Core Viewpoint - The company has confirmed the formal sales order for its 12-inch high-precision cutting equipment, which is suitable for ultra-thin wafers and supports various advanced packaging processes [1] Group 1: Product Capabilities - The 12-inch high-precision cutting equipment is designed for ultra-thin wafers and supports both full cutting and DBG half-cut processes [1] - The equipment also facilitates Edge Trimming processes in advanced packaging, catering to applications in CPO co-packaged optics and compact wearable devices [1] Group 2: Market Validation - The company's equipment for efficient packaging body cutting and sorting has entered the customer validation phase, indicating progress in market acceptance [1]

Core Viewpoint - The company, Guangli Technology, has developed a 12-inch high-precision cutting equipment suitable for ultra-thin wafers, which has already secured formal sales orders [1] Group 1: Product Capabilities - The cutting equipment supports both full cutting and DBG half-cut processes [1] - It is compatible with advanced packaging processes, including Edge Trimming, and can serve applications in CPO co-packaging optics, data internet scenarios, and compact wearable devices [1] Group 2: Market Validation - The equipment used for efficient packaging body cutting and sorting has entered the customer validation phase [1]