证券研究报告/投资策略 机构调研策略周报（2026.02.23-2026.02.27） 投资要点 ➢ 机构调研热门行业情况 本周（2026/2/23-2026/2/27），一级行业中，按机构被调研总次数从高到低排 序，电子、机械设备、汽车、轻工制造的关注度较高，其中电子、轻工制造的近 5 天调研机构家数较多。对比春节前一周的调研情况，本周电子行业关注度提升， 此外轻工制造调研机构家数增多，行业可能受益于出口复苏或内需政策预期。 近 30 天（2026/1/28-2026/2/27），一级行业中，按机构被调研总次数从高到 低排序，机械设备、电子、医药生物、基础化工的关注度较高，其中电子、机械 设备的近一个月调研机构家数较多。 ➢ 机构调研热门公司情况 本周机构调研情况，按照近 5 天机构调研次数排名，调研次数较多且机构评级 家数大于 10 家的公司为杰瑞股份、锡业股份、京东方 A；按照近 5 天机构调研 家数排名，调研机构家数较多且机构评级家数大于 10 的公司为杰瑞股份、锡业 股份、京东方 A 等。 近 30 天机构调研情况，按照近 30 天机构调研次数排名，调研次数较多且机构 评级家数大于 10 的公司为大 ...

Core Insights - The significant rise in tin prices is driven by tightening supply, surging demand, low inventory, and capital inflow [3][7] - Tin prices increased to 431,640 CNY/ton on February 27, up 14.06% from 378,420 CNY/ton before the holiday [5][7] Supply Factors - The resumption of production in Myanmar's Wa region is below expectations, with China relying on Myanmar for about 70% of its tin concentrate imports [3][7] - Indonesia, the world's second-largest tin exporter, is experiencing stricter export quota controls and slower approval processes, limiting overseas supply growth [3][7] - Global tin mine production is projected to decline by 8.3% year-on-year by January 2026, with China's tin concentrate imports decreasing by 15% month-on-month [3][7] Demand Factors - Market expectations are improving, with single AI servers consuming 3-5 times more tin than traditional models, and electric vehicles using three times more tin than conventional fuel vehicles [3][7] - The demand for tin is further supported by essential needs in electronic soldering and semiconductor packaging, leading to proactive inventory building and traders holding back sales, which pushes prices higher [3][7] Market Dynamics - Tin is being recognized as a critical strategic metal, attracting speculative and investment capital, which strengthens tin futures prices [3][7] - Changes in commodity prices directly impact the profitability of related listed companies, with commodity price increases typically leading stock prices by 5, 10, 20, or 30 days [3][7] Investment Strategy - The company offers a value cycle stock selection tool that utilizes commodity price increases over a specified number of days to identify hot products and investment opportunities in value cycle stocks [4][8] - The selection method includes using seasonal price increases to discover buying signals for value cycle stocks ahead of quarterly and annual reports [5][9]

来源：源达 投资要点 机构调研热门行业情况 本周（2026/2/23-2026/2/27），一级行业中，按机构被调研总次数从高到低排序，电子、机械设备、汽 车、轻工制造的关注度较高，其中电子、轻工制造的近5天调研机构家数较多。对比春节前一周的调研 情况，本周电子行业关注度提升，此外轻工制造调研机构家数增多，行业可能受益于出口复苏或内需政 策预期。 近30天（2026/1/28-2026/2/27），一级行业中，按机构被调研总次数从高到低排序，机械设备、电子、 医药生物、基础化工的关注度较高，其中电子、机械设备的近一个月调研机构家数较多。 机构调研热门公司情况 本周机构调研情况，按照近5天机构调研次数排名，调研次数较多且机构评级家数大于10家的公司为杰 瑞股份、锡业股份、京东方A；按照近5天机构调研家数排名，调研机构家数较多且机构评级家数大于 10的公司为杰瑞股份、锡业股份、京东方A等。 近30天机构调研情况，按照近30天机构调研次数排名，调研次数较多且机构评级家数大于10的公司为大 族激光、杰瑞股份、杭州银行等；按照近30天机构调研家数排名，调研机构家数较多且机构评级家数大 于10的公司为九号公司-WD、晶科 ...

