证券研究报告 | 公司点评 | 塑料 ❑ 8 月 19 日，公司发布 2025 年中报：2025H1，公司实现营业收入 53.51 亿元，同 比+15.67%；实现归母净利润 5.01 亿元，同比+51.19%；加权平均净资产收益率 为 5.01%，同比增加 1.61 个百分点。销售毛利率 24.82%，同比增长 1.66 个百分 点；销售净利率 9.75%，同比增加 2.44 个百分点。 圣泉集团(605589) 报告日期：2025 年 08 月 25 日 其中，2025Q2 实现营收 28.92 亿元，同比+16.13%，环比+17.62%；实现归母净 利润 2.94 亿元，同比+51.71%，环比+42.34%；平均净资产收益率为 2.95%，同 比增加 1.05 个百分点，环比增加 0.89 个百分点。销售毛利率 25.40%，同比增加 2.00 个百分点，环比增加 1.27 个百分点；销售净利率 10.55%，同比增加 2.62 个 百分点，环比增加 1.76 个百分点。 点评 ❑ PPO 等放量叠加传统树脂迭代升级，公司 25H1 业绩同比大幅提升 2025H1，公司实现营业收入 53.51 亿元 ...

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Core Viewpoint - Sharp has announced an asset transfer agreement with Aoi Electronics, selling its second factory and part of the land at its Mie base, while also assisting Aoi in introducing semiconductor packaging production lines. This move is part of Sharp's strategy to shift towards a brand-centric business structure and reduce its asset-heavy operations [2][4]. Financial Performance - Sharp's financial performance has been declining, with a nearly 9% year-on-year revenue drop in FY2023, amounting to 2.321 trillion yen (approximately 107.4 billion RMB), and a net loss of 149.98 billion yen (approximately 6.9 billion RMB). The decline is primarily attributed to asset write-downs in its panel business, particularly due to the shrinking market for small to medium-sized panels [2][3]. Historical Context - Sharp was a pioneer in the LCD display field, starting research in the 1970s and establishing a complete panel production system by the 1990s. At its peak, Sharp held nearly 30% of the global LCD panel market share, earning the title "Father of LCD" [2]. - However, after 2008, Sharp failed to adapt to industry trends and lost market share, dropping from approximately 28% in 2009 to below 20% in 2012, and further to 12% by 2015. The acquisition by Foxconn in 2016 was seen as a potential turnaround, but differences in technology and market strategy hindered effective integration [3]. Strategic Moves - Sharp has initiated a series of asset optimization actions, including the closure of its 10th generation line in Sakai, which could not meet the demands of the flexible display era, and the sale of TV factories in Poland and Mexico. These actions have improved cash flow and are expected to lead to profitability in FY2024 [3][4]. - The collaboration with Aoi Electronics indicates a new direction for Sharp, leveraging its precision manufacturing expertise to participate in the growing semiconductor packaging market. Analysts suggest that if Sharp can establish a stable partnership, it may expand into related services such as equipment maintenance and technical consulting, creating a new revenue stream [4]. Market Environment - The LCD panel market has become increasingly oligopolistic, with leading companies leveraging economies of scale to reduce costs. Sharp's heavy asset structure puts it at a disadvantage in cost control, making the sale of idle factories a necessary step to alleviate financial pressure and improve its balance sheet for future transformation [4].

Core Viewpoint - The article highlights the return of entrepreneur Cheng Shengpeng to his hometown of Tianmen, where he established Hubei Zhongsi Micro Optoelectronics Co., Ltd., focusing on semiconductor packaging, particularly in the MiniLED sector, leveraging his extensive experience and technological expertise gained over the years [3][4]. Company Development - Cheng Shengpeng, born in Tianmen, transitioned from a government job to entrepreneurship, founding Zhongshan Liti Optoelectronics Technology Co., Ltd. in 2013, which became one of the first companies in China to achieve large-scale production of Chip Scale Package (CSP) [3][5]. - After the acquisition of his previous company by a listed firm in 2019, he founded Guangdong Zhongsi Micro Optoelectronics in 2021, achieving significant technological advancements in the MiniLED field [3][4]. Investment and Production Capacity - In 2023, the company invested 5 billion yuan to establish a new facility in Tianmen, aiming to create a world-class semiconductor packaging base [3][5]. - The first production line was operational within 90 days, showcasing the efficiency of local government support and infrastructure readiness [5][6]. - The facility is projected to have a monthly production capacity of 200 million CSP chips and 2 million meters of MiniLED flexible light strips by the end of 2024, with an annual production capacity of 50 billion chips and a projected output value of 1 billion yuan [6]. Industry Context - The semiconductor packaging sector is identified as a critical component of the "light-chip-screen-end-network" industrial cluster being developed in Hubei, with Tianmen positioned strategically within the Wuhan "one-hour economic circle" [4][5]. - The local electronic industry foundation and complete supply chain are highlighted as significant advantages for the company's operations [5].

