Core Insights - The electronic circuit and semiconductor industry is at a critical juncture driven by explosive growth in AI large models and global supply chain restructuring, with a 30-fold increase in computing core numbers over the past decade, while memory bandwidth growth is less than 1/5, leading to storage bottlenecks and material iteration challenges [1] Group 1: Storage Technology Breakthrough - Storage is viewed as the "reservoir" of AI computing power, with breakthroughs in technology directly impacting the efficiency of power release [3] - The forum will focus on three major technological directions: traditional storage upgrades, emerging storage implementations, and RV technology integration [3] Group 2: Material Innovation - Material innovation is the underlying logic for upgrading the semiconductor industry, with the forum addressing core material breakthroughs [4] - Key topics include advancements in AMB copper-clad ceramic substrates, third-generation semiconductors like SiC and GaN, and PCB material breakthroughs to meet high-density demands [5] Group 3: Digital Transformation and Intelligent Manufacturing - The forum will explore the application of AI technology across the entire PCB design, production, and testing process, enhancing defect recognition and production efficiency [5] - Discussions will include AI-based dynamic adjustments of key process parameters and the design logic of AI scheduling systems for flexible manufacturing [5] Group 4: Advanced Packaging and EDA Tools - Advanced packaging and EDA tools are becoming critical for breakthroughs in computing power, with a focus on system-level packaging (SiP) and Chiplet technology integration [7] - The forum will analyze the collaborative mechanisms between academia, research institutions, and enterprises to accelerate the industrialization of innovative results [11] Group 5: Forum Details - The "AI-Driven, Smart Chain Future: 2025 Electronic Circuit and Semiconductor Industry Innovation Forum" will take place on October 28, 2025, at the Shenzhen International Convention and Exhibition Center [10] - The forum will cover topics such as AI + PCB intelligent manufacturing, EDA technology breakthroughs, and the localization of AI computing chips [10]