Group 1 - The core point of the article is that Shiyida's subsidiary, Shenzhen Shiyida Intelligent Technology Co., Ltd., has obtained a high-tech enterprise certificate, which will allow the company to enjoy a 15% corporate income tax rate for the next three years, positively impacting long-term development [1] - The company indicated that this certification will not have a significant impact on the 2025 performance forecast [1] - Investors have suggested that the company expand into semiconductor packaging equipment, automotive sensors, and AI hardware to address competitive pressures in the automotive electronics sector [1] Group 2 - In the past week, Shiyida's stock price fluctuated between a decrease of 0.42% and a volatility of 5.97% [2] - The closing price on February 11 was 9.51 yuan, a slight decrease from 9.60 yuan on February 5, with a trend of shrinking trading volume [2] - The technical analysis indicates that the stock price is in a consolidation phase, with short-term performance aligning with the electronic sector [2]

Group 1: Company Overview and Business Development - The company has transitioned from smart card business to liquid cooling technology due to technological accumulation and industry trends, starting with the investment in a specialized chip packaging project in 2018 [1] - The liquid cooling business has successfully entered the supply chain of major US semiconductor companies through partnerships in Taiwan [1][2] - The company has established a professional team with expertise in process development and customer service, supporting steady business growth [1] Group 2: Product Offerings and Production Capacity - The company provides core components for liquid cooling, including liquid cooling plates, stainless steel corrugated pipes, and connectors, with full-process manufacturing capabilities [2] - The production base for liquid cooling is located in Huizhou, with initial construction completed using self-funding, and plans for capacity expansion in 2026 [2][5] - The next generation of products focuses on microchannel technology (MLCP), aimed at enhancing heat dissipation efficiency in high heat flux scenarios [3] Group 3: Market Strategy and Customer Engagement - The company is actively expanding its domestic market presence, collaborating with leading server manufacturers and internet companies [4][5] - The liquid cooling capacity planning is based on the high growth trend of the liquid cooling industry and careful predictions of downstream customer demand [5] - Customers prefer to collaborate with the company due to its mature core processes and stable capacity, which offer efficiency and cost advantages over self-expansion [5] Group 4: Financial Outlook and Risk Management - The semiconductor packaging materials business has shown continuous growth since mass production began in 2023, with optimistic projections for 2024 and 2025 despite rising raw material costs [6] - The company is considering a new equity incentive plan to attract core technical talent, with 1,005,100 shares remaining in the repurchase account [6] - The company acknowledges potential risks in new business and product development, including technical, market, and application validation risks [6]

Core Viewpoint - The tin metal market is experiencing a significant price surge, continuing the upward trend from 2025, with prices reaching historical highs due to a combination of geopolitical conflicts, supply constraints, and long-term demand expectations [1][4]. Price Trends - On January 26, the main contract for tin futures on the Shanghai Futures Exchange rose over 10% to approximately 462,700 CNY per ton, closing at 425,300 CNY per ton, a 1.37% increase from the previous trading day and over 25% for the month [1]. - The LME three-month tin price hit a record high of about 55,400 USD (approximately 358,200 CNY) per ton on January 23, up 6.5% from the previous day [1]. Supply Constraints - The current geopolitical situation in the Democratic Republic of the Congo has escalated, increasing safety risks in major production areas, compounded by slow recovery in Myanmar and policy uncertainties in Indonesia, creating a "triple constraint" on supply [4]. - Global tin inventories are at historical lows, with LME tin stocks at 7,195 tons, a 21.23% increase month-on-month, while domestic social inventories have accumulated to 9,700 tons, up 0.18% [4]. Demand Dynamics - There is a clear distinction between short-term demand pressure and long-term growth potential, with traditional seasonal demand being subdued before the Spring Festival, while long-term growth driven by AI computing, photovoltaic new energy, and electric vehicles is expected to significantly outpace traditional sectors [3][5]. Industry Challenges - The tin industry is currently facing intensified competition between upstream and downstream sectors, with upstream players holding significant power due to resource scarcity [6][7]. - Domestic smelting enterprises are struggling with high procurement costs for imported ore, leading to historically low processing fees and overall industry losses [12]. Resource Dependency - China, despite being the largest tin resource holder and producer, has seen its reliance on imported tin ore exceed 60%, with some years approaching 70%, indicating a severe constraint on raw material supply [7][9]. - The annual production of tin ore in China has declined from 120,000 tons in 2010 to approximately 95,000 tons in 2022, while consumption has increased from 154,000 tons to 195,000 tons, widening the supply gap [11]. Future Price Outlook - Short-term factors supporting high tin prices include a weak dollar environment, supply concerns due to geopolitical tensions, and positive market sentiment [15]. - Analysts predict that while demand growth expectations exist, the anticipated impact of AI on tin consumption may be overstated, with AI-related consumption accounting for only 1%-2% of total tin consumption [15].

