导读： 近日，中国科学院微电子研究所发布多批政府采购意向，仪器信息网特对其中的仪器设备品目进行梳理，统计出10项仪器设备 采购意向，预算总额达1.19亿元。 特别提示 微信机制调整，点击顶部"仪器信息网" → 右上方"…" → 设为 ★ 星标，否则很可能无法看到我们的推送。 近日， 中国科学院微电子研究所发布 1 0 项仪器设备采购意向，预算总额达 1 . 1 9 亿 元，涉及8吋化学纯气态高选择性 各向同性刻蚀设备、三维集成封装结构函数分析仪 、关键尺寸量测设备、高精度扫描电子显微镜 等，预计采购时间为 2 0 2 5 年 6~11 月。 部分采购仪器介绍： 中国科学院微电子研究所 2 0 2 5 年 6 ~ 11 月仪器设备采购 意向汇总表 影像型套刻偏差量测仪 影像型套刻偏差量测仪（Ima g i n g -Ba s e d Ov e rl a y Me a s u r eme n t To o l）是半导体制造工艺中的关键检测设备，用于高 精度测量光刻层与前一层之间的对准误差（即"套刻偏差"，Ov e rl a y Err o r），确保多层微纳结构在芯片上精确对齐。 随着集成电路特征尺寸不断缩小（进 ...

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 随着半导体工艺逼近物理极限，集成电路产业正加速向"超越摩尔"时代跃迁，芯片功率密度与发热量剧 增。5G、AI、HPC、数据中心等新兴领域对高效热管理技术提出迫切需求。先进封装与热管理技术成为 突破算力瓶颈、应对高功率密度挑战的核心引擎。基于此，启明产链将于 9月25-26日在江苏苏州举 办"2025先进封装及热管理大会" 。 本次大会由国家第三代半导体技术创新中心（苏州） 梁剑波教授担任大会主席，甬江实验室作为支持单 位， 目前已有19家单位确认演讲： 中国科学院化学研究所/甬江实验室/ 浙江大学绍兴研究院/哈尔滨工 业大学/中山大学/芯和半导体/青禾晶元/ 齐力半导体/ 芯力半导体/中国科学院深圳先进技术研究院/中 国科学院宁波材料技术与工程研究所。 01 INTRODUCTION 大会概况 2025先进封装及热管理大会聚焦高算力热管理挑战，设置 先进封装与异质异构论坛、高算力热管理创新 论坛、液冷技术与市场应用论坛三大板块， 围绕chiplet、2.5D/3D等先进封装技术、以及热界面材料、 碳基（金 ...

Core Viewpoint - The article discusses the evolution and significance of integrated circuit (IC) packaging in the semiconductor manufacturing process, highlighting the transition from 2D to 2.5D and 3D IC architectures as essential innovations to meet the increasing demands for performance and efficiency in modern electronic devices [2][11][29]. Summary by Sections IC Packaging Overview - IC packaging is a critical step in semiconductor manufacturing, providing protection and functionality to semiconductor chips [2][4]. - The packaging process involves placing fragile semiconductor chips into protective casings, similar to placing a cake in a sturdy box for transport [4][6]. Transition from 2D to 2.5D and 3D IC - The semiconductor industry is moving towards innovative packaging technologies like 2.5D and 3D IC to overcome limitations posed by traditional 2D packaging, especially as Moore's Law slows down [11][27]. - 2.5D IC involves placing chips side by side on an interposer, while 3D IC stacks chips vertically, enhancing integration density and performance [13][25]. Advantages and Challenges of 2.5D and 3D IC - 2.5D IC allows for moderate design complexity and easier thermal management, making it suitable for applications like GPUs and FPGAs [19][28]. - 3D IC offers very high integration density and reduced signal transmission distance, but faces challenges in cooling and design complexity [25][28]. - Both architectures aim to improve performance, reduce power consumption, and minimize space, essential for mobile and edge devices [27][29]. Market Outlook - The advanced chip packaging market is projected to grow from $3.5 billion in 2023 to over $10 billion by 2030, driven by demand in AI, 5G, high-performance computing (HPC), and automotive sectors [27][29].

Group 1 - Glass substrates are characterized by high transparency, excellent flatness, and good stability, serving as a support carrier to ensure the reliable fixation of functional materials and the overall stability and lifespan of devices [1][2] - The global advanced packaging market is projected to grow from $28.8 billion in 2019 to $42.5 billion by 2024, indicating a rising penetration rate [1][13] - The introduction of glass substrates can reduce capacitance between interconnections, leading to faster signal transmission and improved overall performance, particularly in data centers, telecommunications, and high-performance computing applications [1][15] Group 2 - The glass substrate industry chain includes key segments such as raw materials, equipment, technology, production, packaging testing, and applications, with special glass materials being crucial for semiconductor manufacturing [6] - The TGV (Through Glass Via) technology is a core technique for glass substrate packaging, enabling vertical electrical interconnections and addressing challenges associated with traditional TSV technology [19][20] - The glass substrate market is expected to reach over $400 million by 2030, with a penetration rate exceeding 2%, although organic substrates will continue to dominate the semiconductor packaging field in the near term [15][17] Group 3 - The glass substrate technology is anticipated to play a significant role in the semiconductor industry, with ongoing advancements focusing on process optimization, improving via precision and density, and expanding the functional applications of glass substrates [25] - The global semiconductor market is projected to reach $635.1 billion in 2024, reflecting a 19.8% year-on-year growth, driven by the increasing demand for high-performance semiconductor products [9]

Core Insights - Dongguan has launched its first strategic scientist team, achieving significant technological advancements in semiconductor and AI chip development, including the international first TGV 3.0 technology and the world's first low-power AI chip [1][2][4]. Group 1: Technological Innovations - The TGV 3.0 technology has overcome production bottlenecks, achieving sub-10 micron through-hole and a 10:1 aspect ratio, with a through-hole yield of 99.9%, enhancing 3D packaging solutions [4]. - The world's first "energy-aware computing" low-power AI chip operates at only 70mW with a processing power of 512 GOPS, suitable for AIoT and edge computing applications [4]. - The first PLP plasma etching equipment in the country supports large glass substrates and achieves international advanced levels in etching rate and uniformity [4]. - The first fully automated AI-AOI detection equipment offers precision detection at 0.001 microns with an accuracy exceeding 99%, filling a gap in high-end semiconductor testing equipment in China [4]. Group 2: Strategic Development - Dongguan's strategic scientist team, led by Professor Yang Xiaobo, focuses on advanced packaging and low-power AI chips, addressing critical technological challenges in the semiconductor industry [3][4]. - The city aims to transition from "Dongguan manufacturing" to "Dongguan intelligent manufacturing," leveraging its manufacturing base to enhance its technological capabilities [5]. - Dongguan has established a complete industrial chain in semiconductor and integrated circuit sectors, with 257 semiconductor companies and projected industry revenue exceeding 75 billion yuan in 2024 [6]. Group 3: Talent and Policy Support - The local government is optimizing talent policies to attract high-level scientific talent, supporting innovation and entrepreneurship through strategic scientist teams and research initiatives [8][12]. - The Dongguan Integrated Circuit Innovation Center aims to enhance technological innovation capabilities and strengthen the industrial ecosystem, focusing on the transformation of scientific achievements into industrial applications [8][12]. - The collaboration between research teams, the innovation center, and local government is noted for its efficiency and responsiveness, fostering a supportive environment for startups [11].