| 800+ | 200+ | 50.000m² 30+ | | --- | --- | --- | | 企业参展 | 科研院所 | 主题论坛 展览面积 | | 2026.06.10 -> 06.12 | | 上海新国际博览中心 ( N1-N5 ) 馆 | 主题 ： 中国未来产业崛起引领全球新材料创新 2026先进半导体产业大会 中国未来产业崛起引领全球新材料创新发展 2026年6月10-12日 上海新国际博览中心 01 大会信息 在人工智能、新能源汽车、高性能计算、具身智能与航空航天等新兴产业驱动下，全球半导体产业正加速 迈入后摩尔时代。随着制程微缩逐步逼近物理与成本极限，产业发展路径由单一制程节点竞争，转向以材 料创新、器件架构、先进封装与异质集成为核心的系统级协同创新。 FINE 2026先进半导体产业大会 聚焦后摩尔时代关键技术与产业趋势， 围绕第三代与第四代半导体、先 进封装与可靠性、晶圆键合与三维集成、超精密加工及先进热管理等方向 ，汇聚产业链上下游力量，推动 技术成果加速工程化与产业化落地，构建协同发展的先进半导体产业生态。 同期举办的 " FINE2026 先进半导体展 " ， 展区将 聚焦 ...

作者简介 王阳元, 北京大学集成电路学院，北京 100871 卜伟海, 北方集成电路技术创新中心（北京）有限公司，北京 100176 于燮康, 国家集成电路封测产业链技术创新战略联盟，无锡 320214 王润声, 北京大学集成电路学院，北京 100871 王永文, 北京大学软件与微电子学院，北京 102600 刘伟平, 北京华大九天科技股份有限公司，北京 100102 杨德仁, 浙江大学材料科学与工程学院，杭州 310058 严晓浪, 浙江大学材料科学与工程学院，杭州 310058 陈南翔, 长江存储科技控股有限责任公司，武汉 430078 张兴, 北京大学集成电路学院，北京 100871 赵晋荣, 北方华创微电子装备有限公司，北京 100176 康劲, 北方集成电路技术创新中心（北京）有限公司，北京 100176 魏少军， 清华大学集成电路学院，北京 100084 作者简介: 王阳元，教授，中国科学院院士，研究方向为微纳电子学的新器件、新工艺技术和新结构电路，电子信 箱：yywang@pku.edu.cn 摘要 本文立足世界经济50年长波周期演进规律，聚焦第5个长波周期核心引擎——集成电路产业，系统 梳理了 ...

内容概况：在"后摩尔时代"，原子层沉积（ALD）技术凭借其独特的原子级精度和优异的三维保形性， 正从辅助工艺跃升为制造先进芯片三维结构的关键核心技术。2024年，中国ALD设备行业市场规模约 为45.22亿元，同比增长7.23%。一方面，集成电路制造正持续向更先进的节点突破，制造工艺步骤成倍 增加，直接拉动了对ALD设备的核心需求。另一方面，"超越摩尔"战略下的广阔应用正成为新的增长引 擎。高效太阳能电池（TOPCon）的产业化、OLED柔性显示的精密薄膜封装、锂电池固态电解质涂层 等新能源及新材料领域，正为ALD技术开辟远超传统半导体领域的巨大增量市场。 相关上市企业：微导纳米（688147）、拓荆科技（688072）、北方华创（002371）、中微公司 （688012） 相关企业：江苏南大光电材料股份有限公司、江苏雅克科技股份有限公司、华友钴业股份有限公司、赣 锋锂业股份有限公司、营口风光新材料股份有限公司、盈德气体集团有限公司、深圳市恒运昌真空技术 股份有限公司、中芯国际集成电路制造有限公司、隆基绿能科技股份有限公司、宁德时代新能源科技股 份有限公司、京东方科技集团股份有限公司、歌尔股份有限公司、迈瑞医 ...

