突破纯国产2.5D/3D先进封测技术空白 华天科技斥资20亿元"加仓"南京 □ 南京日报/紫金山新闻记者 肖凡 通讯员 吴晓倩 杨长松 近日，国内半导体封测领域龙头企业华天科技发布消息，整合旗下三大核心板块——华天科技（江苏） 有限公司、华天科技（昆山）电子有限公司、华天先进壹号（南京）股权投资合伙企业（有限合伙）， 斥资20亿元在浦口经济开发区组建南京华天先进封装有限公司（以下简称"华天先进"）。这是连续7 年"重仓"南京的华天科技再度落下的关键一子。 多点开花，封测技术更智能更高效 在先进封测领域，华天科技早有布局。几天前，记者走进位于浦口经济开发区的盘古半导体先进封测项 目现场，一栋白色建筑映入眼帘，一批装载着最新生产设备的运输车辆正缓缓驶入厂房。该项目一期已 竣工，目前进入小批量的产品试制阶段。 "盘古，意为开天辟地，对于华天来说是一种更迭。"该项目相关负责人介绍，盘古项目对于传统封装是 一种"降维打击"，是用更高的自动化程度和更低的成本，去进行传统封装的技术革命。 盘古项目是华天科技对国产化先进封测更高领域的探索，其生产设备的国产化率也特别高，将研发高利 用率的玻璃基板，提升芯片在二次布局时的利用率 ...

Core Insights - The project in Huai'an's Qingjiangpu District focuses on high-end semiconductor chip packaging and testing, with significant construction progress and an expected operational date by the end of 2025 [3][5]. Project Overview - The first phase of the project involves an investment of 1 billion yuan, covering an area of approximately 31 acres, and includes the construction of a modern intelligent factory and a 310 square meter Class A warehouse [3][5]. - The project aims to establish 15 semiconductor chip packaging lines and an accelerated life testing line, with plans to create a national-level integrated circuit product laboratory [3][5]. Production Capacity and Economic Impact - Once fully operational, the project is expected to achieve an annual packaging capacity of over 900 million semiconductor chips and generate annual sales of 1 billion yuan, creating 600 new jobs [3][5]. Industry Context - The semiconductor packaging and testing project aligns with national strategic emerging industries and is categorized as an encouraged sector under the revised industrial structure adjustment guidance [5]. - The project utilizes 28nm technology, which meets over 90% of domestic demand, offering high performance and cost-effectiveness [5]. Competitive Landscape - The domestic semiconductor packaging market is competitive, but there remains a gap in advanced packaging technologies compared to international standards, with traditional packaging types still dominating the market [6]. - The project focuses on high-reliability packaging products such as DFN, LGA, and BGA, which are in high demand across various sectors including robotics, AI servers, and automotive [7]. Government Support - The local government has provided robust support for the project, facilitating a streamlined process for company registration, project filing, and financing, which has bolstered investor confidence [7].