点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 引言 当芯片制程的微缩逼近物理与经济的双重极限，集成电路产业的发展动能，正前所未有地从晶体管尺度 的缩小，转向系统级集成与架构的创新。在这一被称为"后摩尔时代"的产业变局中， 先进封装与测试 （简称"先进封测"） 已从配套辅助环节，跃升为提升芯片性能、优化系统功耗、控制整体成本的关键 支点。 本文旨在深入剖析全球及中国先进封测行业的 发展现状、技术脉络、市场格局与驱动因素 ，并前瞻性 地展望在人工智能、高性能计算等需求的强劲牵引下，该领域所孕育的 未来机遇与发展趋势 。 一、集成电路先进封测概况 1、集成电路制造概况 集成电路制造产业链主要包括芯片设计、晶圆制造、封装测试三个环节，具体如下： 封装测试包含封装和测试两个环节 ，其中，封装是指将集成电路与引脚相连接以达到连接电信号的目 的，并使用塑料、金属、陶瓷、玻璃等材料制作外壳保护集成电路免受外部环境的损伤； 测试包括进入封装前的晶圆测试（CP）和封装完成后的成品测试（FT），晶圆测试主要检验每个晶粒 的电性能，成品测试主要检验产品的电性能和功能，目的是将有 ...

Core Viewpoint - The semiconductor market is experiencing robust growth driven by emerging technologies such as AI, 5G, IoT, and automotive electronics, leading to a strong demand for high-performance, low-power chips [1] Industry Overview - The global semiconductor packaging and testing market is projected to grow from 649.4 billion RMB in 2024 to 933 billion RMB by 2029, with a compound annual growth rate (CAGR) of 7.5% [1] - The trend of vertical specialization is deepening within the industry, with more companies adopting a fabless model to focus on complex chip design while outsourcing manufacturing and testing [1] Company Profile - Jiangsu Xinde Semiconductor Technology Co., Ltd. (Xinde Semiconductor) was established in September 2020 and has accumulated significant experience in packaging technology, covering advanced packaging capabilities such as QFN, BGA, LGA, WLP, and 2.5D/3D [2] - Xinde Semiconductor has received recognition from several well-known clients, contributing to its revenue growth, although its profitability remains a concern as it seeks to enter the capital market [2] Financial Performance - Xinde Semiconductor's revenue has shown rapid growth, with figures of 269 million RMB in 2022, 509 million RMB in 2023, and a projected 827 million RMB in 2024, reflecting a strong upward trend [3] - For the first half of this year, the company reported revenue of 475 million RMB, a year-on-year increase of 20% [3] - The majority of Xinde Semiconductor's revenue comes from packaging products and testing services, which accounted for over 99% during the reporting period [4] Revenue Breakdown - The revenue from QFN and BGA products has consistently been the largest, with their respective shares being 31.1% and 31.8% in the first half of 2025 [4] - The company has seen an increase in revenue from LGA and WLP products, with their shares rising from 17.9% and 10.6% in 2022 to 20.1% and 17% in the first half of 2025 [4] Market Position - Xinde Semiconductor ranks seventh in the Chinese general-purpose semiconductor OSAT market, with a market share of approximately 0.6% as of 2024 [8] - The company is one of the few providers in China that has integrated all advanced packaging technologies, positioning itself for growth despite being a newer entrant in the market [3][8] Strategic Initiatives - Xinde Semiconductor plans to strategically expand into overseas markets, targeting regions such as Taiwan, South Korea, Japan, Southeast Asia, the United States, and Germany to establish a solid business foundation [10] - The company aims to enhance its competitive edge through a comprehensive R&D strategy focused on high-performance packaging solutions and innovative technologies [9]

