点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 | 领域 | 重点方向 | 重点关注的新材料 | 重点关注的新技术 | | --- | --- | --- | --- | | 新一代信息技术 先进计算与存储 | | · 二维半导体材料(石壁烯、金屋型碳纳米 | · 异质异构集成技术 | | | | 管、过渡金属二硫族化合物等) | | | | | · 虽子计算材料(超导材料、拓扑量子材料 | · 后摩尔时代芯片工艺 | | | | 、硅自旋量子比特材料等） | | | | | · 新型存储介质(氧化物半导体、纤锌矿铁 · 三维内存工艺(薄膜沉积、刻蚀, | | | | 电材料等) | | 键台等) | | | 册 | · 宽/超宽禁带半导体(氮化家、金刚石 | · F6G光通信器件技术(激光器、调 制器、放大器) | | 通信及网络 | | • 高极化铁电材料、低损耗天线材料、可调 ，芯片出光及全光互连技术 潍坊礼、压由/经则器材料 谐材料、压电/探测器材料 | | | | | · 光通信材料(SOl村底、铜酸锂晶棒, | · 微秒级电光交换技术 | ...

今年是"十五五"开局之年，全市锚定加快建设国家中心城市，全力打造"五个中心"，全面建设现代化大武汉目标，聚力冲刺开门红。 元旦假期，长江日报记者探访武汉科技创新、先进制造、民生保障等领域一批重大项目，火热的建设、投产现场，无一不展现出武汉高质 量发展生机勃勃的良好态势。 湖北江城实验室主任杨道虹介绍，先进封装是高性能算力芯片、硅光芯片、感存算一体芯片等高端芯片的核心技术，不仅能补强武汉 集成电路产业链短板，更将带动整体产业规模跃升。正在加快建设的二期项目，将打造国内高端芯片先进封装量产线，推动中试成果直接 导入产业化，构建"基础研究—概念验证—研发—小试—中试—产业化"全链条创新闭环。 未来，该项目将与人工智能芯片、光芯片等创新载体联动，预计10年内吸引超100家上下游团队落户光谷。此外，紧邻未来科技城生 态绿心九龙湖，江城实验室产业园正处于施工准备的最后冲刺阶段。这一系列布局将进一步增强武汉在集成电路先进封装领域的创新策源 与产业化能力，助力武汉在"十五五"期间向"世界存储之都"加速迈进。 编辑：代婧怡 先进封装综合实验平台上，江城实验室工程师正在分析实验数据 1月2日，位于武汉东湖高新区光谷一路的先进封装 ...

随着摩尔定律趋近物理极限，异构集成已成为提升芯片系统性能、功能与集成度的核心路 径。而在这一技术演进中， 玻璃基板正从一种备选材料，迅速崛起为支撑下一代高密度、高 性能、多功能集成的 "关键路径"平台 。 玻璃基板作为具备高平整度、低热膨胀系数、低介电损耗及优异机械与化学稳定性的核心半 导体关键材料，已从传统显示领域核心应用，全面拓展至先进半导体封装、 MEMS 与传感 器、AI 高性能计算、5G/6G 射频通信、光电子集成及功率半导体等领域的核心赛道。 "宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 添加文末微信，加 电子玻璃 群 依托玻璃通孔（ TGV）等核心技术实现芯片高密度异构集成与互连升级，是后摩尔时代突破 芯片性能瓶颈、支撑半导体产业技术迭代的战略性基础材料，其应用边界与市场渗透率正持 续扩容，成为半导体材料领域的重要发展方向。 要将玻璃的理论优势转化为可靠的量产产品，传统加工技术因应力、微裂纹和精度限制而面 临挑战 ，为此势银网络研讨会有幸邀请到了来自 乐普科（上海）光电有限公司 的 EQ&WQ 部门经理 李建先生 和 RENA Technologies Gm ...

