Core Viewpoint - The company has strategically positioned itself in key areas such as display semiconductors, optical communication semiconductors, MEMS sensors, CIS sensors, and power devices, indicating a focus on advanced technology sectors [1] Group 1: Company Product Offerings - The main products include Mini LED/Micro LED chip sorting machines, AOI inspection equipment, precision placement devices for optical communication chips, die bonding machines, wafer chip sorting machines, CIS-FT testing machines, multi-chip die bonding machines, wafer transfer systems (EFEM), and Mini LED direct display backlight die bonding machines [1]