五年，是时间的刻度，也是发展的标尺。 "十四五"规划纲要擘画了中国经济社会发展的新蓝图，也为无数企业指明了奋进的方向。在这场波澜壮 阔的时代实践中，上市公司作为中国经济的"压舱石"和"排头兵"，正以创新为笔，书写着高质量发展的 答卷。 近期，中国上市公司协会联合21世纪经济报道等主流媒体，共同发起"我在'十四五'这五年上市公司在 行动"主题宣传活动，记录这些来自市场一线的生动故事。 本期，我们将目光投向了全球PCB龙头——鹏鼎控股（002938）。 鹏鼎控股成立于1999年4月，2018年9月在深交所上市，"十四五"期间，公司营业收入稳步攀升，彰显出 强大的市场竞争力。 依据Prismark 2018至2025年以营收计算的全球PCB企业排名，鹏鼎控股自2017年至2024年，已连续八年 荣登全球最大PCB生产企业之榜首。 今年上半年，鹏鼎控股业绩再度高增长——实现营业收入163.75 亿元，同比增长24.75%，实现净利润 12.33 亿元，同比增长57.22%。 对于公司能持续保持核心竞争力和增长潜力的原因，鹏鼎控股董事会秘书周红对记者指出："公司深谙 技术创新与卓越品质乃企业持续成功的基石，长期致力于技 ...

Core Viewpoint - The company reported a revenue increase of 20.93% in the first half of 2025, despite a slight decline in net profit, indicating resilience in a challenging global economic environment driven by trade tensions and geopolitical conflicts [2][3]. Financial Performance - Revenue for H1 2025 reached 7,095,186,521.63 CNY, up from 5,867,141,061.12 CNY in the same period last year, reflecting a growth of 20.93% [3]. - Net profit attributable to shareholders was 649,550,970.36 CNY, a decrease of 1.06% compared to 656,532,509.80 CNY in H1 2024 [3]. - The net profit after excluding non-recurring gains and losses was 537,390,109.68 CNY, down 9.02% from 590,670,835.34 CNY year-on-year [3]. - Total assets increased by 10.62% to 21,287,462,378.19 CNY, while net assets attributable to shareholders grew by 0.34% to 11,351,767,534.73 CNY [2][3]. Industry Trends - The PCB industry is experiencing structural growth driven by advancements in AI hardware, automotive ADAS, and high-end consumer electronics, despite global economic uncertainties [2]. - The demand for high-density interconnect (HDI), high-level circuit (HLC), and flexible printed circuit (FPC) boards is increasing, necessitating higher customization and advanced manufacturing capabilities [2]. Company Strategy and Operations - The company operates six production bases in China and is establishing a production base in Thailand, aiming for a sustainable international supply strategy [4]. - In the AI server sector, the company has accelerated mass production and enhanced its HDI capabilities, responding to high demand for high-end products [4]. - The company is upgrading its existing facilities and expanding its production capacity for high-end HDI to support AI servers and data centers [4]. Product Innovations - The company has achieved significant technological breakthroughs in high-frequency and high-speed communication products, including advanced HDI and multi-layer PTFE boards [5]. - In the automotive electronics sector, the company has become the largest automotive PCB supplier globally, focusing on high-level intelligent driving applications and expanding its customer base [6]. - The company is actively exploring new business opportunities in emerging fields such as humanoid robots and low-altitude aircraft, leveraging its expertise in automotive electronics [7]. Consumer Electronics - The company is positioned to benefit from the growing demand for AI-driven consumer electronics, including AI phones, PCs, and smart home devices, by leveraging its technological advantages in high-density boards [7].

