Group 1 - The core concept of CoWoP (Chip on Wafer on PCB) is to stack or place multiple chips directly on the PCB without an intermediate IC substrate, which improves electrical performance by shortening interconnection paths and reducing parasitic effects [1] - CoWoP is expected to gradually commercialize, with the PCB directly supporting the wafer, leading to reduced signal transmission loss and delay, as well as decreased packaging thickness and area, while enhancing heat dissipation [1] - SLP (Substrate-like PCB) performance is anticipated to improve significantly with the penetration of CoWoP, as it is positioned between HDI boards and IC substrates in terms of specifications and performance [2] Group 2 - SLP manufacturing relies heavily on the mSAP (Modified Semi-Additive Process) technology, which requires high precision in photolithography and laser direct imaging (LDI) to achieve fine lines [3] - Domestic companies such as Shenzhen Circuits, Pegatron, and Xingsen Technology have accumulated technology in both SLP and IC substrate processes, positioning them to benefit from future advancements [3] - Upstream equipment manufacturers like Chipbond and Dazhu CNC are also expected to benefit from production line upgrades due to the increasing demand for advanced SLP technology [3]