2026年2月1日，三佳科技（600520.SH）发布公告称，公司拟以发行股份方式募集不超过3亿元资金， 发行价格为22.52元/股，较定价基准日前20个股票交易日平均价格28.15元/股的80%。 三佳科技本次募资对象为合肥市创新科技风险投资有限公司（下称"合肥创新风投"），后者正是三佳科 技的控股股东。同时，公司本次所募资金扣除发行费用后，将全部用于补充流动资金和偿还银行借款。 换句话说，这是控股股东对于上市平台的一次输血。 截至2025年3季度末，三佳科技账面货币资金为1.04亿元，短期借款为0.67亿元，还款压力似乎不算太 大，但剔除受限部分后，公司现金及现金等价物余额仅为0.78亿元。 三佳科技属于半导体行业的封装测试产业，主营产品为半导体塑料封装模具、装置及配套类设备产品， 2002年1月登陆上交所，被誉为"中华模具第一股"。不过，2022年、2023年及2024年，公司营业收入分 别为4.44亿元、3.3亿元、3.14亿元；扣非净利润分别为0.18亿元、-0.89亿元、0.11亿元，业绩承压明 显。 2026年1月21日，公司业绩预告显示，其2025年扣非净利润预计仅为300万元至450万元，同 ...

Core Viewpoint - The company reported a significant decline in key financial metrics for the first half of 2025, with a notable drop in revenue and net profit compared to the same period in 2024, primarily due to increased credit impairment losses and market competition [2][3][4]. Financial Performance - Revenue for the first half of 2025 was approximately 151.28 million yuan, a decrease of 3% from 155.95 million yuan in the same period last year [2][3]. - Total profit for the period was about 2.12 million yuan, down 74.57% from 8.34 million yuan in the previous year [2][3]. - Net profit attributable to shareholders was approximately 1.93 million yuan, reflecting a 75.99% decline from 8.03 million yuan in the prior year [2][3]. - The net cash flow from operating activities was 13.86 million yuan, a decrease of 56.26% compared to 31.69 million yuan in the previous year [2][3]. Business Overview - The company operates in the semiconductor packaging and testing industry, focusing on plastic packaging molds and related equipment [4][5]. - The semiconductor industry is expected to continue its rapid growth due to technological advancements and market expansion [4][5]. - The company has faced intensified competition in the mid-to-low-end product segments, leading to a significant reduction in sales revenue [4][5]. Investment Activities - The company acquired a 51% stake in Anhui Zhonghe Semiconductor Technology Co., Ltd. for 121.38 million yuan, which will be consolidated into the company's financial statements starting August 2025 [12][13]. - The acquisition is expected to enhance the company's capabilities in the semiconductor sector [12][13]. Industry Trends - The semiconductor packaging industry is experiencing rapid growth, driven by advancements in technology and increasing market demand [4][5]. - The chemical building materials industry is also evolving, with a focus on energy efficiency and sustainable practices [4][5]. - The precision machinery and heavy-duty conveyor belt industry is facing challenges such as low-price competition and fluctuating demand, necessitating technological upgrades and market adjustments [4][5].