Core Insights - The company, Kexiang Co., announced on December 2, 2025, that it is focusing on addressing the heat dissipation challenges in the AI server market [1] - Kexiang is collaborating with a major North American manufacturer to develop ceramic boards suitable for AI servers [1] Company Summary - Kexiang Co. is actively engaged in research and development to enhance AI server technology [1] - The partnership with a North American company indicates a strategic move to leverage external expertise in tackling industry-specific challenges [1] Industry Summary - The AI server market is currently facing significant technical challenges, particularly in heat management [1] - The development of specialized materials, such as ceramic boards, is crucial for the advancement of AI server capabilities [1]

Core Viewpoint - The company is currently applying for a simplified procedure to issue shares to specific targets, aiming to establish a high-end server PCB production capacity of 100,000 square meters per year at Zhi'en Electronics, which will enhance its technology accumulation in high-end servers [1] Group 1: Company Developments - The company has over 10 years of technical accumulation in the HDI field and is fully entering the AI sector, planning to upgrade production lines next year based on order conditions [1] - The company has achieved mass production of its 800G optical module products and has received medium-sized orders, while the 1.6T optical module is currently under development [1] - The company is collaborating with a major North American manufacturer to develop ceramic boards for AI servers, addressing key challenges in heat dissipation in the AI server market [1] Group 2: Subsidiary Operations - The company's subsidiary, Huayu Huayuan, is engaged in PLP panel-level chip packaging, primarily for power chip applications, with smooth research and development progress and plans to increase production capacity next year [1]