如果您希望可以时常见面，欢迎标星收藏哦~ 过去十年，算力的主线始终围绕着工艺微缩、架构优化和加速器堆叠展开。但今天，三条现实约束 正在同时收紧：先进制程推进的边际收益下降、数据中心能耗与散热成为系统级瓶颈、超大规模问 题的计算复杂度，开始超出经典计算的可承受范围。在这一背景下，量子计算不再被视为"遥远的 实验室技术"，而是被纳入算力长期演进路线的一部分。 在12月20日-21日的摩尔线程首届MUSA开发者大会上，摩尔线程与量子计算领域的领先企业图灵 量子正式签署战略合作协议，在英伟达凭借NVQLink布局"量子-经典协同"方案的全球背景下，这 一动作标志着中国版"量电融合"方案也正式开始试水。 QPU 与 GPU，一场"双向奔赴"的互补 长期以来，公众对量子计算存在一种误解——认为它将全面取代经典计算。但事实恰恰相反。 "GPU是'大数据、大计算'，擅长矩阵运算和大规模并行；而QPU是'小数据、超大计算'，适合处 理NP完全问题等极端复杂的搜索与模拟。"图灵量子算法负责人在采访中这样概括两者的分工。 在 NP 类问题中，这种差异尤为明显：当问题规模进入指数爆炸区间，即便是万卡 GPU 集群，也 只能在解空间边 ...

活动期间，重大合作项目签约、未来产业成果转化基金生态共建签约、国际期刊《AIAgent》签约 发刊等活动举行。在专题报告环节，多名院士专家围绕相关前沿方向展开论述，为能源与材料领域的科 学发展与产业转化提供指引。企业界与高校的代表围绕相关主题分享实践进展。 据了解，面向未来，苏州未来产业研究院已确立"双十百"发展目标：到2035年，实现材料赋能上市 企业100家，引进10家以上企业独立研发中心和20家企业联合研发中心，培育100家先锋企业，其中10家 以上实现上市。研究院相关负责人表示，将继续通过临界点项目合作、基金投资、孵化引进等多维度集 成推进，全力助推苏州打造具有国际影响力的产业创新高地。 昨天（12月6日），2025苏州未来产业合作交流暨临界点项目推进会举办，共同探讨未来产业关键 技术突破与产业化路径。会上，苏州未来产业研究院向全球发布未来产业"揭榜挂帅"项目清单。 苏州未来产业研究院依托姑苏实验室建设，核心使命是聚焦双碳战略关键材料、后摩尔时代关键设 备等国家重大战略需求，构建"科学—技术—工程—产品—产业"融通创新生态系统，建设成为国家战略 科技力量的产业化基地与苏州材料产业创新高地。目前，未来院 ...

Core Viewpoint - The company,拓荆科技, is focused on high-end semiconductor equipment, particularly in the development and industrial application of thin film deposition equipment, which has seen significant demand in the semiconductor manufacturing sector [1][4]. Group 1: Company Performance and Product Development - The company held a performance briefing on December 4, 2025, discussing its operational results and financial metrics for Q3 2025 [1]. - The company has established industrial bases in Shenyang and Shanghai, with a production capacity exceeding 700 sets per year, and is expanding its capacity with a new factory in Shenyang [1]. - The thin film deposition product series, including PECVD, ALD, SACVD, HDPCVD, and Flowable CVD, has achieved industrial application in the storage chip manufacturing sector, with a full order book indicating strong future demand [1][4]. Group 2: Technological Advancements and Market Trends - The company is continuously expanding its thin film deposition product series and increasing production scale, with new equipment platforms and advanced processes entering mass production [2]. - The semiconductor industry is transitioning into a post-Moore era, with rapid technological iterations and the emergence of new structures and materials, driving demand for advanced semiconductor equipment [3]. - The rise in storage prices reflects strong demand in the storage chip market, which may lead to increased production capacity among manufacturers, further driving the need for advanced thin film equipment [4]. Group 3: Future Outlook - The company plans to maintain its core competitiveness through high-intensity R&D investments, focusing on thin film deposition and three-dimensional integration equipment, while expanding into new products and processes required for advanced manufacturing [3]. - The ongoing complexity in storage chip processes and structures is expected to significantly boost the demand for thin film equipment, as manufacturers seek to enhance performance with advanced materials [4].