Core Viewpoint - The semiconductor market is experiencing robust growth driven by emerging technologies such as AI, 5G, IoT, and automotive electronics, leading to a strong demand for high-performance, low-power chips [1] Industry Overview - The global semiconductor packaging and testing market is projected to grow from 649.4 billion RMB in 2024 to 933.0 billion RMB by 2029, with a compound annual growth rate (CAGR) of 7.5% [1] - The trend towards vertical specialization in the semiconductor industry is deepening, with more companies adopting a fabless model to focus on complex chip design while outsourcing manufacturing and testing [1] Company Profile - Jiangsu Xinde Semiconductor Technology Co., Ltd. (referred to as "Xinde Semiconductor") was established in September 2020 and has accumulated extensive experience in packaging technology, covering advanced packaging capabilities such as QFN, BGA, LGA, WLP, and 2.5D/3D [2] - Xinde Semiconductor has received recognition from several well-known clients, contributing to its revenue growth [2] Financial Performance - Xinde Semiconductor's revenue has shown rapid growth, with figures of 269 million RMB in 2022, 509 million RMB in 2023, and a projected 827 million RMB in 2024, reflecting a strong upward trend [3] - For the first half of this year, the company's revenue reached 475 million RMB, a year-on-year increase of 20% [3] Revenue Structure - Over 99% of Xinde Semiconductor's revenue comes from packaging products and testing services, with QFN and BGA products being the primary revenue contributors [4] - The revenue share from LGA and WLP products has been increasing, with their respective contributions rising from 17.9% and 10.6% in 2022 to 18.2% and 18.5% in 2024 [4] Market Position - Xinde Semiconductor ranks seventh in the Chinese general-purpose semiconductor OSAT market, holding a market share of approximately 0.6% as of 2024 [8] - The company is the newest player among the top eight competitors in this field, which collectively dominate over 50% of the market share [8] R&D Strategy - The company focuses on R&D as a key strategy to enhance its competitive edge, covering high-performance 2.5D/3D packaging solutions, high-precision optical sensing solutions, automotive-grade packaging technology, innovative glass substrate technology, and iterative development of existing technologies [9] Market Expansion Plans - Xinde Semiconductor plans to strategically expand into overseas markets, targeting regions such as Taiwan, South Korea, Japan, Southeast Asia, the United States, and Germany to establish a solid business foundation [10] - The upcoming listing on the Hong Kong Stock Exchange is expected to attract more attention to Xinde Semiconductor, presenting both opportunities and challenges for the company [10]

点击上方 蓝字 关注我们，看更多行业报告 并将 "材料汇" 设为"星标⭐"，第一时间收获最新推送 写在前面 一直在路上，所以停下脚步，只在于分享 分享内容包括： 新 材料/ 半导体 / 新能源/光伏/显示材料 等 正文 1.1 封测的定义、作用与工艺流程 | 图表1:半导体封装工艺流程 | | | | | | | | --- | --- | --- | --- | --- | --- | --- | | | 即段操作 | | | | 后段慢作 | | | 晶圆脂频 | 品周切宜 | 芯片贴装 | 焊接货 | 后固化、测试 | 打标 | | | 该步骤指在圆片官 | 该步骤也称划片, | 已切割下来的芯片 | 该先辈主要用于使 | 塑封和后固化工艺指在塑封后加热硬 | 电镀：待营脚成型后，在其表面涂 | | | | | | | | | 包装:根据测试结果 | | 面采用机械或化学 | 先将晶圆粘贴在蓝 | 需要非美到框架中 | 引线孔与引脚相连 | 化并去除管亮周围多余的材料,防止 | 刷防腐材料,避免管脚出现氧化、 | | | 机械方式进行财 | 膜上,再将晶圆切 | 间的焊盘上,若焊 | ，使芯片可以与外 ...

