Core Insights - Vertical Semiconductor Inc. has completed a $11 million seed funding round to address power delivery bottlenecks in AI data centers [1] - The company, a spinoff from MIT's Palacios Group, focuses on developing vertical GaN transistors that outperform traditional silicon chips [1][2] Funding and Company Background - The funding round was led by Playground Global, with participation from Jimco Technology Ventures, Milemark-Capital, and Shinetsu [1] - Vertical Semiconductor aims to enhance the efficiency and performance of AI workloads in data centers by utilizing vertical GaN technology [2] Technology and Innovation - Vertical GaN transistors offer superior thermal management and can handle higher densities compared to lateral designs, improving heat dissipation and surge protection [2] - The technology allows for more transistors to be packed into a single chip, supporting higher voltages and enhancing performance [1][2] Market Need and Impact - AI data centers face power delivery challenges that hinder their ability to support advanced workloads, which Vertical aims to resolve [2] - The company's technology could potentially increase data center efficiency by up to 30% while halving power consumption [2] Development and Future Plans - Vertical has demonstrated its technology using standard CMOS manufacturing methods on eight-inch wafers, indicating compatibility with existing data centers [3] - The company plans to provide packaged device samples to early customers by the end of this year and aims to launch fully integrated solutions by the end of 2026 [3]