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 （请添加小编微信，后续会组建 相关行业微信群 ） （欢迎 一级市场投资朋友 加入） 正文 全球科技和产业竞争格局加速重塑，前瞻预判前沿技术和颠覆性技术，谋划布局新兴产业和未来产业发 展成为打造国家竞争新优势的关键。 新材料是高新技术产业发展的基石和先导，新材料的突破将加速新兴和未来产业变革！中国未来产业崛 起引领全球新材料创新发展！ 新一代信息技术、新能源、重大工程与高端装备、生命健康等是中国实现科技强国、制造强国的战略必 争领域 ，也是对新材料有重大需求的重点领域。支撑和满足以上重点领域应用需求，也是未来 10 年中 国新材料发展的重点任务。 一、人工智能发展和数字中国建设对高性能计算与存储、高速及大容量网络通信和智能化人机交互系统 提出更高要求，亟待发展一批新型信息材料 （ 1 ）先进计算与存储关键材料 随着人工智能、超算、云等计算场景的快速发展，未来将会出现百万级的数据中心。传统硅基材料及与 其相配合的周边材料性能，无论在 AI 计算方面还是电能功率方面都接近极限。 异质异构集成 将不同 材料体系、器件结 ...

Core Insights - The demand for computing power driven by generative AI is pushing the limits of chip packaging, leading to a shift from traditional organic substrates to glass substrates, which offer superior flatness, thermal stability, and insulation properties [1] - 2026 is identified as a critical year for the transition of glass substrates from small-scale validation to mass production [1] Industry Dynamics - Intel is advancing its glass substrate commercialization plans and showcased a large glass chip substrate prototype at a recent exhibition in Japan, targeting mass production post-2026 [2] - Samsung is actively pursuing glass substrate development, announcing a joint venture and a commercialization roadmap, while also investing in building a glass substrate ecosystem [2] - Companies from Japan and mainland China, such as BOE and Lens Technology, are making significant progress in glass substrate technology, with predictions of over 10% annual growth in semiconductor glass wafer shipments from 2025 to 2030 [2] Technical Challenges - The main hurdle for the commercialization of glass substrates, particularly for advanced semiconductor packaging, lies in the TGV (Through Glass Via) process, which requires creating micro-sized vias in thin glass and perfect metallization [3] - The current process heavily relies on hydrofluoric acid, posing safety and environmental compliance challenges, prompting experts to explore alternatives like high-temperature alkaline solutions [3] Competitive Advantages - Chinese companies, exemplified by Woge Optoelectronics, are leveraging their extensive experience in chemical management to overcome challenges associated with TGV processing, significantly reducing initial investment and operational costs [6][7] - Woge Optoelectronics has developed a comprehensive management system for handling hazardous chemicals, allowing for a smoother transition to TGV production lines [6] Future Prospects - Woge Optoelectronics is leading the development of GCP (Glass Circuit Board) technology, which is becoming a crucial component in the global electronic information supply chain [7] - The commercialization wave of glass substrates is gaining momentum, with Chinese firms poised to leverage their unique advantages in core processes to compete in the high-end semiconductor packaging materials market [8]

