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Summary of Key Points from the Conference Call Industry Overview - The conference call discusses advancements in the semiconductor packaging industry, particularly focusing on the evolution of packaging technologies such as CoWoS (Chip-on-Wafer-on-Substrate), CoPoS (Chip-on-Panel-on-Substrate), and CoWoP (Chip-on-Wafer-on-PCB) [9][18][24]. Core Concepts and Technologies - **CCL (Copper Clad Laminate)** is identified as a core material for the electronics industry, essential for high-frequency and high-speed circuits, with major suppliers including TUC, EMC, Unimicron, Resonac, MGC, and Panasonic [5][6]. - **CoWoP** aims to eliminate the traditional ABF (Ajinomoto Build-up Film) package substrate, allowing direct mounting of chip and silicon interposer modules onto high-precision PCBs, theoretically offering shorter signal paths and improved thermal management [10][25][30]. - **Technical Challenges**: CoWoP faces significant challenges, including the need for PCB precision below 10 μm, thermo-mechanical reliability issues, and manufacturing yield challenges [12][29][30]. Market Dynamics - The demand for high-end CCL and PCB materials is rising sharply due to the expansion of AI accelerators and data center computing needs, with a notable shift from M7-grade to M8 and M9-grade materials [74][76][81]. - NVIDIA's next-generation Rubin platform and Google's chip are expected to adopt M9-grade CCL, indicating a significant increase in material costs associated with advanced AI computing platforms [77][80]. Future Outlook - CoWoP is not expected to enter mass production in the near term, with industry consensus suggesting that NVIDIA will continue to rely on a mix of CoWoS and CoPoS solutions for product reliability and supply stability [13][26][37]. - The transition to CoWoP may require one to two more product generations before it can reshape the packaging models and supply chain ecosystem for high-performance computing and AI servers [14][28]. Key Suppliers and Innovations - **Mitsui Mining** is highlighted as a dominant supplier of ultra-thin copper foil, critical for SLP and CoWoP applications, with the market entering a high-growth phase due to increasing demand from AI and HPC sectors [41][55]. - **Shin-Etsu Chemical** has developed innovative equipment and methods for advanced packaging substrates, aiming to enhance production capabilities for next-generation chiplet and high-frequency packaging [66][70]. Material Specifications - The specifications for high-speed PCB materials are becoming increasingly stringent, with targets for dielectric constant (Dk) ≤ 3.3 and dissipation factor (Df) ≤ 0.005 to minimize signal loss and ensure impedance stability [48][49]. - Electronic-grade glass fiber fabric is emphasized as a critical reinforcement material for CCL, playing a vital role in ensuring signal integrity and power integrity in high-performance applications [82][86]. Conclusion - The semiconductor packaging industry is undergoing significant transformations driven by advancements in technologies like CoWoP, with increasing demands for high-performance materials and innovative manufacturing processes shaping the future landscape of AI and HPC systems [22][73].