.24%,成长风格上涨4.06%。大盘指数上涨1.31%,中 盘指数上涨 3.62%,小盘指数下跌 0.30%,茅指数上涨 3.25%,宁组合 上涨 9.44%。 节奏上,外部扰动较少,A股节奏先抑后扬。A 股在 9.3 阅兵后 一度出现较大跌幅,但又很快在创业板的带动下收复失地继续上行。 从整月来看,A股在9月并没有面临什么重大的外部扰动,内部经济 数据保持平稳,美联储降息也符合市场预期,节奏更多由市场自身博 弈决定。 资料来源:聚源,中邮证券研究所 研究所 分析师:黄子签 SAC 登记编号:S1340523090002 Email : huangziyin@cnpsec. com 近 ...

沪电股份所属申万行业为：电子-元件-印制电路板。所属概念板块包括：5G、PCB概念、英伟达概念、 电池管理、新基建等。 截至6月30日，沪电股份股东户数12.82万，较上期减少40.16%；人均流通股14997股，较上期增加 67.18%。2025年1月-6月，沪电股份实现营业收入84.94亿元，同比增长56.59%；归母净利润16.83亿元， 同比增长47.50%。 分红方面，沪电股份A股上市后累计派现41.12亿元。近三年，累计派现22.04亿元。 机构持仓方面，截止2025年6月30日，沪电股份十大流通股东中，香港中央结算有限公司位居第三大流 通股东，持股1.23亿股，相比上期增加4719.71万股。华泰柏瑞沪深300ETF（510300）位居第四大流通 股东，持股2404.05万股，相比上期增加211.67万股。易方达沪深300ETF（510310）位居第六大流通股 东，持股1711.12万股，相比上期增加171.29万股。易方达上证50增强A（110003）位居第七大流通股 东，持股1458.78万股，为新进股东。华夏沪深300ETF（510330）位居第九大流通股东，持股1254.33万 股，相比 ...

PCB 作为电子元器件关键互联件，属于二级封装环节，承担支撑、互联功能，其技术演进正朝着高密度、高 电气性能方向快速发展。当前， AI 服务器、高速通信及汽车电子等下游需求驱动 PCB 技术从材料、工艺和架 构三大维度全面升级 ： 1) 材料端， M9/PTFE 树脂、 Rz ≤ 0.4 微米的 HVLP 铜箔及低损耗石英布等高端材料成为实现 224G 高速传输 的关键 ; 2) 工艺端， mSAP/SAP 工艺将线宽 / 线距推向 10 微米以下，激光钻孔背钻及高多层堆叠工艺支撑高密度互连 ; 3) 架构端， CoWoP 封装通过去除 ABF 基板将芯片直连 PCB ，对板面平整度、尺寸稳定性及制造良率提出极 高要求 ，正交背板方案为满足 224GSerDes 传输需采用 M9 或 PTFE 等低损耗材料，埋嵌式工艺则通过将功率 芯片嵌入板内，实现去散热器化与系统级降本，但需引入半导体级洁净室与 IC 工艺。 点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 内容目录（8部分）： 投资要点、PCB技术演进、PCB上游（树脂、铜箔、玻纤布）、PCB市场、国内 ...

①人形机器人+特斯拉+储能，已获Figure新一代机器人定点并转量产，特斯拉PCB核心供应商，这家公司 受益特斯拉储能翻倍增长驱动出货爆发； ②长江存储+芯片，已获得长江存储代理权，这家公司代理产品 主要包括射频芯片、指纹芯片、电源芯片、存储芯片等。 前言 《电报解读》是一款主打时效性和专业性的即时资讯解读产品。侧重于挖掘重要事件的投资价值、分析 产业链公司以及解读重磅政策的要点。即时为用户提供快讯信息对市场影响的投资参考，将信息的价值 用专业的视角、朴素的语言、图文并茂的方式呈现给用户。 ...