Core Viewpoint - Shengquan Group is expected to achieve a net profit of 491 million to 513 million yuan in the first half of 2025, representing a year-on-year growth of 48.19% to 54.83% due to the rapid development of global AI computing power, high-frequency communication, and sectors like new energy vehicles and energy storage [1][2] Group 1: Financial Performance - The company anticipates a significant increase in net profit for the first half of 2025, driven by advancements in electronic materials and battery materials [1] - The production lines for 1000 tons/year PPO resin and 1000 tons/year porous carbon are gradually reaching full capacity, contributing to sales growth [1] Group 2: Business Development - Shengquan Group's synthetic resin industry is expanding its market share, leading to steady sales growth [1] - The Daqing production base's "1 million tons/year biomass refining integration (Phase I project)" is operating smoothly, with increasing capacity utilization, positively impacting overall performance [1][2] Group 3: Industry Position - Shengquan Group is a leading domestic synthetic resin enterprise, with the largest production and sales scale of phenolic resin and furan resin in China and among the top globally [1] - The company has a strong presence in the casting auxiliary materials sector, with a furan resin production capacity of 120,000 tons, ranking first in the world [1] Group 4: Future Growth Potential - The biomass industry expansion project is expected to become a new profit growth point for the company [2] - The demand for high-energy-density batteries in the battery sector is anticipated to drive rapid growth in advanced electronic materials and battery materials [2] - Shengquan Group is actively pursuing overseas business opportunities, with the Thailand alloy project set to be completed and put into production this year [2]

Core Viewpoint - The article highlights the recent IPO progress of several semiconductor companies in China, indicating a growing trend in the semiconductor industry and potential investment opportunities. Group 1: IPO Progress of Semiconductor Companies - Multiple semiconductor companies, including equipment manufacturers and material suppliers, have announced their IPO advancements, such as Zhongke Instrument, Chengdu Super Pure, and Xinshi Technology [1] - Zhongke Instrument has completed its IPO counseling report and plans to list on the Beijing Stock Exchange after previously attempting to list on the Shanghai Stock Exchange [2] - Chengdu Super Pure has initiated its IPO counseling with Huatai United Securities, focusing on semiconductor etching devices and high-power laser devices [5][6] - Xinshi Technology's IPO application has been accepted by the Shanghai Stock Exchange, aiming to raise 785 million yuan for two major projects [8][12] Group 2: Company Profiles and Market Position - Zhongke Instrument specializes in dry vacuum pumps and vacuum instruments, essential for semiconductor manufacturing processes [3] - Chengdu Super Pure is recognized for its advanced surface treatment processes and high-purity materials, contributing to the semiconductor etching device market [5] - Xinshi Technology is a leading domestic manufacturer of semiconductor-grade perfluoroether rubber seals, breaking the monopoly of foreign companies in this sector [9][11] Group 3: Financial Performance and Projections - Xinshi Technology projects revenues of 130.47 million yuan and 207.55 million yuan for 2023 and 2024, respectively, with a net profit of 32.81 million yuan and 63.09 million yuan [12] - Zhongke Instrument's IPO journey reflects its strategic adjustments and readiness for the capital market, indicating strong governance and compliance [2] Group 4: Industry Trends and Competitive Landscape - The semiconductor industry in China is witnessing a shift towards domestic production capabilities, with companies like Xinshi Technology achieving significant market share and technological advancements [11][24] - The competitive landscape is evolving, with domestic firms increasingly challenging foreign dominance in critical components and technologies [11][19]

