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中仑新材:产品目前没有直接应用在半导体芯片领域
Ge Long Hui· 2025-09-24 08:14
Core Viewpoint - The company, Zhonglun New Materials (301565.SZ), is not currently applying its products in the semiconductor chip sector, focusing instead on new packaging materials for various industries [1] Product Overview - The main products include: - New energy BOPA films - Functional BOPA films - Bio-based biodegradable BOPLA films These materials are primarily used for packaging lithium batteries, consumer goods (food, daily chemicals), and medical supplies [1] Upcoming Production - The company is set to launch new energy BOPP films in the fourth quarter, which will be used for film capacitor base films and composite current collector base films [1] Research and Development Focus - The company is deepening its expertise in the PA6 field and is actively exploring high-temperature nylon materials, specifically PA6T and PA10T, to meet the stringent requirements of future applications in humanoid robots, automotive engine components, and electronic devices [1]
中仑新材(301565.SZ):产品目前没有直接应用在半导体芯片领域
Ge Long Hui· 2025-09-24 08:06
Core Viewpoint - The company, Zhonglun New Materials (301565.SZ), is not currently applying its products in the semiconductor chip sector, focusing instead on new packaging materials for various industries [1] Product Overview - The main products include new energy BOPA films, functional BOPA films, and bio-based biodegradable BOPLA films, which are used for packaging in lithium batteries, consumer goods (food, daily chemicals), and pharmaceuticals [1] - The company is set to launch new energy BOPP films in the fourth quarter, primarily for use in film capacitor base films and composite current collector base films [1] Research and Development Focus - The company is deepening its expertise in the PA6 field and is actively exploring high-temperature nylon materials, specifically PA6T and PA10T, to meet the stringent requirements of future applications in humanoid robots, automotive engine components, and electronic devices [1]
中仑新材:公司产品目前没有直接应用在半导体芯片领域
Xin Lang Cai Jing· 2025-09-24 08:05
中仑新材9月24日在互动平台表示,公司的产品目前没有直接应用在半导体芯片领域。公司的主要产品 新能源BOPA膜材、功能性BOPA膜材、生物基可降解BOPLA膜材等,属于封装软包装锂电池、终端消 费品(食品、日化)、医药用品的新型包装材料;公司即将于四季度投产的新能源BOPP膜材,主要用 于薄膜电容器基膜和复合集流体基膜;公司在PA6领域深耕的基础上,通过对聚合工艺的持续优化与配 方体系的创新突破,正积极开拓高温尼龙领域,重点开展PA6T、PA10T等高温尼龙的研发工作,以满 足未来人形机器人、汽车引擎部件、电子电器等领域对耐高温、高负载材料的严苛要求。 ...