Group 1 - The article highlights the rapid expansion of heterogeneous integration technology driven by the increasing demand in high-performance computing, optical communication, and sensor industries, with major chip manufacturers like Sony, TSMC, Samsung, Intel, and AMD competing in this field [2] - The evolution of integration technology is outlined, progressing from 2D heterogeneous integration to 2.5D chip integration, and further to 3D stacked integration, with future developments aiming towards 3.5D system integration [2][3] - Specific bonding technologies and their advancements are discussed, including C4 bump spacing in 2D integration (150-110μm), μ bump spacing in 2.5D integration (50-25μm), and the focus on W2W hybrid bonding technology in 3D integration with bonding spacings currently at 8-2μm, moving towards 1.6μm and 1μm [3] Group 2 - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and aiming to establish Ningbo and the Yangtze River Delta as a hub for the advanced electronic information industry [4] - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic integration, wafer-level bonding, and advanced packaging techniques, inviting experts from both industry and academia for in-depth discussions [4]