Core Viewpoint - Pengding Holdings is actively investing in the AI server and optical module markets to establish a comprehensive AI cloud-edge ecosystem, while maintaining stable costs through the use of imported high-end copper-clad laminate materials [1][2]. Financial Performance - In the first half of the year, Pengding Holdings achieved total revenue of 16.375 billion, a year-on-year increase of 24.75%, and a net profit attributable to shareholders of 1.233 billion, reflecting a year-on-year growth of 57.22% [1]. - The increase in revenue is attributed to a higher proportion of consumer electronics and automotive products, which have higher gross margins compared to communication products [1]. Product Development and Market Strategy - The company is launching advanced HDI products for AI servers and automotive PCBs, with automotive server board revenue reaching 0.805 billion, a year-on-year increase of 87.42% [1]. - Pengding Holdings plans to invest a total of 8 billion in its Huai'an park to expand production capacity for SLP, high-end HDI, and HLC products, targeting the rapidly growing AI application market [2]. Production Capacity and Expansion - The first phase of the Thailand park is expected to be completed by May 2025, with partial production starting in the fourth quarter, focusing on AI servers, automotive, and optical communication sectors [2]. - The second phase of the Thailand facility has also commenced construction [2]. Raw Material Management - The company primarily uses imported high-end copper-clad laminate materials, which have relatively stable market prices, thus limiting the impact on overall costs [2]. - Pengding Holdings is enhancing cooperation with upstream raw material suppliers to ensure stable supply and is optimizing product structure through technological upgrades to mitigate the pressure from rising raw material prices [2]. Market Outlook - The demand for PCBs is expected to surge due to increased AI computing power, leading to a heated upstream materials market, although the price of copper-clad laminates remains uncertain due to fluctuations in copper prices [3].

Group 1: AI Server Market and Production Plans - The company is actively investing in the AI server and optical module markets to establish a comprehensive AI cloud-edge-end layout, with production capacity in Huai'an and initial production in Thailand expected in Q4 2025 [2][3] - The first phase of the Thailand plant was completed in May 2025, focusing on AI servers, automotive, and optical communication products [2] - The company plans to invest a total of 8 billion RMB in the Huai'an park to expand production capacity for SLP, high-end HDI, and HLC products, with the investment period from H2 2025 to 2028 [3] Group 2: Cost Management and Material Prices - The impact of rising prices for upstream copper-clad laminates on overall costs is limited due to the company's reliance on imported high-end materials, which have relatively stable prices [3] - The company is enhancing cooperation with upstream suppliers and optimizing product structures to mitigate the pressure from rising raw material prices [3] - The price of copper-clad laminates is subject to fluctuations in copper prices, leading to uncertainty in price trends for the second half of the year [3] Group 3: Financial Performance and Growth Drivers - The company's strong performance in H1 2025 is attributed to an increased revenue share from consumer electronics and automotive products, which have higher profit margins compared to communication products [3] - New production lines showed significant improvement in yield rates in Q2, contributing to better cost control [3] - The server and automotive PCB business achieved revenue of 805 million RMB in H1 2025, representing a year-on-year growth of 87.42% [3][4] Group 4: Funding Sources for Investments - The 8 billion RMB investment for the Huai'an industrial park will be funded through the company's own resources [4]

Expansion Investment Overview - The company plans to invest a total of 5 billion RMB in the expansion of its Zhuhai Jinwan base, with an estimated payback period of approximately 7.5 years, including the construction period [1][2] - The investment will be implemented in phases, including the renovation of existing facilities and the construction of a new high-end HDI factory, expected to produce 800,000 square meters of high-end HDI by mid-2026 [1][2] Market Demand and Feasibility - The expansion is driven by the high demand for high-end PCBs, particularly in AI servers and high-speed network infrastructure, with a projected compound annual growth rate of 15.7% for multilayer boards with 18 layers or more from 2024 to 2029 [1][3] - The company has over 30 years of experience in PCB manufacturing and has established a solid technical foundation and customer base at the Zhuhai Jinwan base, ensuring the feasibility of the expansion project [2][3] Strategic Alignment - The investment aligns with national industrial policies and meets the long-term, high-standard demand for high-end PCBs in emerging fields, enhancing the company's competitive advantage in high-end products [3][4] - The project supports the company's strategy to focus on AI and expand its second growth curve, aiming to increase the proportion of high-end products in its portfolio [3][4] Financial Position - As of March 31, 2025, the company reported a revenue of 3.343 billion RMB, with a net cash flow compound growth rate of 21.34%, indicating a strong financial position to support the investment [5] - The funding will come from self-owned or self-raised funds, and the company plans to optimize its capital structure and financing costs to ensure sufficient funds for the project [5]