Investment Rating - The report maintains an "Outperform" rating for the industry [3] Core Insights - The release of the Claude Opus 4.5 model by Anthropic marks a significant turning point for AI agents, leading to a substantial increase in CPU demand as the model transitions from a "super intern" to a "senior architect" [4][12] - The report anticipates a surge in CPU demand driven by the proliferation of AI agents, with server CPU configurations evolving from 1:32 to 1:4, and even reaching 1:2 in advanced products [4][60] - The CPU market is expected to experience a price increase due to rising demand, precious metal material costs, and limited advanced process capacity, with a 10% price increase already observed as of February 2026 [4][66][69] - The report highlights the competitive landscape of the global CPU market, projecting Intel to hold approximately 55% and AMD around 40% of the server CPU market share by 2026 [4][72] Summary by Sections 01 Phenomenon of AI Agents - The report discusses the emergence of AI agents as a transformative event in the industry, emphasizing their capabilities in autonomous task execution and workflow automation [5][12] 02 Evolution of Opus 4.5 Model - Opus 4.5 introduces significant advancements in coding capabilities, enabling end-to-end autonomous software engineering and improving the model's performance in complex tasks [27][29] - The model's pricing strategy enhances cost-performance balance, allowing for efficient resource utilization and market competitiveness [28][29] 03 Explosion of CPU Demand Under AI Agents - The report outlines how AI agents necessitate a shift in CPU roles from auxiliary units to central execution hubs, significantly increasing CPU load due to complex task execution and high concurrency requirements [60][61] - The anticipated growth in server CPU configurations reflects the evolving demands of AI agents, with projections indicating a shift towards higher core counts and improved energy efficiency [60][64] Market Dynamics - The report analyzes the competitive dynamics between x86 and ARM architectures, noting the dominance of x86 in the server market while highlighting ARM's advantages in energy efficiency and specific ecosystems [80] - Future trends suggest a gradual market shift towards ARM ecosystems, particularly with the rise of companies like Nvidia and Apple [80]

Group 1 - Ningbo Jintian Copper (Group) Co., Ltd. announced an investment by Jiaxing Jintian Huari Supermaterial Fund in Suzhou Xinjing Semiconductor Technology Co., Ltd., marking the fund's first investment since its establishment [1] - Carbon nanotube wafers are considered a next-generation semiconductor material in the post-Moore era, with the potential to develop into a trillion-dollar industry, addressing the limitations of silicon-based chips [1] - Carbon nanotube wafers exhibit ultra-high carrier mobility, low power consumption, and three-dimensional integration potential, supporting high-frequency operations and meeting the demands of 6G and AI computing [1] Group 2 - Jiaxing Jintian Huari Supermaterial Fund was established by Huari Investment in collaboration with Tongxiang Guotou and Jintian Co., aiming to cultivate core technology enterprises and promote the development of the domestic supermaterial industry [2] - The fund also seeks to assist in the implementation of local industrial planning and innovative capital layout [2]

Core Insights - TSMC has raised its 2026 capital expenditure to $52-56 billion, with 10-20% allocated to advanced packaging, indicating a high growth cycle driven by AI chip demand [1] - The advanced packaging market is expected to grow at a CAGR of 8.9% from 2019 to 2029, increasing its share from 45.6% to 50.9%, surpassing traditional packaging [1] Industry Trends - Technological advancements focus on enhancing electrical performance, integration, thermal management, and cost reduction, with key enabling technologies including Bump, RDL, Wafer-level packaging, and TSV [3] - Current trends include 2.5D/3D packaging and Chiplet technology, which offer significant advantages in yield improvement, cost reduction, and compatibility across multiple processes [3] Market Dynamics - Advanced packaging addresses multiple bottlenecks in the post-Moore's Law era, such as alleviating the "memory wall" with 2.5D/3D integration of high bandwidth memory, breaking the "area wall" through multi-chip stacking, and optimizing power consumption and heat dissipation to tackle the "power wall" [5] - The global packaging revenue is dominated by Taiwan (43.7%), the USA (21%), and mainland China (20.2%), with mainland China's advanced packaging share at approximately 15.5% [7] Growth Projections - The advanced packaging market in mainland China is projected to grow from 51.4 billion yuan in 2024 to 100.6 billion yuan in 2029, with a CAGR of 14.4% [7] - The global advanced packaging market is expected to reach approximately $45 billion in 2024, accounting for 55% of the packaging market, and is projected to grow to $80 billion by 2030, with a CAGR of 9.4% from 2024 to 2030 [7] Company Developments - Changdian Technology has launched the XDFOI® chip integration process and has begun mass production [8] - Tongfu Microelectronics plans to expand production through a private placement, with a 55.7% increase in net profit for the first three quarters of 2025 [8] - Huada Semiconductor has acquired Huayi Microelectronics to expand its power device packaging and has established a subsidiary to enhance 2.5D/3D advanced packaging [8] - Yongxi Electronics is leveraging the FH-BSAP platform to meet diverse advanced packaging needs, with expected revenue of 4.2-4.6 billion yuan in 2025 [8]