Market Performance - The main board saw significant gains with stocks like Dongxin He Ping (+10.03%), Sanwei Communication (+10.02%), and Hengsheng Electronics (+10.02%) leading the charge [1] - The ChiNext board also performed well, highlighted by Tianyang Technology (+20.00%) and Langxin Group (+19.99%) [1] - The Sci-Tech Innovation board was led by Jinchengzi (+19.99%) and Qingyun Technology-U (+11.50%) [1] - Active sub-industries included SW Film and Animation Production (+7.41%) and SW Printed Circuit Board (+3.85%) [1] Domestic News - Aibang VR industry news reported that Lianhui Technology showcased the Homer AI-assisted glasses at the Shanghai Old Expo, designed for the elderly, integrating AI technology for enhanced safety and convenience [1] - South Korean media reported that TSMC and Samsung Electronics are set to produce the industry's most advanced 2nm chips in the second half of the year, with a competitive order acquisition battle expected, although Samsung's yield rates are lower than TSMC's [1] - Taiwan's economic department updated the list of strategic high-tech goods export entities, adding 601 entities involved in "weapons proliferation," including major Chinese tech firms like Huawei and SMIC [1] - Semiconductor investment alliance Huamei Titanium completed nearly 100 million yuan in Pre-A round financing, developing key liquid crystal phased array technology that reduces manufacturing difficulty and costs by 90% [1] Company Announcements - Meishi Technology announced a cash dividend of 6 yuan per 10 shares, totaling 60 million yuan, based on a total share capital of 100 million shares [3] - Jiulian Technology is progressing with a major asset restructuring, with due diligence and audits ongoing, but no formal share transfer agreements signed yet [3] - Jiangbolong's subsidiary signed a memorandum of cooperation with Sandisk to develop customized UFS solutions for mobile and IoT markets [3] - Beijing Junzheng announced a dividend of 0.997988 yuan per 10 shares, maintaining a total payout of 48.157 million yuan despite an increase in share capital [3] Overseas News - Samsung Electronics is developing a new glass substrate for advanced semiconductor packaging, aiming to reduce manufacturing costs and enhance performance [4] - Crusoe plans to establish a data center in the U.S. to house AMD's AI chips for client use in building AI models [4] - AMD unveiled its latest Instinct MI350 series GPU at the 2025 Global AI Development Conference, achieving a fourfold increase in AI computing power and a 35-fold leap in inference performance [4] - Despite economic pressures, OLED display panel trading remains positive, with a projected 132% year-on-year growth in 2024, leading to an upward revision of OLED panel shipment forecasts from 2.8 million to 3.4 million units [4]

Core Insights - The company, Chuangzhi Xinlian, established in November 2006, is a global leader in the wet process plating materials industry and a prominent player in the metallization interconnection field within the electronic packaging sector in China. It was recognized as a national-level specialized and innovative "little giant" enterprise in 2024 [2][44]. Group 1: Market Position and Financial Performance - Chuangzhi Xinlian is the largest domestic provider of wet process plating materials in China, as well as the largest one-stop plating solution provider by revenue in 2024 [6][44]. - The company reported cumulative revenues exceeding 1 billion RMB and a net profit of approximately 100 million RMB over three years [10]. - Revenue for the years 2022, 2023, and 2024 was 320 million RMB, 312 million RMB, and 410 million RMB, respectively, with net profits of 27 million RMB, 19 million RMB, and 53 million RMB [13][18]. Group 2: Revenue Breakdown and Growth - In 2024, revenue from PCB industry plating materials accounted for 61.9%, while semiconductor industry plating materials contributed 18.3%, and plating services made up 19.8% of total revenue [18][19]. - The company has experienced a compound annual growth rate (CAGR) of 53.8% in its semiconductor business from fiscal year 2022 to 2024 [4]. Group 3: Product Offerings and Applications - Chuangzhi Xinlian has developed a comprehensive product matrix for chemical and electroplating materials, covering applications in wafer-level packaging, chip-level packaging, and PCB manufacturing [25][27]. - The company's plating materials are used in various applications, including automotive power chips, CIS chips, RF chips, power management chips, and MEMS, serving sectors such as HPC, electric vehicles, rail transportation, AI, communication electronics, and high-end consumer electronics [8][9]. Group 4: Client Relationships and Market Penetration - The company has established long-term partnerships with leading PCB manufacturers and semiconductor companies, with an average cooperation duration of about 10 years [32]. - By the end of 2024, Chuangzhi Xinlian's chemical nickel/gold and chemical nickel/palladium materials were successfully applied in over 120 production lines in the PCB industry, leading the domestic market in coverage [32]. Group 5: Leadership and Ownership Structure - The company is controlled by a group of shareholders led by Yao Cheng and Yao Yu, with Yao Cheng serving as the chairman and Yao Yu as the executive director and R&D director [39][41]. - Yao Cheng holds a 52.39% stake in the company, while other significant shareholders include Zhiyuanxin and Zhiyuanxin Material [41]. Group 6: Industry Trends and Future Outlook - The demand for wet process plating materials in China is expected to grow, driven by the rapid expansion of sectors such as AI, electric vehicles, and data centers [44]. - The domestic supply of raw materials in the semiconductor sector has increased from approximately 10% to over 15% by 2024, indicating a trend towards localization in the supply chain [44].