Group 1: Company Overview and Shareholder Actions - The actual controller and concerted actors disclosed a share reduction plan on September 10, 2025, and completed the reduction on January 6, 2026, maintaining a 51.71% shareholding post-reduction, ensuring absolute control [1] - The share reduction was primarily due to personal funding needs and is considered a normal market behavior, which may help optimize the company's equity structure in the long run [1] - The company is currently in the early stages of a specific object stock issuance plan, aimed at financing the industrialization of liquid cooling systems and expansion of semiconductor packaging materials [2] Group 2: Market Position and Competitive Landscape - The domestic liquid cooling market includes system integrators and core component manufacturers, evolving from project-based delivery to standardized products and platform capabilities [3] - The company adopts a differentiated strategy in the liquid cooling business, targeting both domestic and overseas markets, with a focus on core components for international clients and system-level solutions for domestic customers [3] - The industry has high barriers to entry, including long customer validation cycles and stringent supply chain collaboration requirements [3] Group 3: Financial Performance and Profitability - The current gross margin for the liquid cooling business is constrained by initial production scale and does not reflect the potential for profitability at scale [5] - The company anticipates that as order volumes increase, gross margins will significantly improve due to lower manufacturing costs and higher production efficiency [6] Group 4: Business Development and Future Plans - The company has transitioned from smart card business to the liquid cooling sector, leveraging its expertise in semiconductor packaging materials and establishing a professional team for development and customer service [7] - Current funding for new projects is based on careful planning to support R&D and capacity building, with initial capacity meeting early order demands [7] - The company aims to enhance its traditional smart card business while focusing R&D resources on semiconductor packaging and liquid cooling [8] Group 5: Risk Management and Market Outlook - Rising raw material prices, including copper, gold, and silver, pose cost pressures, but the company has established price linkage mechanisms with clients to mitigate these impacts [9] - The liquid cooling market is expected to grow rapidly, becoming a significant revenue source as customer mass production is introduced [10] - The company has entered the overseas supply chain through partnerships and is actively expanding its market presence [11] Group 6: Investment Appeal and Future Valuation - The current high price-to-earnings ratio reflects historical revenue from the smart card business and does not fully capture the growth potential of the liquid cooling and semiconductor packaging sectors [15] - The upcoming capital increase aims to enhance key capabilities and production capacity, improve customer onboarding efficiency, and optimize the business structure for long-term stability [16] - The company acknowledges potential risks in new product development and market validation, emphasizing the importance of rational investment and risk awareness for investors [16]

Core Viewpoint - The rapid development of computing power infrastructure has made cooling technology a critical factor in releasing AI server performance, with Chinese manufacturers accelerating their entry into the global computing supply chain through advancements in liquid cooling technology [2]. Group 1: Business Transformation - The company is transitioning its smart card business, which has been a cash flow source for over 20 years, to adapt to changing payment landscapes while also exploring new opportunities in eSIM and OTA technologies [3][4]. - The smart card business is shifting from a "scale-driven" model to a "quality-driven" approach, providing safety margins and growth points for the company [4]. Group 2: New Business Growth - The company has rapidly emerged in the semiconductor packaging and materials sector, with strong growth expected to continue into 2025 [5]. - The company's accumulated micro-manufacturing capabilities in smart card chip packaging have been successfully applied to the broader semiconductor packaging materials field, reducing learning costs and risks associated with cross-industry development [6]. Group 3: Liquid Cooling Business - The liquid cooling segment is positioned as a core focus for the company's future, driven by the exponential growth in AI computing demand, as traditional air cooling technologies approach physical limits [6]. - The company has established deep collaborations with leading domestic server and internet companies, producing core liquid cooling components and expanding its product line [6][7]. - The company anticipates explosive growth in its liquid cooling segment by 2026, potentially becoming a significant revenue source [7]. Group 4: Strategic Growth Drivers - The company expects its smart card, semiconductor packaging materials, and liquid cooling businesses to form a "three-horsepower" growth model, achieving synergistic effects [8]. - The company is also exploring external acquisitions to enhance its core competitiveness and sustainable development capabilities [8].

Core Viewpoint - Huazheng New Materials (603186) emphasizes the extensive application of its copper-clad laminate products in various sectors, including 5G communications, servers, data centers, semiconductor packaging, and automotive electronics [1] Group 1: Product Applications - The company's copper-clad laminate products are widely used in 5G communications, servers, data centers, semiconductor packaging, and automotive electronics [1] - The products cater to a diverse range of direct customers, particularly PCB manufacturers [1] Group 2: Customer Collaboration - The company has developed high-grade copper-clad laminate materials and packaging materials, collaborating with leading end customers across multiple fields [1] - The company ensures stable supply to its customers, reinforcing its position in the market [1]

Group 1 - The core viewpoint of the article highlights that Huazheng New Materials (603186) has a diverse range of applications for its copper-clad laminate products, which are utilized in sectors such as 5G communications, servers, data centers, semiconductor packaging, and automotive electronics [1] - The company’s copper-clad laminate products cater to a variety of direct customers, primarily PCB manufacturers, indicating a broad customer base within the industry [1] - The company has corresponding products that are suitable for all the application areas covered by its copper-clad laminate products, showcasing its adaptability and product alignment with market needs [1]