Core Viewpoint - The company is implementing a differentiated and high-end development strategy focused on electroplating and photolithography, with significant progress in product testing and upcoming mass production, which is expected to drive continuous growth in performance [1][3]. Electroplating - The company has established a competitive product matrix for electroplating solutions, achieving full category coverage in traditional and advanced packaging fields, and has made breakthroughs in high-end markets [1]. - In the advanced packaging sector, multiple products for electroplating solutions and additives have entered mass production, widely used in Bumping and RDL processes [1]. - The high-purity copper electroplating solution has achieved stable supply to Huada Technology and Tongfu Microelectronics, while the tin-silver electroplating additive has passed stringent certification from Changdian Technology and received small batch orders [1]. - The copper electroplating additive for advanced packaging is currently undergoing batch stability verification, and the 28nm Damascus copper interconnect process copper plating additive is in the final stages of product certification [1]. - The ultra-high purity cobalt-based solution and additives for 5-14nm advanced processes are progressing well in client testing, and the cleaning solution for copper processes in wafer manufacturing has entered the mass production scaling phase [1]. Photolithography - The advanced packaging negative photoresist has covered multiple mainstream packaging factories, with market penetration continuously increasing, and the company plans to enrich product models for full category coverage [2]. - The self-developed positive PSPI photoresist has successfully obtained the first domestic order from a mainstream wafer factory, breaking the long-standing technology monopoly of the US and Japan, and is expected to gradually achieve mass shipments by 2025 [2]. - The company is also developing negative PSPI and high-sensitivity chemical amplification PSPI, with plans to continue advancing product certification in advanced packaging and wafer manufacturers by 2025 [2]. - The wafer ICA chemical amplification photoresist is undergoing successful client validation testing, with some indicators outperforming international benchmark products [2]. - The OLED high-sensitivity photoresist is in client testing for OLED backplane array photolithography processes, and the company has reached a consensus with BOE on future cooperation and strategic planning [2]. - The high-thickness KrF photoresist is currently in the laboratory research phase, aiming to fill domestic gaps [2]. Market Expansion - The company has acquired INOFINE to expand into the Southeast Asian market, further solidifying its leading position in wet electronic chemicals [3]. - INOFINE, established in 2009, is one of the early entrants in the semiconductor wet electronic chemicals business in Malaysia and holds a certain influence in the local market [3]. - From 2025, INOFINE will be included in the company's consolidated financial statements [3]. Financial Projections - The company expects revenues of 600 million, 727 million, and 913 million yuan for the years 2025, 2026, and 2027, respectively, with net profits attributable to the parent company projected at 50 million, 71 million, and 103 million yuan for the same years [3].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自semiengineering，谢谢。 在 EUV 光刻技术中，尤其是高数值孔径 EUV，平衡分辨率、灵敏度和线宽粗糙度之间的权衡变 得越来越困难。 使用极端紫外线曝光的光刻图案化依赖于抗蚀剂掩模，该掩模可以同时满足小特征分辨率、对 EUV 波长的高灵敏度以及可接受的线宽粗糙度的目标。不幸的是，光掩模和图案化晶圆之间的最 后一步也是最不可预测和最不为人所知的。 模拟可以准确预测给定的照明和光掩模组合将产生的区域图像。然而，一旦该区域图像遇到光刻 胶，情况就会变得更加复杂。光刻胶是许多不同成分的混合物，它们以不同的方式与 EUV 光子相 互作用。任何给定掩模特征的可打印性取决于其附近的光刻胶成分和 EUV 光子的分布。 化学放大光刻胶 评估光刻工艺的三个关键参数——分辨率、线宽粗糙度和灵敏度——定义了光刻师所谓的 RLS 三 角。在化学放大光刻胶 (CAR) 中，改善其中一个参数通常以牺牲其他两个参数为代价。在这些光 刻胶中，入射光子会产生光酸，进而使光刻胶聚合物脱保护。这使其可溶于显影剂。光刻胶聚合物 的尺寸和光酸扩散距离决定了光刻胶的最终分辨率。 同 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自semiengineering，谢谢。 工艺稳定性需要不断警惕和微调。就 EUV 而言，它还需要在发电、设备和耗材方面进行大量投 资。如今，这些成本仍然是广泛采用的障碍。但该行业并没有停滞不前。正在进行密集的研究和开 发工作，目标是从新型光刻胶材料和更强大的光源到先进的掩模写入器和复杂的 AI 驱动工艺控制 等各个方面。 "晶圆厂的生产力取决于多种因素——产量、工艺效率和准确的图案转移，"Irresistible Materials 首席执行官 Dinesh Bettadapur 表示。"减少曝光剂量、提高光刻胶灵敏度和减少缺陷都是让 EUV 更具成本效益的关键因素。" AI 需求曲线转为垂直 对先进节点半导体的不断增长的需求正在重塑行业。AI 工作负载、高带宽内存 (HBM) 以及下一 代移动和计算设备都在推动向更精细工艺节点的转变。每次迭代都需要使用 EUV 的更复杂的制造 技术，而高 NA EUV 正在成为 1.8nm 及以下大规模生产的唯一可行途径。 人工智能芯片的需求正在呈指数级增长，但成本和复杂性限制了这项技术只能由少数几家公司掌 握。这种情 ...