深圳中富电路股份有限公司 简式权益变动报告书 上市公司名称：深圳中富电路股份有限公司 信息披露义务人：深圳市泓锋实业发展有限公司 住所及通讯地址：深圳市南山区南山街道荔湾社区前海路0101号丽湾商务公寓B- 507 股份变动性质：持股比例减少 签署日期：2026年3月27日 1 股票上市地点：深圳证券交易所 股票简称：中富电路 股票代码：300814 一致行动人之一：中富电子有限公司 住所及通讯地址：香港柴湾丰业街10号业昌中心4楼F室 一致行动人之二：深圳市睿山科技有限公司 住所及通讯地址：深圳市南山区招商街道沿山社区3兰溪谷二期3B栋4C 一致行动人之三：香港慧金投资有限公司 住所及通讯地址：香港柴湾丰业街10号业昌中心4楼F室 一致行动人之四：深圳市中富兴业电子有限公司 住所及通讯地址：深圳市南山区粤海街道龙城社区南商路80号钜建大厦龙泉阁8F 一致行动人之五：东莞市泓众投资有限公司 住所及通讯地址：广东省东莞市东坑镇骏发三路33号1208室 信息披露义务人声明 一、信息披露义务人根据《中华人民共和国证券法》（以下简称《证券法》 ）、《上市公司收购管理办法》（以下简称《收购办法》）、《公开发行证券 的公 ...

证券代码：300814 证券简称：中富电路 公告编号：2026-005 深圳中富电路股份有限公司 关于控股股东存续分立的进展暨权益变动的提示性公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 特别提示： 1、公司控股股东深圳市泓锋实业发展有限公司（以下简称"泓锋实业"） 存续分立后，公司控股股东、实际控制人保持不变，中富电子有限公司（以下 简称"中富电子"）、深圳市睿山科技有限公司（以下简称"睿山科技"）、 香港慧金投资有限公司（以下简称"香港慧金"）、泓锋实业（存续公司）、 深圳市中富兴业电子有限公司（以下简称"中富兴业"）仍为公司控股股东， 东莞市泓众投资有限公司（以下简称"泓众投资"、新设公司）为其一致行动 人，不影响公司生产经营和独立性。 2、本次权益变动后，泓众投资将承继泓锋实业在公司首次公开发行股票时 所做出的全部承诺事项，并遵守《上市公司股东减持股份管理暂行办法》《深 圳证券交易所上市公司自律监管指引第18号——股东及董事、高级管理人员减 持股份》中关于大股东减持额度、预披露义务、减持限制等规定。 3、本次权益变动系因控股股东泓锋实业实施存续 ...

Market Overview - A-shares experienced a collective decline with the Shanghai Composite Index down by 0.85%, Shenzhen Component Index down by 1.87%, and ChiNext Index down by 2.29% [3][4] - Over 4,500 stocks saw a decrease in value [3] Sector Performance - The insurance, precious metals, and banking sectors showed positive performance, while the real estate sector was notably active [6] - Specific real estate stocks such as Shijianhang, Jingneng Real Estate, and Jingtou Development reached their daily limit up [7] Notable Stock Movements - Shijianhang (002285) increased by 10.00% to 3.41, Jingneng Real Estate (600791) rose by 9.99% to 9.36, and Jingtou Development (600683) climbed by 9.96% to 10.60 [8] - In contrast, the CPO sector faced adjustments, with stocks like Juguang Technology dropping over 12% [9] Trading Volume - The total trading volume in the Shanghai and Shenzhen markets was 2.21 trillion yuan, a decrease of 117.5 billion yuan compared to the previous trading day [9] Capital Flow - Main capital inflows were observed in non-bank financials, public utilities, and banking sectors, while outflows were noted in electronics, communications, and machinery sectors [11] - Individual stocks such as Xiexin Integration and Huadian New Energy saw significant net inflows of 3.339 billion yuan and 1.669 billion yuan respectively [12] - Conversely, stocks like Xinyi Sheng and Zhongji Xuchuang experienced net outflows of 3.06 billion yuan and 1.356 billion yuan respectively [13] Institutional Insights - Huatai Securities highlighted that AI empowerment and product innovation will be key growth drivers for technology consumer companies in 2026 [14] - CITIC Securities noted that increased policy support could accelerate the industrialization of the hydrogen energy sector [15] - Industrial logic optimization in the gaming sector, along with AI applications, is expected to catalyze growth according to Industrial Securities [16]