Core Viewpoint - Company plans to invest 5 billion yuan in the expansion project at Zhuhai Jinwan base, focusing on high-growth areas such as AI computing power, high-speed network communication, and automotive intelligence [1][3] Group 1: Investment and Project Details - The total investment for the expansion project is estimated at 5 billion yuan, with a post-tax investment payback period of approximately 7.5 years, including the construction period from 2025 to 2027 [1] - The expansion will be implemented in phases based on market demand and business progress [1] - The project aims to enhance production capacity for high-end PCBs, particularly in AI computing, high-speed networking, and automotive intelligence [1][3] Group 2: Market Trends and Demand - Recent technological breakthroughs in large models and generative AI have driven significant innovation in technology hardware, leading to a high demand for high-end PCBs [1] - Prismark forecasts a compound annual growth rate of 15.7% for multilayer boards with 18 layers or more and 6.4% for HDI from 2024 to 2029, driven by AI server and high-speed network infrastructure [1] - The high-end PCB market is expected to grow due to increasing requirements for advanced technology and higher product value, while competition in ordinary products is intensifying [1] Group 3: Strategic Alignment and Future Outlook - The expansion project aligns with national industrial policies and industry development trends, addressing the long-term and high-standard demand for high-end PCBs in emerging fields [3] - The company aims to enhance its technological innovation capabilities and increase the proportion of high-end products, focusing on AI to create a second growth curve [3] - The expansion is expected to improve the company's economic efficiency, expand operational scale, and strengthen its competitive advantage in high-end products [3]

Core Viewpoint - The company announced a 5 billion yuan expansion investment plan for the Zhuhai Jinwan base, focusing on enhancing production capacity for high-end HDI, HLC, and SLP products in AI computing, high-speed network communication, automotive intelligence, and AI edge applications [1] Group 1: Investment and Expansion - The investment plan includes technical upgrades to existing facilities, new AI server HDI production lines, and the construction of a new high-end HDI factory [1] - The expansion aims to integrate resources at the Zhuhai Jinwan base and strengthen the company's manufacturing capabilities for high-end products [1] - The construction period for the expansion is set from 2025 to 2027 [1] Group 2: Market Demand and Capacity - There is a projected rapid growth in demand for high-layer boards and high-end HDI thick boards in the AI server market, with current high-end capacity being relatively tight [1] - The company is expected to make significant progress in high-end product technology for core computing clients both domestically and internationally [1] - The existing production capacity at the Zhuhai Jinwan factory includes 1.2 million square meters of high-layer boards and 300,000 square meters of HDI/SLP boards [1] Group 3: Financial Outlook - The company maintains previous revenue forecasts for 2025-2027, with expectations of increased orders from North American clients due to the accelerated investment in AI PCB capacity [2] - The company is well-positioned in various downstream application fields, with ongoing product introductions in data communication and automotive sectors [2] - The upgrade of high-end computing capacity is anticipated to open up long-term performance and valuation growth opportunities for the company [2]

