Core Viewpoint - Jie Mei Technology has highlighted its strong technical foundation in low roughness MLCC release films, which aligns well with the performance requirements of HVLP copper foil and PCB carrier copper foil [1] Group 1: Company Insights - Jie Mei Technology is currently in the process of evaluating the performance of HVLP copper foil, which has entered the sample submission phase for South Korea's Doosan [1] - The testing cycle for the new product samples depends on the evaluation results from the customers [1] Group 2: Industry Context - Roushen Technology has mastered the large-scale preparation technology for ultra-thin film materials, with extensive experience in copper vapor deposition, magnetron sputtering, and electroplating [1]

Core Viewpoint - Jie Mei Technology (002859) is leveraging its expertise in low roughness MLCC release films to meet the performance requirements of HVLP copper foil and PCB carrier copper foil, while collaborating with Youzhen Technology, which has advanced thin film material preparation technology [1] Group 1: Company Insights - Jie Mei Technology has a strong technical foundation in low roughness MLCC release films, aligning well with the performance needs of HVLP copper foil and PCB carrier copper foil [1] - Youzhen Technology possesses extensive experience in copper deposition techniques such as evaporation, magnetron sputtering, and electroplating, which enhances its product offerings [1] Group 2: Product Development and Capacity - Youzhen Technology's HVLP copper foil has been sent for sampling to South Korea's Doosan, with the testing cycle dependent on customer evaluation results [1] - The designed annual production capacity for Youzhen Technology's copper foil products is 5 million square meters, and the delivery cycle for related production equipment is short, indicating a potential for rapid expansion [1]