证券代码：300814 证券简称：中富电路 公告编号：2026-004 深圳中富电路股份有限公司（以下简称"公司"）于 2025 年 12 月 8 日在巨 潮资讯网（www.cninfo.com.cn）披露了《关于公司控股股东、实际控制人之一 致行动人股份减持计划的预披露公告》（公告编号：2025-110），持有公司 54,500,000 股（占本公司总股本比例 28.47%）的股东中富电子有限公司（以下 简称"中富电子"）、持有公司 29,539,200 股（占本公司总股本比例 15.43%） 的股东深圳市睿山科技有限公司（以下简称"睿山科技"）和持有公司 18,493,800 股（占本公司总股本比例 9.66%）的股东深圳市泓锋实业发展有限公司（以下简 称"泓锋实业"）计划在减持计划公告披露之日起 15 个交易日后的 3 个月内， 拟通过集中竞价交易方式减持公司股份不超过 1,914,300 股（不超过公司目前总 股本比例 1%），通过大宗交易方式减持公司股份不超过 3,828,602 股（不超过 公司目前总股本比例 2%），合计减持公司股份不超过 5,742,902 股，即不超过 公司总股份的 3%。 ...

一、权益变动基本情况 深圳中富电路股份有限公司（以下简称"公司"）于 2025 年 12 月 8 日在巨 潮资讯网（www.cninfo.com.cn）披露了《关于公司控股股东、实际控制人之一 致行动人股份减持计划的预披露公告》（公告编号：2025-110），持有公司 54,500,000 股（占本公司总股本比例 28.47%）的股东中富电子有限公司（以下 简称"中富电子"）、持有公司 29,539,200 股（占本公司总股本比例 15.43%） 的股东深圳市睿山科技有限公司（以下简称"睿山科技"）和持有公司 18,493,800 股（占本公司总股本比例 9.66%）的股东深圳市泓锋实业发展有限公司（以下简 称"泓锋实业"）计划在减持计划公告披露之日起 15 个交易日后的 3 个月内， 拟通过集中竞价交易方式减持公司股份不超过 1,914,300 股（不超过公司目前总 股本比例 1%），通过大宗交易方式减持公司股份不超过 3,828,602 股（不超过 公司目前总股本比例 2%），合计减持公司股份不超过 5,742,902 股，即不超过 公司总股份的 3%。 证券代码：300814 证券简称：中富电路 公告编 ...

证券代码：300814 证券简称：中富电路 公告编号：2026-002 深圳中富电路股份有限公司 关于公司控股股东、实际控制人之一致行动人持股比例 变动触及 1%整数倍的公告 公司控股股东、实际控制人之一致行动人中富电子有限公司、深圳市睿山科 技有限公司、深圳市泓锋实业发展有限公司、香港慧金投资有限公司、深圳市中 富兴业电子有限公司、东莞市泓众投资有限公司保证向本公司提供的信息内容真 实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 一、权益变动基本情况 | 1.基本情况 | | | --- | --- | | 信息披露义务人（一） | 中富电子有限公司 | | 住所 | 香港柴湾丰业街 10 号业昌中心 4 楼 F 室 | | 信息披露义务人（二） | 深圳市睿山科技有限公司 | | 住所 | 深圳市南山区招商街道沿山社区 3 兰溪谷二期 3B 栋 4C | | 信息披露义务人（三） | 深圳市泓锋实业发展有限公司 | | 住所 | 深圳市南山区南山街道荔湾社区前海路 0101 号丽湾商务 | | | 公寓 B-507 | | 信息披露 ...

Investment Rating - The report recommends a "Buy" rating for companies involved in the AIDC and related sectors, highlighting potential growth opportunities driven by advancements in AI and data center infrastructure [4]. Core Insights - The AIDC sector is experiencing rapid growth, with significant increases in power consumption and infrastructure upgrades driven by AI applications. The global AI market is projected to grow from $25.86 billion in 2024 to $803.9 billion by 2033, reflecting a compound annual growth rate (CAGR) of 46.5% [14][20]. - The power density of AI cabinets is expected to rise significantly, with single cabinet power reaching over 100 kW by 2025 and potentially exceeding 1 MW by 2030. This trend necessitates a shift towards high-voltage direct current (HVDC) systems for efficient power delivery [3][27]. - The evolution of power supply architecture is marked by a transition from traditional discrete components to highly integrated, modular designs. This includes vertical power delivery (VPD) systems that minimize power distribution network (PDN) losses and enhance efficiency [3][27]. - The report emphasizes the importance of companies like Hewei Electric, Zhongfu Circuit, and others that are positioned to benefit from these trends in high-density power integration and HVDC technology [3][4]. Summary by Sections Section 1: Growth in CSP Capital Expenditure and AIDC Power Demand - The North American and Asia-Pacific AI markets are rapidly expanding, leading to increased investment in AIDC infrastructure. The AIDC market in China is expected to exceed 100 billion CNY in 2024, reaching approximately 288.6 billion CNY by 2028, with a CAGR of around 30% [14][18]. Section 2: AI Cabinet Power Density and Electrical Architecture Upgrades - The report discusses the anticipated upgrade of AIDC electrical architecture to 800V HVDC systems, which can significantly enhance power transmission efficiency compared to traditional AC systems. This transition is driven by the increasing power demands of AI servers and the need for more efficient cooling solutions [3][27]. Section 3: Onboard Power Supply Architecture Upgrades - The report outlines the trends in onboard power supply systems moving towards high integration and modular designs. The shift from discrete components to integrated power modules is essential to meet the demands of high-performance AI chips, which are increasingly operating at lower voltages and higher currents [3][27]. Section 4: Investment Recommendations - The report suggests focusing on companies that are leading the charge in high-density power integration and HVDC technology, such as Hewei Electric and Zhongfu Circuit, as they are well-positioned to capitalize on the growing demand for advanced data center infrastructure [3][4].

