Group 1 - The core viewpoint is that the semiconductor industry is expected to experience a comprehensive recovery by 2025, with an improved competitive landscape and sustained profit recovery for related companies [1] - The SW electronic index increased by 1.65% over the past week (August 4-8), outperforming the CSI 300 index by 0.42 percentage points, with sub-sectors showing varied performance [1] - Recommendations for investment focus on semiconductor design companies with low PE/PEG ratios and real performance, including Zhongke Lanyun, Juxin Technology, Meixin Sheng, and Nanchip Technology [1] Group 2 - The CoWoP technology is emerging as the next-generation chip packaging solution, evolving from the current CoWoS technology, which is expected to benefit PCB manufacturing, material supply, and equipment sectors [2][4] - CoWoS technology, led by TSMC, addresses bandwidth and energy efficiency limitations, with a projected monthly capacity increase from 35,000-40,000 wafers in 2024 to 70,000-80,000 wafers in 2025 [3] - CoWoP's design eliminates the ABF substrate, enhancing power efficiency and heat dissipation, which is expected to create opportunities for PCB manufacturers and material suppliers [4]