Core Viewpoint - The Chinese Academy of Sciences Microelectronics Research Institute has announced procurement intentions for 10 types of instruments and equipment, with a total budget of 119 million yuan, scheduled for procurement between June and November 2025 [2][3]. Procurement Overview - The procurement includes advanced semiconductor manufacturing equipment such as: - 8-inch chemical pure gas high selectivity isotropic etching equipment - 3D integrated packaging structure function analyzer - Critical dimension measurement equipment - High-precision scanning electron microscope [3][4][5][6]. Instrument Descriptions - **Imaging-Based Overlay Measurement Tool**: A key detection device in semiconductor manufacturing for high-precision measurement of overlay errors, essential for aligning multi-layer micro-nano structures on chips. It is becoming a mainstream solution due to its high resolution and non-contact characteristics as feature sizes shrink to below 5 nm [4]. - **3D Integrated Packaging Structure Function Analyzer**: A multifunctional, high-precision, non-destructive analysis system for 3D integrated packaging structures, crucial for manufacturing, reliability testing, and failure analysis. It addresses the high demands of complex structures in advanced packaging technologies [5]. - **Diffraction-Based Overlay Measurement Tool**: An advanced technology for high-precision measurement of overlay errors in semiconductor manufacturing, utilizing diffraction patterns to achieve sub-nanometer precision [6]. Budget and Procurement Timeline - The total budget for the procurement is 119 million yuan, with specific allocations for each type of equipment. The procurement is expected to occur from June to November 2025 [2][3][8].