Core Viewpoint - Zhongfu Circuit (300814.SZ) experienced a 4.83% increase in stock price, reaching a historical high of 99.590 yuan, with a total market capitalization of 19.065 billion yuan [1] Group 1 - The stock price of Zhongfu Circuit has reached a new all-time high [1] - The company's market capitalization is reported at 19.065 billion yuan [1] - The increase in stock price is noted to be 4.83% [1]

Group 1 - Mingyang Circuit focuses on the R&D, production, and sales of printed circuit boards (PCBs), covering high multilayer boards, HDI boards, and rigid-flex boards, widely used in industrial control, communication equipment, and automotive electronics. The demand for high-reliability, high-density PCBs is continuously growing due to industrial automation upgrades, 5G communication network construction, and the increasing penetration of new energy vehicles [1][32] - Weirgao specializes in the R&D, production, and sales of electronic-grade special epoxy resins and related composite materials, which are key raw materials for PCBs. The demand for high-frequency, high-temperature, and low-loss materials is increasing in 5G communication, data centers, and new energy vehicles, leading to an expanding market space for specialty epoxy resins [2][33] - Qiangda Circuit focuses on the R&D, production, and sales of high-density interconnect printed circuit boards (HDI), widely used in consumer electronics such as smartphones and tablets. The market demand for high-end products like high multilayer HDI and AnyLayer HDI is continuously growing due to the recovery of the consumer electronics market and the upgrade of smart terminal functions [3][34] Group 2 - Benchuan Intelligent specializes in the R&D, production, and sales of PCBs, with core products including communication boards, automotive boards, and industrial control boards. The market demand for high-reliability, high-frequency PCBs is expanding due to the construction of 5G base stations and the upgrade of new energy vehicle systems [4][35] - Kexiang Co., Ltd. focuses on the R&D, production, and sales of HDI and high multilayer boards, covering various fields including consumer electronics and automotive electronics. The demand for high-end PCBs is continuously growing due to the functional upgrades of consumer electronics and the increasing demand for automotive electronic systems [5][36] - Jinlu Electronics specializes in the R&D, production, and sales of PCBs, with core products including automotive electronic boards and communication boards. The demand for high-reliability, high-integration PCBs is continuously growing due to the increasing penetration of new energy vehicles and the deep coverage of 5G networks [6][37] Group 3 - Shengyi Technology is a leading global supplier of copper-clad laminates (CCL) and related electronic materials, with products widely used in PCBs and electronic packaging. The demand for high-end copper-clad laminates is continuously expanding due to the increasing demand for high-frequency, high-temperature materials in 5G communication and data centers [7][38] - Xiehe Electronics focuses on the R&D, production, and sales of PCBs, including high-frequency and high-speed boards. The market demand for high-end products is continuously growing due to the advancement of 5G networks and the expansion of new energy vehicle systems [8][39] - Shiyun Circuit specializes in the R&D, production, and sales of PCBs, covering automotive electronics, consumer electronics, and industrial control. The demand for high-reliability, high-integration automotive PCBs is continuously growing due to the increasing complexity of in-vehicle electronic systems [9][40]

Group 1 - The CPO concept experienced significant fluctuations, with companies such as Jufei Optoelectronics and Jepu Technology reaching a 20% limit-up [1] - Other companies including Guanghe Technology, Zhongtian Technology, and Hengtong Optoelectronics also hit the limit-up [1] - Additional firms like Tianfu Communication, Yongding Co., Zhongfu Circuit, Guangxun Technology, and Taicheng Light followed with notable increases [1]