智通财经7月3日电，深南电路(002916.SZ)发布投资者关系活动记录表，公司近期各项业务经营正常， 综合产能利用率仍处于相对高位，其中PCB业务因目前算力及汽车电子市场需求延续，近期工厂产能利 用率保持高位运行；封装基板业务因近期存储领域需求相对改善，工厂产能利用率较2024年第四季度、 2025年第一季度均有所提升。公司FC-BGA封装基板现已具备20层及以下产品批量生产能力，最小线宽 线距能力达9/12μm。各阶产品相关送样认证工作有序进行。20层以上产品的技术研发及打样工作按期 推进中。 深南电路：PCB工厂产能利用率保持高位运行 ...

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 核心观点 日 交 先进封装:尖端先进封装需求持续增长,Al相关仍为主要驱动 CCH 20 20 1 堆叠互联:FC/WLP/2.5D/3D四大方案助力封装技术迭代结构升维 2备:传统工艺升级&先进技术促前道设备增量 手标的 【 ◎ 提示 ◆ FC/WLP/2.5D/3D四大方案助力封装技术迭代结构升维。（1）FC:信号路径优化、散热性能提升、I/O引脚密度增加 Yole数据,2024Q2 FCBGA营收为23亿美元,环比增长6.8%,同比增长18%。由于人工智能需求的增长以及更多采用 FCBGA的2.5D/3D封装,预计未来几个季度市场将保持健康增长;FCCSP未来两年收入将有所增长,主要原因是存储需求修 正及Al相关需求维持高位。（2）WLP:先在整片晶圆上同时对众多芯片进行封装、测试，最后切割成单个器件，并直接贴装 到基板或PCB上，生产成本大幅降低。根据Yole数据，2029年WLCSP预计规模为24亿美元;FO（含IC基板）预计规模为43 亿美元。（3）多芯片互联:①2.5D:利用CoWoS封装技 ...

Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a CAGR of 20.9% over the next five years, becoming a key driver for market expansion [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is expected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is rapidly increasing due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets and the ongoing application of advanced packaging technology are expected to sustain healthy growth in the coming years [15]. - AI applications are driving long-term growth in semiconductor revenues, with the AI-related semiconductor market projected to grow at a CAGR of 28.9% from 2024 to 2033 [27]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei Company are recommended for investment due to their breakthroughs in niche areas of the domestic equipment market [5]. - Major packaging projects are underway or planned, with total investments amounting to approximately $100 billion [29].

行情速递 ① 主板领涨， 海能达(+10.03%)/元隆雅图(+10.02%)/吉大正元(+10.02%)/旭光电子(+5.32%)/ 巨人网络(+3.90%)/ ②创业板领涨， 正元智慧(+20.03%)/澄天伟业(+20.00%)/博创科技(+7.02%)/ ③科创板领涨， 金橙子(+20.01%)/中科飞测 (+6.23%)/慧辰股份(+5.60%)/ ④活跃子行业， SW军工电子Ⅲ(+1.74%)/SW半导体设备(+1.63%)/ 国内新闻 ① 艾邦半导体网，近期搭载芯聚能自主碳化硅主驱芯片的模块规模生产/标 志着公司在车规级功率半导体领域完成"芯片设计-模块制造"全链条自主化/ 规模化生产/ ② 半导体地图， 奥芯半导体FC-BGA高阶封装IC基板项目正式开业并完成 首批产品交付/整线配备全球领先的高端设备/年产能达3600万颗封装基板/ 年产值超20亿元/满产后有望突破30亿元/ ③ 半导纵横，晶通科技首批2.5D/3D高阶封装设备正式入驻厂区/此次入驻 的设备包含日本Tazmo的激光解键合设备/东台镭射钻孔机等共计11台/这些 设备将在未来2至3周内分批次进厂/逐步投入生产运营/这些高阶设备集成 ...

