Core Viewpoint - Jiangsu Xinde Semiconductor Technology Co., Ltd. has submitted its listing application to the Hong Kong Stock Exchange, with Huatai International as the sole sponsor [1] Company Overview - Xinde Semiconductor is a provider of semiconductor packaging and testing solutions, focusing on developing packaging designs, custom packaging products, and testing services [3] - The company is one of the first in China to possess advanced packaging technology capabilities, which are crucial for enhancing chip performance and efficiency in the post-Moore's Law era [3][4] - Since its establishment in September 2020, the company has accumulated extensive experience in advanced packaging and has mass production capabilities covering various technologies such as QFN, BGA, LGA, WLP, and 2.5D/3D [3] Technology and Innovation - The company has invested in continuous technological innovation, holding a significant intellectual property portfolio with 211 patents in China, including 32 invention patents and 179 utility model patents [4][5] - The OSAT (Outsourced Semiconductor Assembly and Test) model allows the company to focus resources on packaging design, production, and testing services, providing flexibility to adapt to market changes [5] Financial Performance - The company reported revenues of approximately RMB 269.4 million, RMB 509.1 million, RMB 827.4 million, and RMB 475 million for the six months ending June 30 in 2022, 2023, 2024, and 2025, respectively [6] - The company incurred losses of approximately RMB 360.3 million, RMB 358.9 million, RMB 376.6 million, and RMB 218.6 million for the same periods [6]