Combined with Tower’s multi-site global footprint, Scintil’s unique SHIP™ platform is ready to take on the challenging requirements of the next generation Hyperscale AI Infrastructure MIGDAL HAEMEK, Israel, and GRENOBLE, France, February 17, 2026 - Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, and Scintil Photonics, the technology leader in Heterogeneous Integrated Photonics for next-generation AI infrastructure, today announced availability of t ...

Summary of RoboTechnik (300757.SZ) Conference Call Company Overview - **Company Name**: RoboTechnik (300757.SZ) - **Established**: 2011 - **Initial Focus**: Photovoltaic cell manufacturing equipment - **Key Acquisition**: FiconTEC, a leader in automated assembly and testing for integrated photonics devices, in 2020, which positioned RoboTechnik in the Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) markets [2][4] Industry Insights - **Photonics Assembly and Testing**: The company is experiencing strong demand in the photonics assembly equipment sector, driven by advancements in technology such as higher speeds (800G/1.6T and above) and the transition to CPO and Optical Circuit Switching (OCS) [1][3] - **Market Growth**: Expected growth in optical transceiver shipments at a CAGR of 34% from 2026 to 2028, reaching 94 million units by 2028 [1] Key Takeaways from Management 1. **Competitive Advantages**: - In-house motion control system with high accuracy - Machine vision algorithms for rapid computation, enabling multi-axis and high-precision alignments - Process Control Monitoring (PCM) system utilizing over 20 years of data to enhance equipment performance and speed [3][4] 2. **Opportunities from CPO and OCS**: - Management is optimistic about the long-term demand for assembly and testing equipment due to the rise of CPO and OCS technologies, which cater to increasing speed requirements [4][1] 3. **Technological Development**: - The company is focused on developing new generation platforms to optimize materials and particle processing for improved yield rates [7][4] Additional Insights - **Client Demand**: There is a strong momentum in orders, indicating robust client demand for the company's offerings in the photonics sector [1] - **Strategic Positioning**: The acquisition of FiconTEC has allowed RoboTechnik to participate actively in the AI infrastructure market, enhancing its competitive positioning in the photonics assembly and testing space [2][1] This summary encapsulates the critical insights and strategic directions discussed during the conference call, highlighting RoboTechnik's growth potential and competitive advantages in the evolving photonics industry.

Core Insights - POET Technologies Inc. has announced a strategic collaboration with Sivers Semiconductors AB to develop high-performance External Light Source (ELS) modules for Co-Packaged Optics (CPO) and next-generation AI infrastructure [1][2][4] Company Collaboration - The partnership combines Sivers' high-power distributed feedback (DFB) laser technology with POET's Optical Interposer™ platform, creating a scalable and cost-optimized solution for AI clusters and hyperscale data centers [2][3] - The collaboration aims to address technical challenges in co-packaged optics, enabling efficient scaling into AI-driven markets [3][4] Market Opportunity - The AI Optical connectivity opportunity has generated over $50 billion in market value to date, with the emerging ELS market expected to contribute significantly to this figure [4] - The collaboration is projected to target an estimated annual ELS market opportunity exceeding $1 billion [4] Development Timeline - POET and Sivers plan to demonstrate early prototypes to customers in the first half of 2026, with production readiness anticipated by the end of 2026 [5]

Core Insights - Broadcom has launched its third-generation 200G per lane co-packaged optics (CPO) product line, demonstrating advancements in technology and ecosystem readiness for AI applications [1][4] - The company has established a comprehensive ecosystem of partners to support the deployment of its CPO technology, which is crucial for scaling AI infrastructure [5][7] Company Developments - Broadcom's leadership in CPO technology began with the introduction of the first-generation Tomahawk 4-Humboldt chipset in 2021, which set the foundation for subsequent innovations [2] - The second-generation Tomahawk 5-Bailly chipset became the first volume-production CPO solution, focusing on automated testing and scalable manufacturing processes [3] - The third-generation 200G/lane CPO technology is designed for high-radix scale-up and scale-out networks, addressing the demands of next-generation AI workloads [9][10] Ecosystem and Partnerships - Broadcom has announced significant partnerships with key industry players, including Corning, Delta Electronics, Foxconn Interconnect Technology, and Micas Networks, to enhance its CPO technology and support mass deployment [7][8] - These collaborations have led to advancements in fiber and connector technology, production of CPO Ethernet switches, and high-density CPO fiber cables, further solidifying the CPO ecosystem [7][8] Future Outlook - Broadcom is committed to developing a fourth-generation 400G/lane solution, continuing its leadership in delivering high bandwidth density and low power optical interconnects [4][6] - The company emphasizes the importance of open standards and system-level optimization to ensure the success and evolution of its CPO technology in hyperscale data centers [10]

Investment Rating - The report does not provide a specific investment rating for the industry or companies mentioned Core Insights - The Co-Packaged Optics (CPO) technology is expected to be a significant trend in the optical communication sector, potentially disrupting the existing value chain within the next 2-3 years [14][40] - The global switch market has shown robust growth, with a year-on-year increase of 20.1% in 2023, surpassing USD 40 billion, driven by the scaling of large language model training and data centers [20][21] - CPO shipments are projected to start with small volumes and dominate the 3.2T segment by 2028-2029, with penetration rates in the AI Data Center switch market expected to reach 2% in 2025, 22% in 2027, and 32% in 2030 [2][27] Summary by Sections CPO Technology and Market Outlook - NVIDIA is set to launch its first generation of CPO switch, Quantum 3400 X800, at the GPU Technology Conference (GTC) 2025, with mass production expected to begin in July 2025 [15][45] - Broadcom has introduced the Tomahawk 5 Bailly, a 51.2T Ethernet switch CPO product, which integrates advanced optical engines and is designed to operate at significantly lower power consumption [3][47] - The report estimates that CPO switch penetration in the AI Data Center switch market could reach 2% in 2025, 22% in 2027, and 32% in 2030, indicating a growing acceptance of this technology [27][28] Key Players and Developments - Major players in the CPO market include NVIDIA, Broadcom, and TSMC, with each company making significant advancements in CPO technology [3][41] - Chinese companies such as Suzhou TFC and Accelink are also positioned to benefit from the CPO trend, focusing on optical component manufacturing [4][56] - The report highlights that the integration of optical and electronic components through CPO technology can lead to reduced costs and power consumption, enhancing overall system performance [36][38] AI Applications and Market Dynamics - OpenAI's ChatGPT continues to lead in global AI applications, with a daily active user count fluctuating between 60-63 million, while DeepSeek has emerged as a leading app in China's generative AI market with a DAU of 49 million [5][62] - The competitive landscape in AI applications is evolving, with new models like OpenAI's GPT-4.5 and Alibaba's QwQ-32B being introduced, showcasing advancements in performance and efficiency [10][79] - The report notes that the global AI market is experiencing sustained growth, particularly in China, driven by increasing user engagement and the introduction of innovative AI solutions [60][67]