Core Viewpoint - The 9th China System-Level Packaging Conference (SiP China 2025) focuses on advanced packaging, Chiplet technology, and heterogeneous integration in the context of AI, aiming to explore the trends and innovations in these areas [2][19]. Event Details - The conference will take place from August 26 to 28, 2025, at the Shenzhen Convention Center, Hall 1, Meeting Room ③ [2]. - The theme is "Intelligent Gathering of Chip Energy, Heterogeneous Interconnection - Advanced Packaging and Chiplet Ecological Innovation in the AI Era" [2]. Main Forum Agenda - The main forum on August 26 will cover macro trends and ecosystem building, featuring key speakers from various semiconductor companies [6]. - Topics include new trends in edge AI, challenges in optical packaging technology, and solutions for enhancing AI server efficiency [6][9]. Technical Forums - Technical forums will be held on August 26 and 27, focusing on design innovation, application implementation, and AI-driven Chiplet advanced packaging [10][12]. - Discussions will include 3DIC design methodologies, advanced packaging solutions for high-performance computing, and the integration of EDA solutions [8][12]. Notable Speakers and Topics - The conference will feature prominent figures from leading semiconductor companies and AI chip design experts, discussing high bandwidth memory (HBM), Chiplet heterogeneous integration, and system-level packaging [19]. - Key topics will address the explosive demand for AI computing power and share the latest practices and breakthrough paths in the industry [19].