Summary of Halozyme Therapeutics (HALO) FY Conference Call Company Overview - Halozyme Therapeutics is a leader in rapid large volume subcutaneous drug delivery, utilizing two main platforms: enhanced hyaluronidase enzyme and auto injector business [2][6] Key Value Drivers - The company has seen strong revenue growth driven by products such as: - **DARZALEX**: A $12 billion brand, with 95% of sales from the subcutaneous version, projected to grow to $17.5 billion by 2028 [26] - **FESGO**: Achieved over $700 million in Q1, growing at 50% year-over-year, with a strong market share in China [27] - **Vyvogart Hytulo**: Approved for two neurological indications, showing dramatic uptake [28] Product Launches and Growth Catalysts - Four new products launched recently, including: - **Ocrevus subcutaneous** - **Tecentriq subcutaneous** - **Opdivo subcutaneous** - **Amivantamab subcutaneous** - These products are expected to contribute to growth in 2026 and beyond as reimbursement and coverage are established [29] Clinical Benefits and CMS Guidance - The CMS draft guidance focuses on fixed combination drugs and the clinical differences they provide. Halozyme's enhanced hyaluronidase enzyme is recognized as an active ingredient [9][15] - Clinical studies show significant reductions in infusion-related reactions, with rates dropping from 66% for IV to 13% for subcutaneous [12][37] - The company aims to demonstrate clinically meaningful benefits to align with CMS expectations [14][20] Financial Projections - Projected royalty revenue growth of 31% to 37%, amounting to $750 to $785 million [25] - Continued investment in enhancing existing assets and exploring new drug delivery platforms [67][70] Litigation and Patent Issues - Ongoing litigation with Merck regarding NDA suite patents, with a trial set for March 2, 2026 [50][52] - The MDACE patent portfolio is separate from ENHANZE patents, with no implications for ENHANZE from the MDACE litigation [63] Capital Allocation Strategy - Focus on three pillars: maximizing enhanced assets, share repurchases, and exploring new drug delivery platforms [67][69] - $1.55 billion in share repurchases since February 2019, with an ongoing $250 million repurchase [68] Conclusion - Halozyme is experiencing significant growth with multiple catalysts in place, a strong product pipeline, and a commitment to enhancing its drug delivery platforms. The company is well-positioned for continued success in the biopharmaceutical market [75]

6月5日晚，大为股份（002213）发布公告称，公司全资子公司桂阳大为矿业有限公司（以下简称"桂阳 大为矿业"）近日收到湖南省自然资源厅的复函，确认《湖南省桂阳县大冲里矿区长石矿勘探报告》矿 产资源储量顺利通过评审备案。这一里程碑事件为大为股份在新能源产业的发展注入了一剂"强心针"， 引发了资本市场与行业的广泛关注。 2024年年报显示，公司郴州锂电新能源产业项目累计投入14,900 余万元（包括竞买探矿权投入、购买碳 酸锂项目土地投入等）。据了解，大冲里矿区位于湖南省郴州市桂阳县，该区域地质条件优越，矿产资 源丰富。2023年11月，桂阳大为矿业竞得"桂阳县大冲里矿区高岭土矿普查"探矿权，并于2024年2月取 得湖南省自然资源厅颁发的探矿权许可证。经勘查，截至2024年10月底，矿区长石矿矿石量20,953.3万 吨，伴生氧化锂矿物量32.37万吨（平均品位0.154%），钨、锡等战略金属储量亦达到中、大型规模。 大冲里矿区不仅拥有超大型长石矿及丰富的锂、钨、锡伴生矿资源，矿体连续稳定，且杂质含量低，适 合露天开采。公司拟采用"磁选+浮选"为主、"重选"为辅的联合选矿工艺，在粗磨条件下回收锂矿，同 时注重选 ...

新华财经昆明5月26日电（记者张新新、卫韦华、王小璐）面对全球高端制造竞争与产业链重构压力， 中国锡产业正加速推进"资源提效—技术突破—生态重构"的战略跃迁。作为全球最大的锡生产国与消费 国，中国锡行业以技术创新为核心引擎，以数智化转型与全链整合为支撑，推动产业从"规模扩 张"向"价值增值"的深度变革。 锡材需求预期改善原料扰动因素加剧 锡，素有"绿色环保金属"之称，广泛应用于半导体芯片、军工国防、5G以及电子产业等领域，也是新 能源、AI等新兴领域不可或缺的关键材料。 半导体行业协会（SIA）数据显示，2024年全球半导体销售额达到6276亿美元，较2023年的5268亿美元 增长19.1%。作为锡消费占比65%的主力领域，半导体封装用锡焊料需求增加，预计2025年全球增速将 达5%至7%。 中粮期货研究院研究员徐婉秋表示，锡下游消费整体韧性仍存，预计今年全年全球精炼锡消费增速约为 0.5%。半导体行业仍处于上升周期；光伏领域表现持续清淡，但上半年光伏"531"新政带来的抢装潮或 有支撑。 在需求量不断增加的同时，锡的供给端却面临多重挑战。记者梳理发现，今年以来，锡矿端供应扰动因 素加剧。其中，2月，缅甸佤 ...

