Core Viewpoint - The semiconductor industry is undergoing significant transformation, with advanced packaging technology becoming a key driver for continuous breakthroughs. Material innovation is essential for technological upgrades and achieving self-sufficiency in high-end manufacturing [2]. Group 1: Event Overview - The "New Materials Create Future" 2025 New Materials Entrepreneurs Conference will feature a forum on semiconductor and advanced packaging materials, bringing together leaders from academia, industry, and investment to discuss critical topics such as core packaging materials, breakthroughs in lithography processes, and advancements in detection technology [2]. Group 2: Key Topics and Speakers - The forum will address the opportunities and challenges in domestic semiconductor packaging materials, focusing on the need for self-innovation and industrialization [4]. - A key presentation will analyze the critical technologies behind high-resolution photoresist resins, highlighting advancements in this area [7]. - Discussions will include trends and challenges in chip and chip sensor materials, led by a prominent figure in the field with extensive research and publication credentials [11][13]. - The development trends and key materials in advanced packaging technology will be explored, emphasizing the importance of these materials in the semiconductor industry [15]. - The application and development trends of organic silicon materials for advanced semiconductor packaging will be presented, showcasing their significance in the market [18]. - The latest industry advancements in semiconductor detection will be discussed, providing insights into current progress and future directions [22]. - An exploration of the application of silver-coated copper powder as a substitute for pure silver powder in the industry will be conducted, addressing material innovation [25]. - The forum will also cover semiconductor lithography processes, with insights from an expert with extensive experience in advanced process platforms [27].