2025浦东国际人才港论坛 集成电路产业人才论坛 将于12月6日在张江科学会堂举办 敬请期待！ 识别下方二维码 参与活动报名 03 产才报告， 为进一步促进集成电路国际人才交流与发展, 多维度探讨全球人才发展创新机遇与挑战,推动集 成电路产业高质量发展,由上海市浦东新区人才工 作局指导,上海张江高科技园区开发股份有限公司 主办,上海张江浩芯企业管理有限公司、复旦大学校 友总会集成电路行业分会承办的"2025浦东国际人 才港论坛 ·集成电路产业人才论坛"将于2025年12月 6日在上海张江科学会堂举行。 对集成电路领域人才 发展研究进行专业剖析 与数据解构,揭示行业动 向与成长路径。 时间地点 时间:2025年12月06日13:30-16:00(星期六) 地点：张江科学会堂（海科路1393号）二楼张江厅A LT 01 習演趋势， 关注产业人才吸引与 发展的新动向,呈现技术 成果落地应用的典范实 例,讲述具有启示意义的 创新历程。 02 精英共论, 融通未来 集结产业、学术与研 究领域的领军人物,展开 跨学科尖端科技的深入 探讨与理念交锋。 04 专项展区， 04 聚焦"芯"生态 14:15-14:30 光计算如 ...

Group 1 - The core viewpoint of the article emphasizes the transition of the integrated circuit industry from traditional transistor scaling to system-level integration and architecture innovation, particularly highlighting the importance of advanced packaging and testing in enhancing chip performance and optimizing system power consumption [2][4][9]. Group 2 - The integrated circuit manufacturing industry consists of three main segments: chip design, wafer manufacturing, and packaging testing, with packaging testing further divided into packaging and testing processes [4][6]. - Advanced packaging is a critical aspect of modern integrated circuit manufacturing, focusing on enhancing functionality density and system-level optimization, distinguishing itself from traditional packaging methods [9][11]. Group 3 - The global integrated circuit packaging and testing industry has shifted from its early development in Europe and the United States to emerging markets in Asia, with Taiwan, mainland China, and the United States forming a triad in the current market landscape [14][16]. - The market size of the global integrated circuit packaging and testing industry is projected to grow from $55.46 billion in 2019 to $101.47 billion in 2024, with a compound annual growth rate (CAGR) of 12.8% [16]. - The advanced packaging market is expected to grow at a CAGR of 10.6% from 2024 to 2029, significantly outpacing the traditional packaging market's 2.1% CAGR [17]. Group 4 - In mainland China, major players in the integrated circuit packaging and testing industry include Longsys Technology, Tongfu Microelectronics, and Huatian Technology, with a market size projected to grow from ¥234.98 billion in 2019 to ¥331.90 billion in 2024, reflecting a CAGR of 7.2% [20][22]. - The advanced packaging market in mainland China is expected to grow at a CAGR of 14.4% from 2024 to 2029, with its market share reaching 22.9% by 2029 [22]. Group 5 - The global advanced packaging industry includes participants from both wafer manufacturing and packaging backgrounds, with significant growth driven by the demand for high-performance computing applications such as artificial intelligence and data centers [24][25]. - The market for Flip Chip (FC) packaging is projected to grow from $18.75 billion in 2019 to $26.97 billion in 2024, with a CAGR of 7.5% [28]. - Chiplet integration packaging is identified as a key growth area, with its market size expected to increase from $2.49 billion in 2019 to $8.18 billion in 2024, reflecting a remarkable CAGR of 26.9% [29]. Group 6 - The advanced packaging technology is widely applied across various sectors, including consumer electronics, mobile communications, and high-performance computing, with significant growth driven by the demand for advanced packaging in smartphones and AI applications [34][42]. - The global computing power is expected to grow from 309.0 EFlops in 2019 to 2,207.0 EFlops in 2024, with a CAGR of 48.2% [36]. Group 7 - The article outlines several trends in the integrated circuit advanced packaging and testing industry, including the acceleration of domestic substitution, the rise of chiplet integration packaging, and the increasing importance of industry chain collaboration [48][50][51]. - The value of advanced packaging is expected to continue rising, driven by the shift towards high-performance applications in AI and data centers [52].

