Core Viewpoint - Company emphasizes the importance of dicing saws and grinders in the packaging process of storage chips, logic chips, and computing chips, highlighting its role in the semiconductor packaging equipment market [1] Group 1: Company Overview - Company specializes in high-precision equipment and consumables for semiconductor dicing and grinding, primarily used in the backend packaging and testing of various chips [1] - Main applications include wafer cutting, package body cutting, and wafer thinning processes [1] Group 2: Market and Clientele - Key customers are OSAT (Outsourced Semiconductor Assembly and Test) and IDM (Integrated Device Manufacturer) companies [1]