Market Performance - The main board led the gains with notable increases in stocks such as Yuyin Co. (+10.08%), Chaoxun Communication (+7.09%), and Yongding Co. (+7.03%) [1] - The ChiNext board saw significant growth with New Guodu (+16.30%) and Xiechuang Data (+11.81%) leading the charge [1] - The Sci-Tech Innovation board was also up, with Dekeli (+7.58%) and Qingyue Technology (+7.19%) showing strong performance [1] - Active sub-industries included SW Communication Network Equipment and Devices (+1.94%) and SW Communication Terminals and Accessories (+1.20%) [1] Domestic News - Aibang Semiconductor Network announced a total investment of 1.2 billion, with Hanjin Technology's silicon carbide packaging project reaching completion, capable of producing 300,000 silicon carbide power modules and 50 million silicon carbide power devices annually [1] - TSMC reported a surge in demand for CoWoS chip manufacturing materials, leading to shortages in the memory market, with Mitsubishi Gas Chemical announcing delays in shipments of materials for BT substrates [1] - Changfei Advanced's Wuhan base achieved mass production, with the first 6-inch silicon carbide wafer successfully produced, expected to reach an annual production capacity of 360,000 silicon carbide chips [1] - Anhui Huaxin Micro-Nano Integrated Circuit Co. announced the successful production of the first batch of products from its 8-inch wafer production line, which will have a monthly production capacity of 30,000 wafers [1] Company Announcements - Huajin Technology announced a 2024 annual equity distribution plan, distributing 9 yuan for every 10 shares [3] - Jingyan Technology also announced a 2024 annual equity distribution plan, distributing 1.10 yuan in cash dividends for every 10 shares [3] - Airong Software reported receiving a government subsidy of 7.201 million yuan, accounting for 10.85% of the company's audited net profit for the last fiscal year [3] - Yingfang Micro disclosed a pre-announcement of share reduction by a major shareholder, planning to reduce up to 1% of shares through centralized bidding [3] Overseas News - IBM and Deca Technologies formed a significant alliance in the semiconductor packaging sector, allowing IBM to enter the advanced fan-out wafer-level packaging market [2] - Rohm launched its first high-voltage GaN driver IC, which enhances the stability of GaN devices during high-frequency and high-speed switching [2] - In April, iPhone exports from India to the U.S. increased by 76% year-on-year, while exports from China decreased by 76%, reflecting Apple's accelerated manufacturing plans in India [2] - Samsung is reportedly exiting the MLC NAND flash memory market, notifying customers that orders will only be accepted until June, prompting a search for new suppliers [2]

Group 1: Business Growth and Innovation - The company is focusing on semiconductor packaging materials, specifically lead frames and copper pin heat sink substrates, to enhance material performance and reduce packaging costs, targeting applications in power devices and third-generation semiconductors [1][2][15]. - The development of modular and customized liquid cooling solutions is underway, aimed at AI servers and high-density data centers, currently in the R&D verification stage [1][2][6]. - The company is expanding its smart security business, with ongoing R&D and testing for products like smart security checks and protective barriers [1][2][15]. Group 2: Financial Performance - In 2024, the company reported a revenue of 360.19 million CNY, a decrease of 8.65% year-on-year, while net profit attributable to shareholders increased by 29.77% to 11.57 million CNY [3][5][11]. - Revenue from lead frame products surged by 467.80% in 2024, with a further increase of 236.78% in Q1 2025 [2][4][11]. - The smart card business, a core revenue source, saw a decline of 12.62% in revenue, while semiconductor product revenue dropped by 91.99% [3][4][11]. Group 3: Market Trends and Risks - The lead frame market is experiencing robust growth, driven by demand in electric vehicle control systems and high-performance power modules [2][3][4]. - The company acknowledges risks in new product development, including technical, market, and application validation risks, urging investors to make informed decisions [2][6][15]. - The shift towards high-end specifications in lead frames is evident, with increasing customer demands for high thermal conductivity and low thermal resistance [2][3][4]. Group 4: Strategic Planning and Future Directions - The company aims to diversify its revenue streams by investing in semiconductor packaging materials, digital and energy thermal management, and innovative applications for super SIM cards [1][2][15][20]. - Future growth points are identified in the semiconductor packaging sector, with a focus on self-designed and mass-produced products covering various power module needs [1][2][15]. - The company plans to maintain a balance between traditional smart card business and emerging sectors, ensuring stable growth while fostering new business opportunities [1][15][20].