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湾芯展上“秀肌肉” 半导体产业链自主可控提速
Shang Hai Zheng Quan Bao· 2025-10-15 18:31
Core Insights - The 2025 Bay Area Semiconductor Industry Ecosystem Expo (Bay Chip Expo) officially opened on October 15, showcasing over 600 companies and covering more than 60,000 square meters, serving as a key platform to observe the development of China's semiconductor industry [1][2] Industry Developments - The Bay Chip Expo featured innovative products such as a semiconductor composite mobile robot from Huichuan Technology, which utilizes advanced technologies for high efficiency and precision in logistics within semiconductor manufacturing [2] - Jiangfeng Electronics presented an 8-inch silicon carbide (SiC) epitaxial wafer, which is more challenging to produce than the more common 6-inch wafers but offers significant cost advantages by allowing for more devices to be cut from a single wafer [2] - Huazhong Microelectronics highlighted its 12-inch wafer manufacturing capabilities, focusing on process nodes between 40nm and 90nm, catering to mature market demands [3] Self-Sufficiency in Semiconductor Industry - The Chinese semiconductor industry is progressively achieving full-chain self-sufficiency from raw materials to downstream applications, as stated by He Xiaolong, Chairman of Huazhong Microelectronics [4] - New products launched at the expo include a 90GHz ultra-high-speed oscilloscope by Wankai, which enhances domestic oscilloscope performance by 500%, breaking through previous Western technology restrictions [4][6] - Two new EDA design software products from Qiyunfang were introduced, improving performance by 30% and reducing hardware development cycles by 40%, filling a gap in high-end electronic design software in China [5][6] Market Trends and Future Outlook - Huichuan Technology reported that its industrial automation segment has achieved 90% self-sufficiency, with significant progress in MCU and logic chip production [6] - The industry is expected to leverage domestic demand and systematic R&D investments to upgrade and overcome challenges in high-end manufacturing and foundational tools [6]