Core Insights - The summit "Qiusiyuan Semiconductor Alliance 2025 Industry Summit and 10th Anniversary Celebration" was held in Shanghai, gathering 562 attendees to discuss key topics in the semiconductor industry, including supply chain, AI-driven material innovation, and green manufacturing [1][3]. Group 1: Alliance Development and Achievements - The Qiusiyuan Semiconductor Alliance has grown from 175 individual members and 16 organizational members in 2015 to over 2,250 individual members and more than 420 organizational members by 2025, evolving into a comprehensive ecosystem platform for the semiconductor industry [3][9]. - The alliance has hosted over 50 high-quality events annually, with total participation exceeding 3,000 attendees, providing continuous technical exchanges and industry resource connections [9][10]. - The first phase of the alliance's fund invested in 9 projects, with one project achieving a 9-fold return, while the second phase is currently progressing steadily [9][10]. Group 2: Government and Industry Support - The Deputy District Mayor of Xuhui District highlighted the area's deep roots in integrated circuits, with over 1,500 AI companies and a total output scale reaching billions, aiming to accelerate the growth of the semiconductor and AI industries [5]. - The Shanghai Integrated Circuit Industry Association emphasized the alliance's role in breaking down industry and regional barriers, fostering collaboration across the entire semiconductor value chain [7]. Group 3: Future Directions and Strategic Focus - The alliance's six key development focuses for 2026 include enhancing team building, expanding membership, improving event quality, promoting the second phase of the fund, deepening external cooperation, and expanding regional liaison points [10]. - The alliance aims to adapt its governance structure to better respond to industry changes, enhancing its decision-making and management capabilities [12]. Group 4: Technological Innovations and Challenges - Wu Hanying, an academician, discussed the challenges in the integrated circuit industry, proposing a "cost reduction + virtualization" approach to address the disconnect between design and manufacturing [16][19]. - The need for innovation in materials and architectures was emphasized, particularly in the context of AI's explosive demand for computing power, which is expected to double every two months [21][22]. Group 5: Roundtable Discussions and Industry Insights - The roundtable forum highlighted the necessity for multi-dimensional collaboration in technology, materials, packaging, and algorithms to drive innovation in the semiconductor industry [37]. - Participants discussed the dual challenges in talent cultivation, emphasizing the need for interdisciplinary education that integrates semiconductor and AI knowledge [38]. Group 6: Sustainability and ESG Initiatives - The summit included discussions on ESG practices, with representatives sharing insights on sustainable water management and the latest trends in ESG disclosure standards in the semiconductor industry [49]. Conclusion - The summit showcased the Qiusiyuan Semiconductor Alliance's achievements over the past decade and emphasized the importance of innovation, collaboration, and sustainability in driving the future of the semiconductor industry [50].

Core Viewpoint - The article discusses the trends and opportunities in the integrated circuit industry, particularly focusing on advancements in semiconductor technology, AI applications, and the development of advanced packaging techniques [5][6][7][8]. Group 1: Integrated Circuit Development Trends - The conference features discussions on the development trends of integrated circuits in the post-Moore era, emphasizing the importance of innovative materials and processes [5]. - Keynote speakers include prominent figures such as Wu Hanming and Li Yanrong, who address the challenges and innovations in power semiconductor technology [5][6]. Group 2: AI and Semiconductor Technology - The integration of AI in semiconductor technology is highlighted, with presentations on AI-driven advancements in power integration and the role of AI in enhancing data center efficiency [6][7]. - Discussions include the dual relationship between AI and TGV (Through Glass Via) technology, showcasing how both fields can benefit from each other [6]. Group 3: Advanced Packaging Techniques - The article outlines various sessions dedicated to advanced packaging technologies, including the development of glass substrates and their applications in integrated circuits [8]. - Experts discuss the challenges and innovations in silicon carbide (SiC) and gallium nitride (GaN) power devices, focusing on their industrialization and application in modern electronics [7][8]. Group 4: Industry Ecosystem and Collaboration - The conference emphasizes the importance of building an ecosystem for integrated circuits, involving collaboration among academia, industry, and government [10]. - The role of alumni networks in fostering innovation and investment opportunities in the semiconductor sector is also discussed [10].