Core Viewpoint - The semiconductor market is experiencing robust growth driven by emerging technologies such as AI, 5G, IoT, and automotive electronics, leading to a strong demand for high-performance, low-power chips [1] Industry Overview - The global semiconductor packaging and testing market is projected to grow from 649.4 billion RMB in 2024 to 933 billion RMB by 2029, with a compound annual growth rate (CAGR) of 7.5% [1] - The trend of vertical specialization is deepening within the industry, with more companies adopting a fabless model to focus on complex chip design while outsourcing manufacturing and testing [1] Company Profile - Jiangsu Xinde Semiconductor Technology Co., Ltd. (Xinde Semiconductor) was established in September 2020 and has accumulated significant experience in packaging technology, covering advanced packaging capabilities such as QFN, BGA, LGA, WLP, and 2.5D/3D [2] - Xinde Semiconductor has received recognition from several well-known clients, contributing to its revenue growth, although its profitability remains a concern as it seeks to enter the capital market [2] Financial Performance - Xinde Semiconductor's revenue has shown rapid growth, with figures of 269 million RMB in 2022, 509 million RMB in 2023, and a projected 827 million RMB in 2024, reflecting a strong upward trend [3] - For the first half of this year, the company reported revenue of 475 million RMB, a year-on-year increase of 20% [3] - The majority of Xinde Semiconductor's revenue comes from packaging products and testing services, which accounted for over 99% during the reporting period [4] Revenue Breakdown - The revenue from QFN and BGA products has consistently been the largest, with their respective shares being 31.1% and 31.8% in the first half of 2025 [4] - The company has seen an increase in revenue from LGA and WLP products, with their shares rising from 17.9% and 10.6% in 2022 to 20.1% and 17% in the first half of 2025 [4] Market Position - Xinde Semiconductor ranks seventh in the Chinese general-purpose semiconductor OSAT market, with a market share of approximately 0.6% as of 2024 [8] - The company is one of the few providers in China that has integrated all advanced packaging technologies, positioning itself for growth despite being a newer entrant in the market [3][8] Strategic Initiatives - Xinde Semiconductor plans to strategically expand into overseas markets, targeting regions such as Taiwan, South Korea, Japan, Southeast Asia, the United States, and Germany to establish a solid business foundation [10] - The company aims to enhance its competitive edge through a comprehensive R&D strategy focused on high-performance packaging solutions and innovative technologies [9]

Core Viewpoint - The semiconductor market is experiencing robust growth driven by emerging technologies such as AI, 5G, IoT, and automotive electronics, leading to a strong demand for high-performance, low-power chips [1] Industry Overview - The global semiconductor packaging and testing market is projected to grow from 649.4 billion RMB in 2024 to 933.0 billion RMB by 2029, with a compound annual growth rate (CAGR) of 7.5% [1] - The trend towards vertical specialization in the semiconductor industry is deepening, with more companies adopting a fabless model to focus on complex chip design while outsourcing manufacturing and testing [1] Company Profile - Jiangsu Xinde Semiconductor Technology Co., Ltd. (referred to as "Xinde Semiconductor") was established in September 2020 and has accumulated extensive experience in packaging technology, covering advanced packaging capabilities such as QFN, BGA, LGA, WLP, and 2.5D/3D [2] - Xinde Semiconductor has received recognition from several well-known clients, contributing to its revenue growth [2] Financial Performance - Xinde Semiconductor's revenue has shown rapid growth, with figures of 269 million RMB in 2022, 509 million RMB in 2023, and a projected 827 million RMB in 2024, reflecting a strong upward trend [3] - For the first half of this year, the company's revenue reached 475 million RMB, a year-on-year increase of 20% [3] Revenue Structure - Over 99% of Xinde Semiconductor's revenue comes from packaging products and testing services, with QFN and BGA products being the primary revenue contributors [4] - The revenue share from LGA and WLP products has been increasing, with their respective contributions rising from 17.9% and 10.6% in 2022 to 18.2% and 18.5% in 2024 [4] Market Position - Xinde Semiconductor ranks seventh in the Chinese general-purpose semiconductor OSAT market, holding a market share of approximately 0.6% as of 2024 [8] - The company is the newest player among the top eight competitors in this field, which collectively dominate over 50% of the market share [8] R&D Strategy - The company focuses on R&D as a key strategy to enhance its competitive edge, covering high-performance 2.5D/3D packaging solutions, high-precision optical sensing solutions, automotive-grade packaging technology, innovative glass substrate technology, and iterative development of existing technologies [9] Market Expansion Plans - Xinde Semiconductor plans to strategically expand into overseas markets, targeting regions such as Taiwan, South Korea, Japan, Southeast Asia, the United States, and Germany to establish a solid business foundation [10] - The upcoming listing on the Hong Kong Stock Exchange is expected to attract more attention to Xinde Semiconductor, presenting both opportunities and challenges for the company [10]