Core Viewpoint - The company has achieved mass production capability for FC-BGA packaging substrates with 20 layers and below, featuring a minimum line width and spacing of 9/12μm [1] Group 1 - The company specializes in FC-BGA packaging substrates [1] - The current production capability includes products with 20 layers or fewer [1] - The minimum line width and spacing achieved is 9/12μm [1]

Group 1: Company Operations and Capacity Utilization - The company's overall business operations are normal, with a comprehensive capacity utilization rate remaining relatively high. The PCB business benefits from sustained demand in computing power and automotive electronics, maintaining high capacity utilization [1] - The packaging substrate business has seen improved demand in the storage sector, with capacity utilization increasing compared to Q4 2024 and Q1 2025 [1] Group 2: Product Development and Project Progress - The company has achieved mass production capability for packaging substrates with up to 20 layers, and the technical development for products with over 20 layers is progressing as scheduled [1] - The Guangzhou packaging substrate project has entered its first phase, with production capacity steadily increasing and batch orders for BT and some FC-BGA products being accepted, although it is still in the early stages of capacity ramp-up [1][2] Group 3: Client Base and Market Position - The packaging substrate business serves a diverse client base, including IDM (Integrated Device Manufacturers), Fabless (semiconductor design companies), and OSAT (Outsourced Semiconductor Assembly and Test) manufacturers [3] Group 4: Expansion Plans and Technological Capabilities - The PCB business is expanding with factories located in Shenzhen, Wuxi, Nantong, and a new facility under construction in Thailand. The company is upgrading existing PCB factories to enhance capacity and is progressing with the Nantong Phase IV project to establish an HDI technology platform [4] - The company’s PCB business utilizes HDI technology, which allows for high-density wiring, primarily applied in communication, data centers, industrial control medical, and automotive electronics sectors [5] Group 5: Investment and Market Strategy - The total investment for the Thailand factory is 1.274 billion RMB, with construction progressing on schedule. The factory will have capabilities in high-layer and HDI PCB technologies, aiding in expanding overseas market reach [6] Group 6: Raw Material Price Trends - Key raw materials include copper-clad laminates, prepregs, copper foil, gold salts, and inks. In Q1 2025, prices for some raw materials, such as gold salts, increased year-on-year and compared to Q4 2024 due to commodity price fluctuations [7] Group 7: Compliance and Disclosure - The company adhered to the "Information Disclosure Management System" during the research process, ensuring no significant undisclosed information leaks occurred [8]

1 证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 编号：2025-20 Q5、请介绍原材料价格变化情况及对公司的影响。 Q3、请介绍公司 PCB 业务近年来扩产规划。 公司 PCB 业务在深圳、无锡、南通及泰国（工厂在建）均设有工厂。一方面，公司通过 对现有成熟 PCB 工厂进行技术改造和升级，打开瓶颈，提升产能；另一方面，公司有序推 进南通四期项目建设，构建 HDI 工艺技术平台和产能，目前正在推进项目基础工程建设。公 司将结合自身经营规划与市场需求情况，合理配置业务产能。 Q4、请介绍公司泰国工厂投资规模及业务定位。 公司在泰国工厂总投资额为 12.74 亿元人民币/等值外币。目前基础工程建设按期有序推 进中，具体投产时间将根据后续建设进度、市场情况等因素确定。泰国工厂将具备高多层、 HDI 等 PCB 工艺技术能力，其建设有利于公司进一步开拓海外市场，满足国际客户需求， 完善产品在全球市场的供应能力。 投资者关系 活动类别 √特定对象调研 □分析师会议 □现场参观 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □其他 （ ） 活动参与人 员（排名不 分先后） ...