Group 1 - The company aims to establish an integrated capability of "PCB - semiconductor - packaging" with automotive electronics as the foundation, focusing on high integration modular products [1] - In the first half of the year, the company achieved operating revenue of 2.579 billion yuan, a year-on-year increase of 7.64%, and a net profit attributable to shareholders of 384 million yuan, a year-on-year increase of 26.89% [1] - The PCB industry is experiencing high prosperity, with the company holding significant advantages in the automotive PCB sector while also expanding into AI, humanoid robots, low-altitude aircraft, AI smart glasses, and energy storage products [1] Group 2 - The deep integration of PCB and advanced packaging has become a core trend in the industry, addressing the dual challenges of "speed enhancement" and "power optimization" [2] - The company plans to invest 1.5 billion yuan to build a new generation PCB manufacturing base, producing embedded chip PCBs and enhancing high-end HDI product capacity [2] - The embedded PCB packaging technology is a semiconductor packaging technology that breaks through the physical boundaries of existing PCBs, integrating upstream and downstream value chains [2]