Core Insights - The article emphasizes that AI is currently the strongest engine driving the technology industry, with significant demand for hardware and complex applications expected to grow by 2026 [1] Group 1: AI Development Trends - The demand for speed and power efficiency in AI will drive the introduction of new technologies and materials, focusing on improving power efficiency through high-voltage direct current (HVDC) and utilizing light for data transmission [1][2] - The industry will see advancements in semiconductor technology, particularly in packaging techniques like Panel-Level Packaging (PLP) to reduce costs and improve efficiency [3][4] Group 2: Material and Technology Opportunities - New materials such as ceramic substrates and negative thermal expansion fillers are becoming viable due to the high costs associated with AI chips, which are now justifiable given their high market prices [4] - Innovations like micro channels for cooling solutions are being explored to enhance heat dissipation efficiency, which is critical for high-performance AI chips [4] Group 3: Structural Changes in Industries - Taiwanese suppliers are gaining traction in the semiconductor supply chain due to their quick response times compared to traditional Japanese suppliers, which is crucial in the fast-paced AI market [5][6] - The printed circuit board (PCB) and testing industries are experiencing structural changes, with increased demand for high-density interconnects and early-stage testing to prevent costly failures in expensive components [6][7] Group 4: Future of Robotics and Edge AI - Robotics and edge computing are anticipated to be significant trends, although substantial advancements may not be seen until 2027 or 2028 [8] - The integration of AI with traditional mechanical components presents a long-term opportunity for Taiwan's mechanical industry to upgrade and innovate [8]