封装结构及芯片

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晶方半导体取得封装结构及芯片专利,提高了封装结构的可靠性
Jin Rong Jie· 2025-08-16 04:12
Company Overview - Suzhou Jingfang Semiconductor Technology Co., Ltd. was established in 2005 and is located in Suzhou, primarily engaged in the manufacturing of computers, communications, and other electronic devices [2] - The company has a registered capital of 652.171706 million RMB [2] - Suzhou Jingfang has made investments in 7 companies and participated in 13 bidding projects [2] Patent Acquisition - The company has obtained a patent titled "Packaging Structure and Chip," with the authorization announcement number CN223230341U, applied for on August 2024 [1] - The patent describes a packaging structure that includes a substrate with a first and second surface, through-holes, and multiple insulation layers designed to enhance reliability by reducing stress on the contact points between the metal layer and the pads [1] - The innovative design of the insulation layers aims to protect the first insulation layer from stress concentration, thereby improving the overall reliability of the packaging structure [1]