Group 1 - The core investment plan for the Zhuhai Jinwan base involves a total investment of RMB 5 billion, with a tax return period of approximately 7.5 years, including the construction period from 2025 to 2027 [1] - The investment includes RMB 1 billion for targeted technological upgrades in high-layer factories and the addition of advanced HDI production lines for AI servers, aimed at overcoming existing production bottlenecks and enhancing technical capabilities, expected to be completed in the second half of 2025 [1] - A planned investment of RMB 3.2 billion for a new high-end HDI factory is expected to achieve an annual production capacity of 800,000 square meters, with construction starting in the second half of 2025 and production commencing in mid-2026 [1] Group 2 - The market for high-end PCBs is projected to grow significantly, driven by advancements in AI servers and high-speed network infrastructure, with a compound annual growth rate of 15.7% for multilayer boards over 18 layers and 6.4% for HDI from 2024 to 2029 [2] - The company has over 30 years of experience in PCB manufacturing and is recognized as a national high-tech enterprise, providing a solid technical foundation for the successful implementation of the expansion project [2] - The expansion aligns with national industrial policies and industry trends, addressing the long-term demand for high-end PCBs in emerging fields, while enhancing the company's production capacity for advanced HDI, SLP, and HLC products [2]

Investment Rating - The report maintains a "Strong Buy" rating for the company [3][7]. Core Views - The company announced a 5 billion yuan expansion investment plan at its Zhuhai Jinwan base, focusing on enhancing AI PCB production capacity in high-end applications such as AI computing, high-speed network communication, and automotive intelligence [1][7]. - The expansion aims to integrate resources at the Jinwan base, improve manufacturing capabilities for high-end products, and accelerate the company's product layout in high-end HDI, HLC, and SLP products [1][7]. - The construction period for the expansion is set from 2025 to 2027, with expectations of increased production capacity and technological capabilities to meet customer demands in various high-end sectors [1][7]. Financial Data and Valuation - Total revenue is projected to grow from 10,757 million yuan in 2023 to 21,152 million yuan in 2027, with a compound annual growth rate (CAGR) of approximately 18% [2][15]. - Operating profit is expected to increase from 1,052 million yuan in 2023 to 2,519 million yuan in 2027, reflecting a growth rate of 22% in the later years [2][15]. - Net profit attributable to shareholders is forecasted to rise from 936 million yuan in 2023 to 2,230 million yuan in 2027, with a similar growth trajectory [2][15]. - Earnings per share (EPS) are anticipated to grow from 0.99 yuan in 2023 to 2.36 yuan in 2027, indicating a strong upward trend in profitability [2][15]. Market Performance - The current stock price is 54.18 yuan, with a total market capitalization of 51.1 billion yuan [3]. - The company has shown a strong performance over the past 12 months, with a 134% increase in absolute performance [5]. Future Outlook - The report projects that the company will benefit from the increasing demand for high-end multi-layer boards and HDI products, particularly in the AI server market [7]. - The expansion investment is expected to solidify the company's position in the high-end PCB market, especially for clients in North America and the ASIC field [7]. - The company is well-positioned for long-term growth due to its broad application areas, strong management capabilities, and ongoing product introductions in the data communication and automotive sectors [7].

Core Viewpoint - The company plans to invest a total of RMB 5 billion in the expansion of its Zhuhai Jinwan base to enhance its production capacity and technological capabilities in high-end products, particularly in AI computing, high-speed network communication, and automotive intelligence applications [2][4][12]. Group 1: Investment Overview - The investment project is named the Zhuhai Jinwan Base Expansion Project [6]. - The total investment amount is estimated at RMB 5 billion, with funding sourced from self-owned or self-raised funds [2][11]. - The project aims to upgrade existing factory technology, increase production capacity, and construct new facilities to meet high-end product demands [4][9]. Group 2: Project Details - The project will be implemented by Jingwang Electronics Technology (Zhuhai) Co., Ltd. [8]. - The construction location is at the Zhuhai Jinwan Base Park, specifically at No. 801, Nanshui Avenue, Nanshui Town, Zhuhai City [7]. - The construction period for the project is set from 2025 to 2027 [10]. Group 3: Board Approval - The investment plan was approved unanimously by the board of directors during the meeting held on August 22, 2025 [5][16]. - The decision does not involve related transactions and does not constitute a major asset restructuring as per relevant regulations [5]. Group 4: Impact on the Company - The expansion project is expected to strengthen the company's competitive advantage in high-end products and enhance its market position, ultimately contributing positively to future operational performance and profitability [12].