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奥特斯中国朱津平:中国业务是全球战略支点
Core Viewpoint - AT&S reported a total revenue of €1.59 billion for the fiscal year 2024/2025, reflecting a 3% year-on-year growth despite price pressures and global trade uncertainties [1][2]. Financial Performance - The company's revenue increased from €1.55 billion in the previous fiscal year to €1.59 billion [1]. - EBITDA saw a significant rise of 97%, increasing from €307 million to €606 million, primarily due to the sale of the Korean factory [1]. - Adjusted EBITDA, excluding the impact of the Korean factory sale, was €408 million, up 6% from €384 million in the previous fiscal year [2]. Market Environment - The ongoing trade tensions, particularly between the U.S. and China, are viewed as the largest uncertainty affecting the market [2][5]. - Demand in the mobile devices, computers, and communication infrastructure sectors remains stable, while the automotive sector is stagnant and the industrial sector is weak [2][5]. - Price pressures in the printed circuit board (PCB) and semiconductor packaging sectors continue, although the decline in PCB prices is less severe than in the previous fiscal year [2][5]. Strategic Initiatives - The company is focusing on cost optimization and efficiency improvements to counteract market pressures and inflation [2]. - AT&S is implementing a "local for local" strategy in China to enhance market resilience and capitalize on local opportunities [6]. - The company plans to balance production capacity across its global manufacturing network, which includes facilities in China, Malaysia, Austria, and India [7]. Future Outlook - AT&S is preparing for future demand recovery by ensuring that its new factory in Malaysia is ready to start production quickly when needed [7]. - The company acknowledges the growing interest from Chinese clients in its advanced technologies, emphasizing that the Chinese market remains a core business area [7].
基板大厂,马来西亚设厂
半导体芯闻· 2025-05-07 09:49
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容来自enanyang ,谢谢 。 作 为 全 球 领 先 的 高 品 质 半 导 体 封 装 载 板 和 印 制 电 路 板 制 造 商 , 奥 特 斯 ( AT&S Austria Technologie & Systemtechnik AG ) 荣 耀 宣 布 , 位 于 马 来 西 亚 居 林 高 科 技 园 区 (Kulim Hi-Tech Park)新工厂正式投产,并已具备全面量产能力。 为积极响应马来西亚国家半导体战略,奥特斯聚焦新客户、新科技和研发项目将助力马来西亚的经 济增长。位于马来西亚首都吉隆坡以北约350公里的居林工厂,以创纪录的速度完成建设。 Ingolf Schröder表示:"我们已经为马来西亚的科技产业链做出诸多贡献。高端制造业需要大量投 资,我们很欣慰能够与本地机构建立起稳健可靠的合作关系。我们将携手共创微电子的未来。" 截至目前,奥特斯对整个居林厂区的工厂与行政大楼累计投资约50亿令吉(10亿欧元)。在 1号 厂房,奥特斯为知名半导体公司AMD生产最先进的半导体封装载板。厂房总建筑面积约为25万 5000平方米,配备约500 ...