Market Performance - The main board led the gains with notable increases in stocks such as Jishi Media (+10.09%), Zhongdian Xilong (+10.05%), and Beiwai Technology (+10.04) [1] - The ChiNext board saw significant rises with Guangku Technology (+20.01%) and Rongke Technology (+20.00%) [1] - The Sci-Tech Innovation board also performed well, with Zhongchuan Special Gas (+20.01%) and Jinchengzi (+20.01%) [1] - Active sub-industries included SW Communication Network Equipment and Devices (+8.75%) and SW Passive Components (+7.03%) [1] Domestic News - TSMC announced plans to gradually phase out 6-inch wafer manufacturing over the next two years and continue to integrate 8-inch wafer capacity to enhance efficiency [1] - Guangli Micro announced the acquisition of 100% equity in LUCEDA, a global leader in silicon photonic chip design automation software [1] - Kaifeng Gas reported that its gas filling and storage project in Shantou, Guangdong, is nearing completion, with an expected annual output value exceeding 80 million yuan upon reaching full capacity [1] - IDC data indicated that China's tablet market shipment volume is projected to reach 8.32 million units in Q2 2025, reflecting a year-on-year growth of 15.6% [1] Company Announcements - Aiwei Electronics reported total revenue of 1.37 billion yuan for H1 2025, a year-on-year decrease of 13.4%, while net profit attributable to shareholders increased by 71.09% to 157 million yuan [3] - Ankai Micro reported total revenue of 234 million yuan for H1 2025, a decrease of 3.02%, with a net loss of 49 million yuan [3] - Pengding Holdings reported total revenue of 16.375 billion yuan for H1 2025, a year-on-year increase of 24.75%, with net profit attributable to shareholders rising by 57.22% to 1.233 billion yuan [3] - Youyan Silicon reported total revenue of 491 million yuan for H1 2025, a decrease of 3.2%, with net profit attributable to shareholders declining by 18.74% to 106 million yuan [3] Overseas News - Vuzix announced the launch of the new Vuzix LX1 smart glasses, designed for warehouse operations, expected to be mass-produced by the end of the year [4] - Samsung Electronics is developing a rectangular SoP packaging technology to compete for large-scale chip system integration orders with Intel and TSMC [4] - SK Hynix plans to apply six-layer extreme ultraviolet (EUV) technology to mass production of 1c DRAM to enhance DDR5 and high-bandwidth memory (HBM) product performance [4] - Arm introduced Arm Neural Technology at SIGGRAPH, which can significantly reduce GPU workload for mobile content by up to 50% [4]