Group 1: Recent IPOs - Minglue Technology, a data intelligence application software company, successfully listed on the Hong Kong Stock Exchange, raising approximately HKD 1.018 billion with a market capitalization of HKD 31.301 billion [1] - Seres, a new energy vehicle brand, completed its IPO on the Hong Kong Stock Exchange, raising around HKD 14.283 billion and achieving a market capitalization of HKD 247.6 billion [2] - Joyson Electronics, a provider of automotive technology solutions, successfully listed on the Hong Kong Stock Exchange, raising approximately HKD 3.412 billion with a market capitalization of HKD 31.388 billion [3] - Wangshan Wangshui, a biopharmaceutical company, completed its IPO on the Hong Kong Stock Exchange, raising about HKD 0.587 billion and achieving a market capitalization of HKD 13.743 billion [4] - WeRide, an L4 autonomous driving technology company, successfully listed on the Hong Kong Stock Exchange, raising approximately HKD 2.392 billion with a market capitalization of HKD 25.049 billion [5] Group 2: Companies Filing for IPO - Xinde Semiconductor, a semiconductor packaging and testing solutions provider, filed for an IPO on the Hong Kong Stock Exchange [6] - Haiguangxin, a provider of optical interconnect products, submitted an IPO application to the Hong Kong Stock Exchange, ranking 10th globally in professional optical module providers by revenue for 2024 [8] - Dingtai Pharmaceutical, a contract research organization, filed for an IPO on the Hong Kong Stock Exchange, offering integrated solutions for pharmaceutical companies and research institutions [9] - Haote Energy, an energy management solutions provider, submitted an IPO application to the Hong Kong Stock Exchange, focusing on data center energy management [10] - Guoxia Technology, a renewable energy solutions provider, filed for an IPO on the Hong Kong Stock Exchange, specializing in energy storage systems [11] - Tiantong Vision, an L4 solution provider, submitted an IPO application to the Hong Kong Stock Exchange, offering comprehensive intelligent driving solutions [12] - Lupeng Pharmaceutical, a platform-based pharmaceutical company, filed for an IPO on the Hong Kong Stock Exchange, focusing on high bioavailability oral drugs [13][14] - Libang Pharmaceutical, a biopharmaceutical company specializing in kidney disease, submitted an IPO application to the Hong Kong Stock Exchange [15] - FSTech, a provider of electric drive solutions, filed for an IPO on the Hong Kong Stock Exchange, ranking second in China's industrial control sector by revenue for 2024 [16] - Ketao Co., a smart parking space operator, refiled for an IPO on the Hong Kong Stock Exchange after a previous application expired [17] - Zhihui Interconnect, an AI company, submitted an IPO application to the Hong Kong Stock Exchange, focusing on urban traffic management solutions [18] - Taotao Vehicle, an electric mobility company, filed for an IPO on the Hong Kong Stock Exchange, ranking second globally in the electric low-speed vehicle industry by revenue for 2024 [19] - Nanhua Futures, a financial services provider, refiled for an IPO on the Hong Kong Stock Exchange after a previous application expired [20] Group 3: Companies Passing Hearings - Haiwei Electronics, a capacitor film manufacturer, passed the listing hearing on the Hong Kong Stock Exchange, ranking second in China by capacitor film sales volume for 2024 [21] Group 4: Companies Approved for Filing - Xidi Zhijia received approval for overseas issuance and "full circulation" of unlisted shares from the China Securities Regulatory Commission [22]