Core Viewpoint - Advanced packaging is emerging as a new engine for computing power in the "post-Moore's Law" era, addressing the limitations of traditional chip performance improvements through innovative bonding technologies [4][5]. Group 1: Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [8][19]. - The development of hybrid bonding has evolved through various stages, from wire bonding to flip chip, and now to hybrid bonding, which enables ultra-fine pitch stacking and packaging [10][11]. - Hybrid bonding can be categorized into wafer-to-wafer (W2W) and chip-to-wafer (C2W) processes, with C2W offering higher flexibility and lower defect rates for smaller chips [14][16]. Group 2: Advantages and Challenges of Hybrid Bonding - The technology allows for extreme interconnect density and performance breakthroughs, achieving interconnect pitches below 1 μm, significantly enhancing data transfer bandwidth [23]. - Hybrid bonding is compatible with existing wafer-level manufacturing processes and can be integrated with TSV and micro-bump technologies, providing cost optimization potential [24]. - Challenges include yield issues, surface smoothness requirements, cleanliness standards, and complex testing processes that need to be addressed for successful mass production [26]. Group 3: Market Demand and Future Prospects - Major HBM manufacturers, including Samsung, Micron, and SK Hynix, have committed to adopting hybrid bonding technology for HBM5, which aims to meet the extreme demands of AI and high-performance computing [28]. - TSMC's SolC technology, which utilizes hybrid bonding, is expected to double its production by 2026, highlighting the growing adoption of this technology [29][30]. - The global market for hybrid bonding equipment is projected to exceed $600 million by 2030, with significant growth anticipated in the Asia-Pacific region [37]. Group 4: Competitive Landscape - The hybrid bonding equipment market is dominated by international players such as BESI, EV Group, and SUSS MicroTec, with BESI holding a market share of 67% in 2023 [44]. - The competitive landscape is evolving, with Chinese companies like Piotech entering the market, indicating advancements in domestic semiconductor equipment capabilities [42].

Investment Rating - The report suggests a positive investment outlook for the hybrid bonding technology, highlighting its critical role in the AI era and advanced packaging market [7]. Core Insights - Hybrid bonding is identified as a key enabling technology for overcoming performance bottlenecks in the post-Moore era, driven by explosive demand in AI and high-performance computing (HPC) [7]. - The market for hybrid bonding equipment is expected to experience significant growth, with demand projected to increase several times by 2030, particularly in high-performance computing and memory applications [5][44]. - The report emphasizes the competitive landscape, noting that while overseas companies like BESI dominate the market, domestic players in China are making significant strides [5][57]. Summary by Sections Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [14][28]. - The technology enables interconnect distances below 10μm, significantly enhancing data transmission bandwidth compared to traditional methods [29]. Market Demand and Growth - The demand for hybrid bonding technology is transitioning from an advanced option to a core infrastructure in the AI era, with major manufacturers like TSMC and Samsung adopting it for next-generation products [5][33]. - The global hybrid bonding equipment market is projected to exceed $600 million by 2030, with the Chinese market expected to surpass $400 million [48]. Key Players and Competitive Landscape - BESI holds a dominant position in the hybrid bonding equipment market, with a market share of approximately 67% in 2023, and is expected to maintain around 70% in 2024 [57]. - Domestic companies such as Tuojing Technology and Baiao Chemical are rapidly advancing, with Tuojing Technology launching its first mass-production hybrid bonding equipment [5][57]. Applications and Future Trends - Hybrid bonding is primarily applied in 3D NAND and is expanding into high-performance computing scenarios, including HBM4 and HBM5 technologies [25][44]. - The report indicates that the technology is becoming essential for various applications, including AI chips and advanced memory solutions, with significant investments being made in new packaging facilities globally [43][44].