Core Viewpoint - The company, Qizhong Technology (688352), has demonstrated strong growth in its main business of integrated circuit packaging and testing, with a notable increase in revenue and a focus on technological innovation and customer relationships [10]. Group 1: Customer Structure - The company's current OLED customer base includes notable clients such as Ruiding, Yunyin Valley, Jichuang North, Lianying, Shengxianwei, Xinying, Yisiwei, and Yuchuang [2]. Group 2: Competitive Advantages - The company possesses outstanding technological research and innovation capabilities, having developed proprietary technologies in the field of display driver chip packaging, including high-reliability manufacturing techniques for fine-pitch gold bumps and core component design technologies [4]. - The company has a strong advantage in technical transformation and software/hardware development, with a specialized team of over 20 professionals dedicated to smart manufacturing and equipment modification [5]. - The management team is experienced and stable, primarily composed of internally trained personnel with over 15 years of experience in the advanced packaging and testing industry, which supports the company's leading position in the market [5]. Group 3: Pricing Trends and Order Visibility - The company aims to maintain stable pricing as a priority, with future adjustments based on market supply and demand conditions [7]. - Currently, customers typically provide a demand forecast of about three months [8]. Group 4: Financial Performance - For the first three quarters of 2025, the company reported a main revenue of 1.605 billion yuan, an increase of 11.8% year-on-year, while the net profit attributable to shareholders decreased by 19.2% to 185 million yuan [10]. - The gross profit margin for the company stands at 28.6% [10]. Group 5: Market Ratings and Predictions - In the last 90 days, four institutions have rated the stock, with three buy ratings and one hold rating [11]. - Detailed profit forecasts from various institutions indicate expected net profits of 336 million yuan for 2025, 400 million yuan for 2026, and 510 million yuan for 2027 [12].

Core Viewpoint - Jiangsu Xinde Semiconductor Technology Co., Ltd. has submitted its listing application to the Hong Kong Stock Exchange, with Huatai International as the sole sponsor [1]. Company Overview - Xinde Semiconductor is a provider of semiconductor packaging and testing solutions, focusing on developing packaging designs, customized packaging products, and testing services [3]. - The company is one of the first in China to possess advanced packaging technology capabilities, which are crucial for enhancing chip performance and efficiency in the post-Moore's Law era [3][4]. Technology and Innovation - The company has established a comprehensive technology platform covering all branches of advanced packaging technology, enabling continuous research and development of cutting-edge technologies [3][4]. - As of October 22, 2025, the company holds 211 patents in China, including 32 invention patents and 179 utility model patents, which strengthen its competitive advantage [4][5]. Business Model - Operating under the OSAT (Outsourced Semiconductor Assembly and Test) model allows the company to focus resources on packaging design, production, and testing services, while clients concentrate on semiconductor chip design and wafer manufacturing [5]. - This model supports advanced packaging research and professional facilities, enabling clients to access cutting-edge technology without extensive internal development [5]. Financial Performance - The company reported revenues of approximately RMB 269 million, RMB 509 million, RMB 827 million, and RMB 475 million for the years 2022, 2023, 2024, and the first half of 2025, respectively [6]. - The net losses for the same periods were approximately RMB 360 million, RMB 359 million, RMB 377 million, and RMB 219 million [6].

Core Viewpoint - Jiangsu Xinde Semiconductor Technology Co., Ltd. has submitted its listing application to the Hong Kong Stock Exchange, with Huatai International as the sole sponsor [1] Company Overview - Xinde Semiconductor is a provider of semiconductor packaging and testing solutions, focusing on developing packaging designs, custom packaging products, and testing services [3] - The company is one of the first in China to possess advanced packaging technology capabilities, which are crucial for enhancing chip performance and efficiency in the post-Moore's Law era [3][4] - Since its establishment in September 2020, the company has accumulated extensive experience in advanced packaging and has mass production capabilities covering various technologies such as QFN, BGA, LGA, WLP, and 2.5D/3D [3] Technology and Innovation - The company has invested in continuous technological innovation, holding a significant intellectual property portfolio with 211 patents in China, including 32 invention patents and 179 utility model patents [4][5] - The OSAT (Outsourced Semiconductor Assembly and Test) model allows the company to focus resources on packaging design, production, and testing services, providing flexibility to adapt to market changes [5] Financial Performance - The company reported revenues of approximately RMB 269.4 million, RMB 509.1 million, RMB 827.4 million, and RMB 475 million for the six months ending June 30 in 2022, 2023, 2024, and 2025, respectively [6] - The company incurred losses of approximately RMB 360.3 million, RMB 358.9 million, RMB 376.6 million, and RMB 218.6 million for the same periods [6]